MICROELECTRONICS SYSTEM SUPPORT

COMPLETE SUPPORT FROM SILICON-TO-SILICON -
BECAUSE EVERY POINT OF INTERCONNECTION IS CRITICAL

As requirements for smaller, faster, and more integrated microelectronics increase, the challenges designers face intensify exponentially. Samtec offers a unique blend of signal integrity and advanced IC packaging expertise to provide full channel system support for these next generation challenges.

From the early stages of the design process including package design, material selection and PCB routing, through in-depth analysis, modeling and simulation, with measurement validation services available to 67 GHz, Samtec Teraspeed Consulting and Signal Integrity Group engineers can help you optimize and validate your high-performance systems.

FULL CHANNEL EXPERTISE & SUPPORT

PACKAGE AND PCB DESIGN


  • Bumpout / ballout optimization
  • Ballout transition structures
  • Layout & routing
  • Material recommendations

MODELING AND SIMULATION


  • Validate implementation and signaling requirements for critical channels
  • High bandwidth full-wave simulations
  • Design rules for package and PCB designs
  • Simulations via High-Performance Computing (HPC)

ANALYSIS, TESTING & VALIDATION


  • Characterization at frequencies to
    67 GHz and beyond
  • Package, PCB and system-level Signal Integrity / Power Integrity
  • Post-design test, simulation and measurement
  • Post-design test, simulation and measurement
Samtec is presenting new products and new technologies at Electronica 2018, as well as our full line of interconnects including High Speed Board-to-Board, High Speed Cable Assemblies, Micro/Rugged, Flexible Stacking, Optics and Precision RF.  We are in a new location this year:  ...
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