HDTM

Product Specs
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XCede® HD 1.80 mm High-Density Backplane Vertical Header

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Features

  • Integrated guidance, keying and polarizing side walls available

  • Up to 3.00 mm contact wipe on signal pins

  • 3-, 4- and 6-pair designs

  • 4, 6 or 8 columns

  • Three levels of sequencing enable hot plugging

Specs Kit

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