ZA1

1.00 mm Ultra Low Profile Micro Array

This 1.00 mm pitch ultra low 1 mm profile interposer feature a choice of dual compression contacts or single compression with solder balls. Compared to standard interposers, they feature greater density, X-Y-Z axes flexibility, customizable shapes and patterns, increased cycle life, low normal force with high deflection range and higher speed performance.

Features
  • Low profile - 1 mm standard height
  • Ideal for board stacking, module-to-board and LGA interfaces
  • Allows easy field upgrade, exchange
  • Minimizes thermal expansion issues
  • Up to 400 I/Os
  • 1.00 mm (.0394") pitch
  • Samtec 28+ Gbps Solution
Mates

Click here to see a full list of mates related to ZA1.


.
.
With our last web update, we brought you a major update to our on-site search capabilities, an update to how we serve static webfiles on the website, and a few new content pages for industry standard products. In July, we continued to make improvements to our recently released on...
Design and Processing Engineers frequently contact our Interconnect Processing Group (IPG) to discuss multiple connector alignment issues on mating PCBs. Our standard response is “it’s easy, don’t worry about the alignment, and we recommend you use as many mated connector sets as...
All facets of life seem to include videos of some kind.  Social media feeds feature videos from family and friends or possibly that “killer product or service” everybody has to have.  “How-to” and “DIY” videos can be found on any random topic.  The list goes on. Never-ending vide...
24-hour free samples have always been one of the key differentiators for Samtec. We’re always striving to make that process as easy as possible. For the past few months, we’ve been quietly expanding and improving your ability to place sample requests online. We’ve now gotten this...
Bob Hult, our friend at Bishop and Associates and Connector Supplier, recently published High Speed Signals Take The High Road on the Connector Supplier website. Among other things, the article discusses the challenges of high-speed signals in printed circuit boards. As always, B...
View Full Site