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Board-to-Board Connectors
Micro Pitch Board-To-Board
.050" Systems
.050" x .050" Micro Pitch Systems
CLP
Board-to-Board Connectors
Micro Pitch Board-To-Board
.050" Systems
.050" x .050" Micro Pitch Systems
CLP

CLP

Product Specs
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CLP

Product Specs

Low Profile Dual-Wipe Socket, .050" Pitch

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The CLP series is rugged and reliable printed circuit board mount socket. Suitable for top- and bottom-entry applications, the CLP utilizes the Samtec Tiger Claw™ dual-wipe contact system to allow for "pass-through" contact arrangements.

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Features

  • Dual vertical and horizontal row available
  • Low profile dual wipe Tiger Claw™ contact
  • Up to 8 Gbps performance
  • SET Qualified Product: visit samtec.com/SET for more information about Severe Environment Testing
  • Meets or exceeds MIL-DTL-55302 testing
  • Top or bottom entry styles
  • Extended Life Product™ (E.L.P.™)
Specs Kit

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