High-Speed Interconnect Solutions

NovaRay® combines extreme density and performance for 112 Gbps PAM4 per channel in 40% less space than traditional arrays.

AcceleRate® HP 0.635 mm pitch arrays feature 112 Gbps PAM4 extreme performance and a flexible open-pin-field design.

View the full line of AcceleRate® products.

These 0.635 mm pitch high-density, open-pin-field arrays feature up to 400 high-speed Edge Rate® contacts in a slim, low-profile design.

View the full line of AcceleRate® products.

These 0.635 mm pitch high-density, high-speed signal/power arrays achieve 64 Gbps PAM4 speeds and feature rotated power blades for improved performance and simplified breakout region (BOR).

View the full line of AcceleRate® products.

These high-speed, high-density open-pin-field arrays allow maximum grounding and routing flexibility.

These 0.80 mm pitch high-density arrays feature an open-pin-field for up to 50% board space savings.

These low profile open-pin-field arrays feature stack heights down to 4 mm with up to 400 total I/Os.

High-speed, low profile one-piece interposers with a 1.27 mm body height and dual compression contacts.

Elevated HD Mezz high-density open pin field arrays up to 35 mm stack heights.

These high mating cycle connectors are tested to rigorous standards which evaluate contact resistance in simulated storage and field conditions.

Samtec offers a variety of SureWare™ hardware for connector support, including precision standoffs, compression alignment hardware, and guidance modules to assist with mating and help ensure a reliable connection.

These Edge Rate® rugged high-speed connector strips feature contacts optimized for signal integrity performance, increased durability and cycle life.

Samtec Q Strip® high-speed ground plane connectors are designed for high-speed board-to-board applications where signal integrity is essential.

Samtec Q Pairs® differential pair mezzanine connectors are designed for high-speed board-to-board applications where signal integrity is essential.

Q Rate® slim high-speed connectors feature an integrated power/ground plane and rugged Edge Rate® contacts for high-reliability and performance.

These rugged shielded high-speed connectors feature a ground plane and high-wipe contacts.

These high mating cycle connectors are tested to rigorous standards which evaluate contact resistance in simulated storage and field conditions.

Samtec's Generate® 0.60 mm pitch edge card sockets feature differential pair Edge Rate® contacts for 64 Gbps PAM4 (32 Gbps NRZ) performance and PCIe® 6.0 capable; compliant to SFF-TA-1002 specifications.

Samtec's Generate® 0.80 mm pitch edge card sockets feature Edge Rate® contacts optimized for signal integrity performance. Available in vertical, right-angle, edge mount, pass-through and power/signal combo for design flexibility.

Samtec's Generate® 1.00 mm pitch edge card sockets with rugged Edge Rate® contacts and misalignment mitigation support speeds up to 28 Gbps NRZ.

These micro pitch edge card sockets come in a variety of centerlines and orientations, including 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm, and 2.00 mm, vertical, right-angle, and edge mount, as well as surface mount and through-hole tails.

Samtec offers a variety of PCIe® edge card connectors that mate with PCIe® cable assemblies and jumpers, and are PCI Express® 3.0/4.0/5.0/6.0 and CXL® capable.

High-speed, low profile micro plane SATA socket accommodates variable mating card thickness and features a large deflection BeCu contact system.

These high mating cycle connectors are tested to rigorous standards which evaluate contact resistance in simulated storage and field conditions.

SFP connectors, transceiver interface sockets and single or ganged cages. Mates with SFP, SFP+, XFP, or ZENPAK transceivers.

These micro TCA high-speed edge card connectors support hot plugging and high-speed serial connections with up to 170 total I/Os.

Mini edge card guide sockets with up to 50 total I/Os that accommodate 0.80 mm and 1.60 mm thick cards.

High-speed, high-density Razor Beam™ self mating connectors reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

These Micro Blade & Beam 0.40 mm & 0.50 mm fine pitch connectors feature an ultra slim, ultra low profile for increased board space savings.

Samtec offers a variety of SureWare™ hardware for connector support, including precision standoffs, compression alignment hardware, and guidance modules to assist with mating and help ensure a reliable connection.

The ExaMAX® backplane system offers high-density and design flexibility to fit a variety of applications, including Flyover® cable supporting 112 Gbps PAM4 and board-to-board supporting 64 Gbps PAM4 (32 Gbps NRZ).

Samtec's XCede® HD high-density backplane system features a small form factor ideal for density-critical applications, and a modular design for flexibility and customizable solutions.

NovaRay® Micro Rugged Backplane system combines ultra-high density with an offset footprint for optimal signal integrity performance to 112 Gbps PAM4.

Samtec offers a variety of SureWare™ hardware for connector support, including precision standoffs, compression alignment hardware, and guidance modules to assist with mating and help ensure a reliable connection.