High-Speed

Board-to-Board & Backplane

High-Speed Interconnect Solutions


Samtec offers the largest variety of high-speed board-to-board and backplane interconnects in the industry with full engineering support, online tools and an unmatched service attitude.

High-Speed Performance


Speeds to 112 Gbps PAM4

More than 4.0 Tbps of aggregate bandwidth

Extremely low crosstalk beyond 40 GHz

Application
Flexibility


10-1,000 positions

1 mm - 40 mm stack heights

Vertical, right-angle, edge mount

Signal Integrity Support


Free test reports, models, app notes, Break Out Region

Easy access to live EE support

Channelyzer® online tool

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High-Speed Performance


High speeds & increased bandwidth with optimized signal integrity.

16 gbps NRZ
25 gbps NRZ
24 gbps and 56 gbps
56 gbps and 112 gbps
112 gbps NRZ and 224 gbps PAM4

Speeds for now
and for the future

Application Flexibility


A wide range of options to meet the demands of any high-speed, high-density application.

High-Density Arrays

These high density array connectors feature a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.

NovaRay® 112 Gbps PAM4, Extreme Density Arrays

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NovaRay® combines extreme density and performance for 112 Gbps PAM4 per channel in 40% less space than traditional arrays.

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AcceleRate® HP High-Performance Arrays

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AcceleRate® HP 0.635 mm pitch arrays feature 112 Gbps PAM4 extreme performance and a flexible open-pin-field design.

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AcceleRate® HD Ultra-Dense, Slim Body Arrays

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These 0.635 mm pitch high-density, open-pin-field arrays feature up to 400 high-speed Edge Rate® contacts in a slim, low-profile design.

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AcceleRate® mP 0.635 mm Signal/Power Arrays

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These 0.635 mm pitch high-density, high-speed signal/power arrays achieve 64 Gbps PAM4 speeds and feature rotated power blades for improved performance and simplified breakout region (BOR).

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SEARAY™

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These high-speed, high-density open-pin-field arrays allow maximum grounding and routing flexibility.

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SEARAY™ 0.80 mm

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These 0.80 mm pitch high-density arrays feature an open-pin-field for up to 50% board space savings.

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LP Array™

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These low profile open-pin-field arrays feature stack heights down to 4 mm with up to 400 total I/Os.

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SUPERNOVA™ Low Profile Compression Interposers

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High-speed, low profile one-piece interposers with a 1.27 mm body height and dual compression contacts.

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HD Mezz

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Elevated HD Mezz high-density open pin field arrays up to 35 mm stack heights.

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E.L.P.™ High Mating Cycle Connectors

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These high mating cycle connectors are tested to rigorous standards which evaluate contact resistance in simulated storage and field conditions.

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Standoffs, Guide Posts & Ultra Rugged Hardware

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Samtec offers a variety of SureWare™ hardware for connector support, including precision standoffs, compression alignment hardware, and guidance modules to assist with mating and help ensure a reliable connection.

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High-Speed Dual Row Strips (Mezzanine)

Board-to-board high speed mezzanine connectors, strips, and systems to 28 Gbps performance featuring integral ground planes, rugged signal integrity optimized Edge Rate contacts, slim body and low profile stack heights.

Edge Rate® Rugged, High-Speed Connector Strips

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These Edge Rate® rugged high-speed connector strips feature contacts optimized for signal integrity performance, increased durability and cycle life.

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Q Strip® High-Speed Ground Plane Connectors

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Samtec Q Strip® high-speed ground plane connectors are designed for high-speed board-to-board applications where signal integrity is essential.

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Q Pairs® Differential Pair Mezzanine Connectors

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Samtec Q Pairs® differential pair mezzanine connectors are designed for high-speed board-to-board applications where signal integrity is essential.

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Q Rate® Slim High-Speed Connectors

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Q Rate® slim high-speed connectors feature an integrated power/ground plane and rugged Edge Rate® contacts for high-reliability and performance.

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Q2™ Rugged, Shielded High-Speed Connectors

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These rugged shielded high-speed connectors feature a ground plane and high-wipe contacts.

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E.L.P.™ High Mating Cycle Connectors

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These high mating cycle connectors are tested to rigorous standards which evaluate contact resistance in simulated storage and field conditions.

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High-Speed Edge Cards

High-speed edge card connector systems with a choice of 0.50 mm, 0.60 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm or 2.00 mm pitch in vertical, right-angle and edge mount orientations.

High-Speed 0.60 mm Pitch Edge Card

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Samtec's Generate® 0.60 mm pitch edge card sockets feature differential pair Edge Rate® contacts for 64 Gbps PAM4 (32 Gbps NRZ) performance and PCIe® 6.0 capable; compliant to SFF-TA-1002 specifications.

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Generate® High-Speed 0.80 mm Pitch Edge Card Sockets

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Samtec's Generate® 0.80 mm pitch edge card sockets feature Edge Rate® contacts optimized for signal integrity performance. Available in vertical, right-angle, edge mount, pass-through and power/signal combo for design flexibility.

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High-Speed 1.00 mm Pitch Edge Card

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Samtec's Generate® 1.00 mm pitch edge card sockets with rugged Edge Rate® contacts and misalignment mitigation support speeds up to 28 Gbps NRZ.

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Micro Pitch Edge Card Sockets

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These micro pitch edge card sockets come in a variety of centerlines and orientations, including 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm, and 2.00 mm, vertical, right-angle, and edge mount, as well as surface mount and through-hole tails.

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PCI Express® Edge Cards

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Samtec offers a variety of PCIe® edge card connectors that mate with PCIe® cable assemblies and jumpers, and are PCI Express® 3.0/4.0/5.0/6.0 and CXL® capable.

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Serial ATA Link Card Sockets, SATA

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High-speed, low profile micro plane SATA socket accommodates variable mating card thickness and features a large deflection BeCu contact system.

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E.L.P.™ High Mating Cycle Connectors

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These high mating cycle connectors are tested to rigorous standards which evaluate contact resistance in simulated storage and field conditions.

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SFP, SFP+ Systems

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SFP connectors, transceiver interface sockets and single or ganged cages. Mates with SFP, SFP+, XFP, or ZENPAK transceivers.

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Micro TCA High-Speed Edge Card Connectors

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These micro TCA high-speed edge card connectors support hot plugging and high-speed serial connections with up to 170 total I/Os.

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Mini Edge Card Guide System

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Mini edge card guide sockets with up to 50 total I/Os that accommodate 0.80 mm and 1.60 mm thick cards.

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Ultra Micro Interconnects

Ultra fine pitch connectors featuring low-profile and ultra-slim bodies with up to 28 Gbps performance.

Razor Beam™ Self-Mating Connectors

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High-speed, high-density Razor Beam™ self mating connectors reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

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Micro Blade & Beam

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These Micro Blade & Beam 0.40 mm & 0.50 mm fine pitch connectors feature an ultra slim, ultra low profile for increased board space savings.

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Standoffs, Guide Posts & Ultra Rugged Hardware

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Samtec offers a variety of SureWare™ hardware for connector support, including precision standoffs, compression alignment hardware, and guidance modules to assist with mating and help ensure a reliable connection.

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Backplane Connectors

Samtec's backplane connectors include ExaMAX® for high-speed 56 Gbps PAM4 performance and XCede® HD for high-density flexibility and space savings.

ExaMAX® High-Speed Backplane System

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The ExaMAX® backplane system offers high-density and design flexibility to fit a variety of applications, including Flyover® cable supporting 112 Gbps PAM4 and board-to-board supporting 64 Gbps PAM4 (32 Gbps NRZ).

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XCede® HD High-Density Backplane System

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Samtec's XCede® HD high-density backplane system features a small form factor ideal for density-critical applications, and a modular design for flexibility and customizable solutions.

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NovaRay® 112 Gbps PAM4 Micro Rugged Backplane System

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NovaRay® Micro Rugged Backplane system combines ultra-high density with an offset footprint for optimal signal integrity performance to 112 Gbps PAM4.

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Standoffs, Guide Posts & Ultra Rugged Hardware

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Samtec offers a variety of SureWare™ hardware for connector support, including precision standoffs, compression alignment hardware, and guidance modules to assist with mating and help ensure a reliable connection.

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Signal Integrity Support


In-house signal integrity expertise for complex applications.

White Papers
Test Reports
Electrical/Mechanical Models
Electrical/Mechanical Models
Break out Region
Break out Region

Online Tools