Processing Documentation and Support

Listed below is the processing literature we have available. Click on the links below to view an online version or right click to download. If you do not find the information that you are looking for below or require more information, scroll down to get support from our Interconnect Processing Group.

General Processing Guidelines

Reflow Soldering

Wave Soldering

Solder Locks

Cleaning

Arrays

Document Type	Link
	AcceleRate® HD ADF6/ADM6 Product Processing
	AcceleRate® HP APF6/APM6 Product Processing
	HD Mezz HDAM/HDAF Products
	High I/O BGA Connector Solder Joint Integrity Investigation
	Improved Solder Joint Integrity for High-Density Interconnect Applications
	LP Array^™ LPAM/LPAF Products Processing
	Qualification of High Density Connector Solutions for Military and Avionic Environments
	SEARAY^™ SEAM/SEAF Products Processing
	SEARAY^™ SEAM/SEAF Products Solder Charge Technology
	SEARAY^™ SEAM-RA/SEAF-RA Products Processing
	SEARAY^™ SEAM-RA/SEAF-RA Products Fixturing
	SEARAY^™ SEAM8/SEAF8 Product Processing
	SEARAY^™ SEAF8-RA Product Processing

Edge Mount Connectors

Document Type Link

Edge Mount Processing (English)

Edge Mount Processing (Chinese)
Multiple Connector Applications

Document Type Link

Multiple Connector Applications

Multiple LSXX Connector Applications

Multiple XLH Connector Applications
Paste In Hole Processing

Document Type Link

Paste In Hole Technology

PIH Soldering of Non-Protruding Connector Features

Solder Locks
Press Fit

Document Type Link

SEARAY^™ Compliant Pin Termination Specifications

Press Fit Instructions

Document Type	Link
	Edge Mount Processing (English)
	Edge Mount Processing (Chinese)

Document Type	Link
	Multiple Connector Applications
	Multiple LSXX Connector Applications
	Multiple XLH Connector Applications

Document Type	Link
	Paste In Hole Technology
	PIH Soldering of Non-Protruding Connector Features
	Solder Locks

Document Type	Link
	SEARAY^™ Compliant Pin Termination Specifications
	Press Fit Instructions

Rework Guidelines

Document Type	Link
	Edge Mount Rework Guidelines
	HSEC8-DV Rework Guidelines
	LP Array^™ LPAM/LPAF Rework Guidelines
	Q Strip^® and Q2^™ Right-Angle Rework Guidelines
	Q Strip^® and Q2^™ Vertical Rework Guidelines
	Razor Beam^™ LSEM/LSS/LSHM Rework Guidelines
	Right-Angle and Horizontal Surface Mount Rework Guidelines
	SEARAY^™ 0.80 mm SEAM8/SEAF8 Rework Guidelines
	SEARAY^™ SEAM/SEAF Rework Guidelines
	SEARAY^™ SEAM-RA/SEAF-RA Rework Guidelines
	SEARAY^™ SEAF8-RA Rework Guidelines
	Solder Ball Rework Guidelines

Additional Resources

Document Type	Link
	Board-to-Board Standoffs
	Cut Tape Packaging Instructions
	Conformal Coating Connectors
	JSO Board-to-Board Standoffs
	Locking Clips Processing
	MEC5 Processing Recommendations
	PCB Hole Sizes
	Securing Connectors with Epoxy Adhesives
	Soldering Success with 0.15 mm (.006") Coplanarity & 0.10 mm (.004") Stencil – English
	Soldering Success with 0.15 mm (.006") Coplanarity & 0.10 mm (.004") Stencil - German

Contact the Interconnect Processing Group

Our Interconnect Processing Group is an in-house staff of engineers to support your interconnect processing concerns. IPG can assist you to improve the overall processing and manufacturability of your board as well as help lower its total applied cost.

You may call us at

1-800-SAMTEC9

1-812-944-6733

Email IPG

FAQ

For more information, please check our FAQs page.