Processing Documentation and Support

Listed below is the processing literature we have available. Click on the links below to view an online version or right click to download. If you do not find the information that you are looking for below or require more information, scroll down to get support from our Interconnect Processing Group.


Samtec's surface mount components are rated MSL level 1 and are compliant with the lead free reflow profile parameters detailed in IPC/JEDEC J-STD-020D.1

Contact the Interconnect Processing Group

Our Interconnect Processing Group is an in-house staff of engineers to support your interconnect processing concerns. IPG can assist you to improve the overall processing and manufacturability of your board as well as help lower its total applied cost.

You may call us at

1-800-SAMTEC9

1-812-944-6733

or

FAQ

For more information, please check our FAQs page.

Samtec high-speed, edge card interconnect systems are available in a variety of pitches, stack heights, and orientations. They are used just about everywhere, including computers and peripherals, telecom, datacom, industrial equipment, medical, test and measurement, instrumentati...
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High-speed PCB design for applications supporting data rates of 28 Gbps and beyond provides many challenges.  PCB designers and layout engineers need to answer many questions: What PCB laminate offers the best performance? What connectors will be used?  What is the stack up?  How...
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What is the next “smart” thing? Consumers always want the next big “it” thing. Component manufacturers constantly innovate new solutions to help the drive the next “hot” trend or killer application in the electronics industry. Whatever the next consumer trend may be, other market...
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