ZA1

1.00 mm Ultra Low Profile Micro Array

This 1.00 mm pitch ultra low 1 mm profile interposer feature a choice of dual compression contacts or single compression with solder balls. Compared to standard interposers, they feature greater density, X-Y-Z axes flexibility, customizable shapes and patterns, increased cycle life, low normal force with high deflection range and higher speed performance.

Features
  • Low profile - 1 mm standard height
  • Ideal for board stacking, module-to-board and LGA interfaces
  • Allows easy field upgrade, exchange
  • Minimizes thermal expansion issues
  • Up to 400 I/Os
  • 1.00 mm (.0394") pitch
  • Samtec 28+ Gbps Solution
Mates

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