GLASS CORE TECHNOLOGY

ULTRA-MINIATURIZED | HIGHLY INTEGRATED | HIGH PERFORMANCE

THROUGH-GLASS VIAS (TGVs) IN GLASS SUBSTRATES

The industry’s only proven process for metalization and hermetic sealing of ultra-high-density Through-Glass Vias (TGVs) enables:

  • Extreme Miniaturization & Integration
  • High Performance Electronics
  • High Reliability Packaging Solutions
REDISTRIBUTION LAYER (RDL) CIRCUIT PATTERNING ON GLASS

RDL’s unique thin-film process enables circuit formation on glass substrates, providing for:

  • Low Loss Fan-Out of Chip and Package Interconnects
  • Lower Cost Compared to Traditional Silicon-Based Interposers
CHANNELS AND SHAPED VIAS IN GLASS SUBSTRATES

Glass is ideal for applications requiring shaped vias and channels, including:

  • Microfluidic & Fluidic Devices
  • 3D Structures
  • Integrated Passive Devices, Filters
  • Endless IoT Applications

HIGH PERFORMANCE ELECTRONICS

Glass substrates offer high structural integrity, resistance to vibration and temperature, environmental ruggedness, and low electrical loss, making them ideal for next generation microelectronics demands. Samtec’s proprietary Glass Core Technology process leverages the performance benefits of glass to enable performance optimized, ultra-miniaturized substrates for next generation designs.

VIEW TYPICAL DESIGN GUIDELINES

Automotive MEMS and Sensors

Smart Building Sensor Modules

RF Component and Modules

Advanced RF SiP

Automotive RF

CMOS Image Sensor (CIS)

Automotive Camera Modules

Active Images & LiDAR

Microfluidics & Lab-On-Chip

Solid State Medical Images

Medical Robotics Sensors

GLASS CORE TECHNOLOGY | ROADMAP

With a wide market reach and broad range of flow speeds, fused silica-based substrates are an ideal solution for micro fluidic devices, a growing market sector within the biomedical industry. Applications include:

  • Fluidic structures for electronics cooling designs
  • Microfluidic structures for biomedical devices and lab-on-chip application designs

Microstructuring possibilities also include formation of micro channels, cavities, larger cooling channels, mixing channels, 180-degree bends, as well as ferrule openings for optical fibers and v-grooves, among others.

Contact the specialists at Samtec Microelectronics to discuss solutions for your next generation system design.

GLASS CORE TECHNOLOGY

GLASS CORE TECHNOLOGY DESIGN GUIDELINES

NOTE

These dimensions are guidelines designed to help release product to manufacturing as quickly as possible. Full capabilities are not limited to the specifications included in this document. Please contact SME@samtec.com for applications with tighter requirements.

THROUGH-GLASS VIA (TGV) ENABLED GLASS INTERPOSERS

Samtec’s Through-Glass Vias (TGVs) enable Glass Core Technology (i.e., glass interposers, smart glass substrates and microstructured glass substrates). TGV-enabled glass substrates permit the integration of glass and metal into a single wafer, while interposers promote more efficient package interconnects and manufacturing cycle times. The hermetically sealed TGVs are manufactured from both high quality borosilicate glass, fused silica (aka quartz), and sapphire.

Through the use of high quality glass wafer material, combined with advanced interconnect technologies (e.g., Redistribution Layer (RDL)), Samtec’s Glass Core Technology enables a one-of-a-kind packaging product.

STANDARD TGV DESIGN GUIDELINES
THROUGH-GLASS VIA CROSS-SECTION VIEW
BOROSILICATE GLASS
FUSED SILICA

LOW PROFILE & FINE PITCH WIRE BOND

RDL provides a unique thin-film approach for interfacing to TGVs. The technique enables circuit formation on various glass substrates.

GLASS CORE TECHNOLOGY CAPABILITIES
TOP VIEW OF CIRCUIT FOR
TOP / BOTTOM RDL
Profile
Typical Package Design Rules
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