The Expanding HSMC Ecosystem
The Intel High Speed Mezzanine Card (HSMC) specification allows for a flexible design approach to interoperable motherboards and mezzanine cards of various manufacturers. By defining both the electrical and mechanical properties of the adaptor, HSMC brings a standardized approach to a modular architecture. Key features of HSMC include:
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Optimization for high speed protocols such as PCI Express®, Gigabit Ethernet, and AMC
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HSMC interconnect provides JTAG, high speed serial I/O, as well as SE and DP signal mapping
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Programmable I/O and flexible layout options
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Three-bank connector design allowing for SE and DP signals
Terasic ICB-HSMC
Terasic’s ICB-HSMC (Industrial Communication Board) was designed with industrial communications in mind. ICB allows for serial communication protocols to be sent in real-time. This results in reliable distributed control in applications such as automation and instrumentation.
Key features include:
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HSMC (High-Speed Mezzanine Card) compatible
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RS232, RS485 and CAN (Controller Area Network) support over HSMC
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40-pin expansion port
Featured Samtec Products:
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Intel HSMC (0.50 mm Pitch Lead-Free) Male Connector (Q Strip® ASP-122952-01)
Terasic DE2-115
Terasic’s DE2-115 Development and Education Board offers an abundance of interfaces to accommodate various application needs. The DE2-115 balances low cost and low power with a rich supply of logic, memory and DSP capabilities.
An HSMC connector supports additional functionality and connectivity via HSMC daughter cards and cables. HSMC High-Speed Cable & Mezzanine Connectors allow users to connect two mainboards with HSMC interfaces. For large-scale ASIC prototype development, users can connect two kits via the HSMC interface.
Key features include:
- HSMC (High-Speed Mezzanine Card) compatible
- Configurable I/O standards (voltage levels: 3.3/2.5/1.8/1.5V) via HSMC
- Configurable I/O standards (voltage levels: 3.3/2.5/1.8/1.5V) via 40-pin expansion port
Featured Samtec Products:
