Technology Centers

Technology Centers

Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system. These complementary, cross-functional groups leverage their respective areas of expertise and experience to ensure complete system optimization - from Silicon-to-Silicon™.

Signal Integrity Group

Signal Integrity Group

The Signal Integrity Group (SIG) provides in-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Services include full-channel analysis, high-data rate simulations, application-specific design and development assistance, and advanced design support.

High-Speed Cable Plant

High-Speed Cable Plant

This Technology Center focuses on R&D and manufacturing of precision extruded micro coax and twinax cable used for high-speed, high-density cable assemblies, including 26-38 AWG, 50/75/85/100 Ω impedance, and systems rated at 28 Gbps and beyond.

Samtec Optical Group

Samtec Microelectronics Group

The Microelectronics Group brings a unique blend of signal integrity and advanced IC packaging expertise to provide full channel system support. This includes precision die attach, fine pitch and low profile wire bond, flip chip, underfill and stacked die, com- plete IC-to-Board design, support and manufacturing of IC packaging, substrates, micro high-density inter- posers, and micro optical engines.

Samtec Optical Group

Samtec Optical Group

The Samtec Optical Group is an engineering team dedicated to the design, development, and application support of high performance micro optical engines, active optical assemblies, and high-density ganged passive optical panel solutions.

Advanced Interconnect Design

Advanced Interconnect Design

The Samtec Advanced Interconnect Design Technology Center (AID) ensures your interconnect systems are designed for quality, design flexibility, ease-of-processing, and even supply chain risk minimization. The AID includes precision stamping, plating, molding, and automated assembly for high-speed, fine pitch, array, and micro-rugged interconnects.

Samtec Teraspeed Consulting

Samtec Teraspeed Consulting

From the early stages of the design process including package design, material selection and PCB routing, through in-depth analysis, modeling and simulation, with measurement validation services available to 67 GHz, Samtec Teraspeed Consulting services can help you optimize and validate your high-performance systems. teraspeed.com

In the footer of Samtec.com, we’ve always made it easy to contact us by phone, email, or live chat (even fax back in the day!). To continue to progress this theme, you’ll now find a new helpful tool in the footer area of Samtec.com. This tool will match you up with your local FSE...
When you hear ICP you might think of the American hip hop duo know as the Insane Clown Posse, but rest assured we are talking about Inductively Coupled Plasma Testing (ICP Testing). While the band might bring a more colorful conversation; it will not aid you in RoHS or REACH comp...
Bishop and Associates Survey We try to make sure the topics in this blog are helpful to our readers — new products, new technologies, new ideas, connector design and processing issues, etc.  We try to not write articles promoting Samtec.  Having said that, every now and then some...
In June, we spent the majority of our time beefing up several areas of My Samtec. We also made a few tweaks to the Tech Specs pages to provide even more technical data to help you make your product decisions. Here are the major updates to Samtec.com for June of 2018. Performance ...
Samtec recently completed an arduous flex and bend test on our Eye Speed® Ultra-Low Skew Twinax cable.  This is used in our high speed cable assemblies, including the Samtec Flyover™ FQSFP-DD cable assembly. Besides achieving outstanding electrical performance, the testing has pr...
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