Samtec.com
digikey
High-Speed Board-to-Board
High-Density Arrays
HD Mezz
HDAM
hdam-23-12.0-s-13-1

HDAM-23-12.0-S-13-1

2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal rohs logo Product Specs

HDAM-23-12.0-S-13-1

2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal rohs logo

Product Specs
More details

Please Login to see customer specific pricing. Or you may directly contact support.
You don't have an account? Create one

Pricing
Breaks 18 36 54 90 234 486
Price $55.700 $53.610 $52.300 $41.660 $38.120 $31.030

Save your preferred CAD Download type in your user profile.

2D view may not be representative of the configured product. Please see 3D preview or CAD download for actual representation.

Need help choosing your options? View Catalog Page.

Please confirm configuration with the Series Print before final design in.

For assistance with 3D Models, please contact [email protected].

For 3D Models suitable for EM Field Solvers, please contact Samtec’s Signal Integrity Group.

.
Features

  • 2.00 mm x 1.20 mm pitch

  • HD Mezz is a trademark of Molex Incorporated

  • Integrated guide posts to minimize contact damage when mating and unmating

  • Intermateable with Molex HD Mezz Arrays

  • Open pin field design

  • Performance: Up to 9 GHz / 18 Gbps

  • Solder charge termination for ease of processing

  • Up to 299 I/Os

Specs Kit

Secured form. No spam.

. .
.
.
. .
.