ExaMAX® Backplane SI Characterization Kits

ExaMAX® Backplane SI Characterization Kits

SI test platform for characterizing ExaMAX® High-Speed Backplane System


Overview

Next-generation data center equipment requires high-speed data paths across the backplane. Samtec’s ExaMAX® high-speed backplane interconnects deliver 56 Gbps electrical performance. The ExaMAX® Backplane SI Characterization Kit provides system designers and SI engineers an easy-to-use solution for testing the ExaMAX® High-Speed Backplane System.

The ExaMAX® Backplane SI Characterization Kit (REF-205463-01) consists of one ExaMAX SI Backplane (REF-200839-01) and two ExaMAX SI Linecards. The system routes eight, high-precision differential pairs over a backplane using ExaMAX® connectors in a 4x10 configuration. It supports configurable backplane trace lengths via user-selected paddleboard placement. Users can configure the system with additional ExaMAX® SI Linecards as desired.

The ExaMAX® Backplane SI Characterization Kit delivers a high-quality system with robust mechanical design. Please contact Samtec’s technical experts at KitsAndBoards@samtec.com for additional information.

examax board
Samtec Part No. REF-205463-01 Pictured
examax backplane
Samtec Part No REF-200840-01 Pictured
examax linecard
Samtec Part No. REF-200839-01 Pictured

Features

  • Three piece PCB system in a compact form factor
  • ExaMAX® SI Backplane contains EBTM series ExaMAX® 2.00 mm Pitch Vertical Header Assembly
  • ExaMAX® SI Linecard contains EBTF-RA series ExaMAX® 2.00 mm Pitch Right-Angle Receptacle
  • Configurable trace lengths from 0.75” to 20.5”
  • Contains high-precision 2.92 mm RF connectors
  • Optimized SI performance via Samtec Final Inch® BOR PCB trace routing
  • Enable time domain measurements via direct connection to TDR/TDTs
  • Enable frequency domain measurements via direct connection to VNAs
  • Ideal test platform for characterization of 56 Gbps PAM4 CDRs, retimers, transceivers and similar ICs

Applications

  • 56 Gbps PAM4 IC Characterization
  • FPGA/SoC Development Boards
  • Servers
  • Storage
  • Networking
  • Test and measurement
  • Wired communication
  • Wireless communications

Ordering Information

Please see drawings REF-205463-01, REF-200839-01 and REF-200840-01 for more detail.

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