Technology Centers

Technology Centers

Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system. These complementary, cross-functional groups leverage their respective areas of expertise and experience to ensure complete system optimization - from Silicon-to-Silicon™.

Signal Integrity Group

Signal Integrity Group

The Signal Integrity Group (SIG) provides in-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Services include full-channel analysis, high-data rate simulations, application-specific design and development assistance, and advanced design support.

High-Speed Cable Plant

High-Speed Cable Plant

This Technology Center focuses on R&D and manufacturing of precision extruded micro coax and twinax cable used for high-speed, high-density cable assemblies, including 26-38 AWG, 50/75/85/100 Ω impedance, and systems rated at 28 Gbps and beyond.

Samtec Optical Group

Samtec Microelectronics Group

The Microelectronics Group brings a unique blend of signal integrity and advanced IC packaging expertise to provide full channel system support. This includes precision die attach, fine pitch and low profile wire bond, flip chip, underfill and stacked die, com- plete IC-to-Board design, support and manufacturing of IC packaging, substrates, micro high-density inter- posers, and micro optical engines.

Samtec Optical Group

Samtec Optical Group

The Samtec Optical Group is an engineering team dedicated to the design, development, and application support of high performance micro optical engines, active optical assemblies, and high-density ganged passive optical panel solutions.

Advanced Interconnect Design

Advanced Interconnect Design

The Samtec Advanced Interconnect Design Technology Center (AID) ensures your interconnect systems are designed for quality, design flexibility, ease-of-processing, and even supply chain risk minimization. The AID includes precision stamping, plating, molding, and automated assembly for high-speed, fine pitch, array, and micro-rugged interconnects.

Samtec Teraspeed Consulting

Samtec Teraspeed Consulting

From the early stages of the design process including package design, material selection and PCB routing, through in-depth analysis, modeling and simulation, with measurement validation services available to 67 GHz, Samtec Teraspeed Consulting services can help you optimize and validate your high-performance systems. Samtec Teraspeed Consulting

Many of our Samtec blogs focus on high-speed, high-bandwidth, cutting-edge connector applications. This makes sense because Signal Integrity is a critical issue for many of our customers, and because it’s a more flashy, attention-grabbing, sexy topic. And yes, I did just use the ...
Many electronics experience a wide range of climates while in operation and storage. Because of this fact, connector humidity testing is used to determine the ability of a product to withstand elevated humidity and cycling temperatures. Humidity testing is conducted in combinatio...
In this new video, Samtec’s Kevin Burt introduces Samtec Direct Connect™. Direct Connect gives the benefit of exiting a higher number of lanes at low loss from the chip package, which can be very useful in both high performance computing and network switching applications, especi...
This is the first release of a few phases of a new login system for Samtec.com. This replaces a system that was built in 2011 and has been running well ever since. But, technology changes over time, and it was time for an upgrade. Here are some additional details about the featur...
Modern electronic devices are getting smaller with every new generation, and as a result, they are becoming more portable.  At the same time, the performance of these devices is growing as the demands of consumers become greater.  We expect to be able to connect to the internet w...