Intel®

Intel®

OVERVIEW

Intel® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in today’s FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.

hsmc logo

Connectors

Intel® HSMC – Q Strip® (QSH/QTH)

The HSMC connectors defined by the specification are based on the 0.50 mm pitch Q Strip® QSH/QTH Products high-speed board-to-board connectors from Samtec. These connectors are partitioned into three “banks.” Bank 1 in each respective connector has every third signal pin removed to allow for multi-gigahertz differential signaling. Bank 2 and Bank 3 in each respective connector have the entire rows of signal pins filled for various single-ended interface signals.

Intel® HSMC Specified Connectors (Q Strip®)
 

Samtec PN

Connectors
 
Three Bank
Pitch Rows Prints 3D
PADS
ASP-122952-01

Male

0.5 mm

2 PDF Print IGES
PARASOLID
STEP

PADS

ASP-122953-01

Female

0.5 mm

2 PDF Print IGES
PARASOLID
STEP

PADS

Intel® HSMC Specified Cables (Q Strip®)
 

Samtec PN

Cables
 
Type
Pitch Rows Prints End 1 Connector on Cable
End 2 Connector on Cable
HDR-128291-XX

1 Bank, Male Debug Cable

0.5 mm

2 PDF Print IGES
PARASOLID
STEP

IGES
PARASOLID
STEP

HDR-131992-XX-HQDP

3 Bank, Male to Female Cable

0.5 mm

2 PDF Print IGES
PARASOLID
STEP

PADS
PARASOLID
STEP

Intel and the Intel logo are trademarks of Intel Corporation or its subsidiaries.

The Expanding HSMC Ecosystem

The Expanding HSMC Ecosystem

The Intel High Speed Mezzanine Card (HSMC) specification allows for a flexible design approach to interoperable motherboards and mezzanine cards of various manufacturers. By defining both the electrical and mechanical properties of the adaptor, HSMC brings a standardized approach to a modular architecture. Key features of HSMC include:

  • Optimization for high speed protocols such as PCI Express®, Gigabit Ethernet, and AMC
  • HSMC interconnect provides JTAG, high speed serial I/O, as well as SE and DP signal mapping
  • Programmable I/O and flexible layout options
  • Three-bank connector design allowing for SE and DP signals

Terasic ICB-HSMC

Terasic’s ICB-HSMC (Industrial Communication Board) was designed with industrial communications in mind. ICB allows for serial communication protocols to be sent in real-time. This results in reliable distributed control in applications such as automation and instrumentation.

Key features include:

  • HSMC (High-Speed Mezzanine Card) compatible
  • RS232, RS485 and CAN (Controller Area Network) support over HSMC
  • 40-pin expansion port

Featured Samtec Products:

  • Intel HSMC (0.50 mm Pitch Lead-Free) Male Connector (Q Strip® ASP-122952-01)
hsmc image

Terasic DE2-115

Terasic’s DE2-115 Development and Education Board offers an abundance of interfaces to accommodate various application needs. The DE2-115 balances low cost and low power with a rich supply of logic, memory and DSP capabilities.

An HSMC connector supports additional functionality and connectivity via HSMC daughter cards and cables. HSMC High-Speed Cable & Mezzanine Connectors allow users to connect two mainboards with HSMC interfaces. For large-scale ASIC prototype development, users can connect two kits via the HSMC interface.

Key features include:

  • HSMC (High-Speed Mezzanine Card) compatible
  • Configurable I/O standards (voltage levels: 3.3/2.5/1.8/1.5V) via HSMC
  • Configurable I/O standards (voltage levels: 3.3/2.5/1.8/1.5V) via 40-pin expansion port

Featured Samtec Products:

DE2-115

Test Reports

Intel HSMC Standard

For questions regarding the Intel HSMC Standard and additional information, please contact us at:

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