VCU110 Examax® Loopback Card

VCU110 Examax® Loopback Card

Mimic IEEE 802.3 Reference Design Channels with 25 dB Loss


Overview

As FPGAs take over the data center, system-level architects require technical support over the entire high-speed serial channel data path. FPGA vendors like Xilinx are working with interconnect partners like Samtec to emulate next generation data center architectures in their FPGA evaluation, development and characterization kits.

As an example, the Xilinx Virtex® UltraScaleTM FPGA VCU110 Development Kit features the ExaMAX® high-speed backplane connector system. Pairing these solutions together provides a platform for demonstrating 28 Gbps performance from an FPGA over a backplane.

The VCU110 ExaMAX® Loopback Card routes 8 GTY MGTs from the Xilinx Virtex® UltraScaleTM FPGA through the ExaMAX® mated connector pair and back to the FPGA. Four GTY loopback channels contain little or no insertion loss. The summation of VCU110 insertion loss and the engineered loss on four additional GTY loopback channels satisfies the IEEE 802.3bj insertion loss requirements. The combined solution enables evaluation and development of routing FPGA transceivers in a table-top environment.

examax searay

Product Brief

VCU110 Examax® Product Brief

VCU110 Examax® Product Brief

Get

Features

  • Compact form factor (5.25" x 6") simplifies mating to traditional right-angle backplane receptacles
  • ExaMAX® 2.00 mm pitch vertical header assembly (Samtec P/N: EBTM-4-10-2.0-S-VT-1)
  • Attaches to J116 (Samtec P/N: EBTF-4-10-2.0-S-RA-1) on Xilinx Virtex® UltraScaleTM FPGA VCU110 Development Kit
  • Features optimize SI performance via Samtec Final Inch® BOR PCB trace routing for EBTM series connector
  • Supports 8 high-speed multi-gigabit transceivers (Tx and Rx) operating up to 28 Gbps

Applications

  • Backplane connector testing and evaluation
  • Wired communication
  • Wireless communications
  • Servers
  • Storage
  • Networking

Ordering Information

Please see drawing REF-200748-01 for more detail.

CONTACT SALES

First Name
Last Name
Email
Company
Industry
Estimate Annual Usage
Family
Message

Don't want to fill out a form?
Chat with a product expert directly.

.
.
In this video from EDI CON 2109, Samtec’s Jignesh Shah explains how Samtec Flyover® offers a 112 Gbps high-density escape from the system ASIC to the front panel. This is a live demonstration of 112 Gbps PAM4 traffic using Credo Semiconductors mixed signal SERDES with Samtec Flyo...
In the video above, Samtec’s Jignesh Shah and Kevin Burt explain that as data rate requirements approach and surpass 112 Gbps PAM4, developers are challenged with balancing increasing throughput, scalability, and density demands with concerns such as power consumption, signal int...
“Artificial Intelligence” and “AI” are all the rage. From high frequency trading on Wall Street to improved drug development, AI affects more aspects of human lives daily. Many AI solutions harness the computing power of cloud connectivity, edge computing, data centers and HPC. T...
mmWave. Massive MIMO. Beamforming. Full duplex. Connectors. Connectors? Yes, connectors. Really! This may seem like a new take on the old childhood game of “One of These Things”. However, all of these technologies (and others) are directly related to developing next-generation an...
“Where high frequency meets high speed,” says the tag line of past EDI CON USA events. What exactly is EDI CON? Technical specialists from across the RF, microwave, EMC/EMI, high-speed digital design and system integrator spectrum met annually. Why? For networking, training and l...