Processing Documentation and Support

Listed below is the processing literature we have available. Click on the links below to view an online version or right click to download. If you do not find the information that you are looking for below or require more information, scroll down to get support from our Interconnect Processing Group.


Samtec's surface mount components are rated MSL level 1 and are compliant with the lead free reflow profile parameters detailed in IPC/JEDEC J-STD-020D.1

Contact the Interconnect Processing Group

Our Interconnect Processing Group is an in-house staff of engineers to support your interconnect processing concerns. IPG can assist you to improve the overall processing and manufacturability of your board as well as help lower its total applied cost.

You may call us at

1-800-SAMTEC9

1-812-944-6733

or

FAQ

For more information, please check our FAQs page.

Embedded World 2019 is the conference for security in electronic systems, distributed intelligence, the Internet of Things / e-mobility, and energy efficiency. In other words, you are going to experience a wide range of embedded systems. It shouldn’t come as a surprise, since we ...
Samtec’s Active Product Demonstrator proves 56 Gbps PAM4 based systems are fully realizable today. It’s a state-of-the-art prototype combining high-performance interconnects from Samtec and bleeding edge Credo silicon. All interconnect and silicon shown are available. The Demonst...
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Samtec’s complete line of discrete wire connectors and cable assemblies are used in a variety of applications, including industrial automation and industrial equipment (like power supplies, measurement devices, process controls and sensor systems), security, telecom, automation, ...
In this video from DesignCon 2019, Scott McMorrow walks us through a live demonstration showing how NovaRay® Cable assemblies offer extreme density while enabling 112 Gbps PAM4 performance. In combination with an ExaMAX® Backplane Cable assembly, the traditional backplane archite...