HDTF
XCede® HD 1.80 mm Right-Angle Backplane Receptacle
Features
- 3-, 4- and 6-pair designs
- 4, 6 or 8 columns
- Standard or high-speed wafers available
- 85 Ω and 100 Ω options
- Modular design provides flexibility in applications
Features
- 3-, 4- and 6-pair designs
- 4, 6 or 8 columns
- Standard or high-speed wafers available
- 85 Ω and 100 Ω options
- Modular design provides flexibility in applications
While Samtec started as a connector company with a focus on two-piece, pin-and-socket board stacking systems, High-Speed Board Stacking connectors and High-Speed Cable Assemblies now make up a significant portion of our sales. To support development in this area, in December of 2...
In the manufacturing world there are standards for just about everything, and they all are typically there to ensure a product can perform as expected for the end application. Among these standards is IPC-A-610 covering solder joints for varying types of connector termination sty...
New Year’s resolutions. Many of us make them, whether it’s to continue a good habit, change a bad one or accomplish a new goal, improvement is the focus. The hardest part of this process is the time between making the plan and accomplishing it. Wouldn’t it be nice if we could jus...
2019 was a fun year for Samtec.com. We’re in a great place right now where we get to maintain current content and features while we’re building a lot of new stuff as well. The website is becoming more mature, but still developing rapidly. If you missed it, here is a look back at ...
While air cooling is still a commonly used method to cool data centers, the industry is seeing HPC, AI, and scientific computing market leaders investigating either conduction cooling, or full-scale immersion cooling, for their next generation designs. In this video from SuperCom...
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