triangle alert This site uses cookies and other website monitoring technologies to assist with website functions and with our promotional and marketing efforts. By clicking Accept, you consent to the terms in our recently updated Privacy Notice and Policy Manual.
Accept Decline
triangle alert This site uses cookies and other website monitoring technologies to assist with website functions and with our promotional and marketing efforts. By clicking Accept, you consent to the terms in our recently updated Privacy Notice and Policy Manual.
Accept Decline

Altera®

Altera®

OVERVIEW

Altera® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in today’s FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.

altera logo
hsmc logo

Connectors

Altera® HSMC – Q Strip® (QSH/QTH)

The HSMC connectors defined by the specification are based on the 0.50 mm pitch Q Strip® QSH/QTH Series high-speed board-to-board connectors from Samtec. These connectors are partitioned into three “banks.” Bank 1 in each respective connector has every third signal pin removed to allow for multi-gigahertz differential signaling. Bank 2 and Bank 3 in each respective connector have the entire rows of signal pins filled for various single-ended interface signals.

Altera® HSMC Specified Connectors (Q Strip®)
 

Samtec PN

Connectors
 
Three Bank
Pitch Rows Prints 3D
PADS
ASP-122952-01

Male

0.5 mm

2 PDF Print IGES
PARASOLID
STEP

PADS

ASP-122953-01

Female

0.5 mm

2 PDF Print IGES
PARASOLID
STEP

PADS

Altera® HSMC Specified Cables (Q Strip®)
 

Samtec PN

Cables
 
Type
Pitch Rows Prints End 1 Connector on Cable
End 2 Connector on Cable
HDR-128291-XX

1 Bank, Male Debug Cable

0.5 mm

2 PDF Print IGES
PARASOLID
STEP

IGES
PARASOLID
STEP

HDR-131992-XX-HQDP

3 Bank, Male to Female Cable

0.5 mm

2 PDF Print IGES
PARASOLID
STEP

PADS
PARASOLID
STEP

The Expanding HSMC Ecosystem

The Expanding HSMC Ecosystem

The Altera® High Speed Mezzanine Card (HSMC) specification allows for a flexible design approach to interoperable motherboards and mezzanine cards of various manufacturers. By defining both the electrical and mechanical properties of the adaptor, HSMC brings a standardized approach to a modular architecture. Key features of HSMC include:

  • Optimization for high speed protocols such as PCI Express®, Gigabit Ethernet, and AMC
  • HSMC interconnect provides JTAG, high speed serial I/O, as well as SE and DP signal mapping
  • Programmable I/O and flexible layout options
  • Three-bank connector design allowing for SE and DP signals

Terasic ICB-HSMC

Terasic’s ICB-HSMC (Industrial Communication Board) was designed with industrial communications in mind. ICB allows for serial communication protocols to be sent in real-time. This results in reliable distributed control in applications such as automation and instrumentation.

Key features include:

  • HSMC (High-Speed Mezzanine Card) compatible
  • RS232, RS485 and CAN (Controller Area Network) support over HSMC
  • 40-pin expansion port

Featured Samtec Products:

  • Altera® HSMC (0.50 mm Pitch Lead-Free) Male Connector (Q Strip® ASP-122952-01)
hsmc image

Test Reports

Altera® HSMC Standard

For questions regarding the Altera® HSMC Standard and additional information, please contact us at:

CONTACT SALES

First Name
Last Name
Email
Company
Industry
Estimate Annual Usage
Family
Message

Don't want to fill out a form?
Chat with a product expert directly.

.
.
.
SC19 has come and gone. Anticipation for SC20 in Atlanta is already building. Before we look ahead, what were some highlights from SC19? AI is Everywhere AI is affecting all aspects of life. At SC19, technical presentations showed how AI and HPC are helping researchers cure heart...
In November, we wrapped up our technical debt cleanup, upgraded several of our back-end APIs, and rolled out several small user-experience updates throughout Samtec.com. These updates will pave the way for some exciting new applications and e-e-commerce features in 2020. Here are...
In the video above Ralph Page, Systems Architect at Samtec, walks us through a live product demonstration that received a lot of attention at Super Computing 2019. Ralph discusses several Samtec 56 Gbps PAM4 connector solutions and shares some incredible results. The system can a...
Sam Shine, the founder of Samtec, passed away on November 15 at age 86. Since his passing, several articles and obituaries have been written about Sam and his legacy. Rightfully so, most focus on his love for the Southern Indiana community, his local and national conservation eff...
The global XDF technology road shows come to Beijing next week. FPGA designers, system architects, data scientists and other technical leaders will gather December 3-4, 2019 at the China National Convention Center. Samtec technical experts and our partners will demonstrate some o...