High-Speed Backplane Systems


High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. XCede® HD is a small form factor system with a modular design for significant space savings and flexibility.

NovaRay® micro rugged backplane system enables performance to 112 Gbps PAM4 with an offset footprint and provides configurable signal banks for design flexibility.

High-Speed Backplane Systems Brochure

High-Speed Backplane Systems Brochure

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High-Speed Backplane Product Lineup

ExaMAX® High-Speed Backplane System

ExaMAX® High-Speed Backplane System

The ExaMAX® backplane system offers high-density and design flexibility to fit a variety of applications, including Flyover® cable supporting 112 Gbps PAM4 and board-to-board supporting 64 Gbps PAM4 (32 Gbps NRZ).

  • Enables 64 Gbps PAM4 (32 Gbps NRZ) electrical performance on 2.00 mm column pitch

  • PCIe® 6.0/CXL® 3.1 capable

  • Allows designers to optimize density or minimize board layer count

  • Two reliable points of contact, even when subjected to angled mating

  • Meets Telcordia GR-1217 CORE specification

  • Individual signal wafers with staggered differential pair design; 24–72 pairs (board connectors) and 16–96 pairs (cable assemblies)

  • One-piece embossed ground structure on each signal wafer to reduce crosstalk

  • Lowest mating force on the market: 0.36 N max per contact

  • Backplane cable assemblies improve signal integrity and increase signal path length at higher data rates

  • Samtec's Eye Speed® ultra low skew twinax cable provides increased flexibility and routability

  • Stub free mating

  • Press-fit termination

  • Power and Guide Modules available

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XCede® HD High-Density Backplane System

XCede® HD High-Density Backplane System

Samtec's XCede® HD high-density backplane system features a small form factor ideal for density-critical applications, and a modular design for flexibility and customizable solutions.

  • Small form factor provides significant space savings

  • Modular design provides flexibility in applications

  • High-density backplane system – up to 84 differential pairs per linear inch

  • 1.80 mm column pitch

  • 3-, 4- and 6-pair designs

  • 4, 6 or 8 columns

  • 12–48 pairs

  • Up to a 3.00 mm contact wipe on signal pins

  • Multiple signal/ground pin staging options

  • Integrated power, guidance, keying and side walls available

  • 85 Ω and 100 Ω options

  • Three levels of sequencing enable hot plugging

  • Cost-effective designs available for low-speed applications

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NovaRay® 112 Gbps PAM4 Micro Rugged Backplane System

NovaRay® 112 Gbps PAM4 Micro Rugged Backplane System

NovaRay® Micro Rugged Backplane system combines ultra-high density with an offset footprint for optimal signal integrity performance to 112 Gbps PAM4.

  • Ultra-high density with up to 128 differential pairs in a single connector

  • 56 Gbps NRZ/112 Gbps PAM4 performance per channel

  • Supports blind mate applications

  • Surface mount for better density and performance

  • Offset footprint for optimum signal integrity

  • Flyover® cable assembly in design

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Standoffs, Guide Posts & Ultra Rugged Hardware

Standoffs, Guide Posts & Ultra Rugged Hardware

Samtec offers a variety of SureWare™ hardware for connector support, including precision standoffs, compression alignment hardware, and guidance modules to assist with mating and help ensure a reliable connection.

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