Technology Centers

Technology Centers

Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system. These complementary, cross-functional groups leverage their respective areas of expertise and experience to ensure complete system optimization - from Silicon-to-Silicon™.

Signal Integrity Group

Signal Integrity Group

The Signal Integrity Group (SIG) provides in-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Services include full-channel analysis, high-data rate simulations, application-specific design and development assistance, and advanced design support.

High-Speed Cable Plant

High-Speed Cable Plant

This Technology Center focuses on R&D and manufacturing of precision extruded micro coax and twinax cable used for high-speed, high-density cable assemblies, including 26-38 AWG, 50/75/85/100 Ω impedance, and systems rated at 28 Gbps and beyond.

Samtec Optical Group

Samtec Microelectronics Group

The Microelectronics Group brings a unique blend of signal integrity and advanced IC packaging expertise to provide full channel system support. This includes precision die attach, fine pitch and low profile wire bond, flip chip, underfill and stacked die, com- plete IC-to-Board design, support and manufacturing of IC packaging, substrates, micro high-density inter- posers, and micro optical engines.

Samtec Optical Group

Samtec Optical Group

The Samtec Optical Group is an engineering team dedicated to the design, development, and application support of high performance micro optical engines, active optical assemblies, and high-density ganged passive optical panel solutions.

Advanced Interconnect Design

Advanced Interconnect Design

The Samtec Advanced Interconnect Design Technology Center (AID) ensures your interconnect systems are designed for quality, design flexibility, ease-of-processing, and even supply chain risk minimization. The AID includes precision stamping, plating, molding, and automated assembly for high-speed, fine pitch, array, and micro-rugged interconnects.

Samtec Teraspeed Consulting

Samtec Teraspeed Consulting

From the early stages of the design process including package design, material selection and PCB routing, through in-depth analysis, modeling and simulation, with measurement validation services available to 67 GHz, Samtec Teraspeed Consulting services can help you optimize and validate your high-performance systems. Samtec Teraspeed Consulting

Readers of the Samtec blog are familiar with the benefits of FMC and FMC+. These popular interfaces define a compact electro-mechanical expansion interface for a daughter card to an FPGA baseboard or other device with re-configurable I/O capability. VITA 57.1 has been around for ...
In February, we rolled out several back-end performance updates to Samtec.com, as well as a few upgraded applications. Here are the major updates to Samtec.com for February 2019. Updated Experience for mPOWER™ Family Page The mPOWER™ connector system is the ultimate micro, high-p...
Edge Rate®, one of Samtec’s most popular high speed, high bandwidth interconnect systems, also saves space on your PCB. Edge Rate is both the name of the contact system and the product family. The contact system is designed for high speed, high cycle, rugged applications.  With s...
Long Reach Backplane Cable This live demonstration from DesignCon 2019 shows how Samtec’s ExaMAX® backplane connector, combined with Samtec Flyover® technology, achieves high density and very long reach. Here, the reach is five meters for a rack-to-rack interconnect system. In th...
By popular request, we have just recently released a brand new standalone videos page that you can use to browse, search, and filter through all of the videos that are featured throughout Samtec.com. You can search by keyword, and/or use the filters we have provided to pair down ...