Technology Centers

Technology Centers

Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system. These complementary, cross-functional groups leverage their respective areas of expertise and experience to ensure complete system optimization - from Silicon-to-Silicon™.

Signal Integrity Group

Signal Integrity Group

The Signal Integrity Group (SIG) provides in-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Services include full-channel analysis, high-data rate simulations, application-specific design and development assistance, and advanced design support.

High-Speed Cable Plant

High-Speed Cable Plant

This Technology Center focuses on R&D and manufacturing of precision extruded micro coax and twinax cable used for high-speed, high-density cable assemblies, including 26-38 AWG, 50/75/85/100 Ω impedance, and systems rated at 28 Gbps and beyond.

Samtec Optical Group

Samtec Microelectronics Group

The Microelectronics Group brings a unique blend of signal integrity and advanced IC packaging expertise to provide full channel system support. This includes precision die attach, fine pitch and low profile wire bond, flip chip, underfill and stacked die, com- plete IC-to-Board design, support and manufacturing of IC packaging, substrates, micro high-density inter- posers, and micro optical engines.

Samtec Optical Group

Samtec Optical Group

The Samtec Optical Group is an engineering team dedicated to the design, development, and application support of high performance micro optical engines, active optical assemblies, and high-density ganged passive optical panel solutions.

Advanced Interconnect Design

Advanced Interconnect Design

The Samtec Advanced Interconnect Design Technology Center (AID) ensures your interconnect systems are designed for quality, design flexibility, ease-of-processing, and even supply chain risk minimization. The AID includes precision stamping, plating, molding, and automated assembly for high-speed, fine pitch, array, and micro-rugged interconnects.

Samtec Teraspeed Consulting

Samtec Teraspeed Consulting

From the early stages of the design process including package design, material selection and PCB routing, through in-depth analysis, modeling and simulation, with measurement validation services available to 67 GHz, Samtec Teraspeed Consulting services can help you optimize and validate your high-performance systems. Samtec Teraspeed Consulting

In December, we wrapped up a number of new features to Samtec.com to round out the 2018 year, including a new way to find Samtec sales locations and distributors, a new homepage panel for our Micro Rugged products, continued mobile optimizations, and a few updates to our Industry...
112 Gbps Samtec Flyover™ Demo Samtec’s Ralph Page walks us through a live demonstration of a Samtec Flyover™ system which enables 112 Gbps PAM4 performance. The Credo CDR generates two ports of 31-bit PRBS data at 112 Gbps PAM4 data rates. The signal travels from the Credo Pelica...
Since Samtec began in 1976, free connector samples have been a cornerstone of our business model. That said, we’re always looking for ways to continue to improve how we get samples into your hands. Recently we rolled out a simplified way to place sample requests on the website, w...
It was hot, really hot. In fact, things were getting so bad the walls around us were starting to melt, and just like that it was over; we failed current carrying capacity. That is Current Carrying Capacity (CCC) in a nutshell, well it would be if the parts were failing. Samtec pe...
In this video from SC18, Jignesh Shah of Samtec’s High Speed Connectivity Group walks us through a demonstration of a rearchitected Open Compute Project (OCP) wedge switch. By rearchitected we mean it utilizes Samtec Flyover™ high-speed cable assemblies to achieve next gen speeds...