Power/Signal Systems

High power and signal connectors. Combination board-to-board systems up to 60 A, in vertical and right-angle orientations with high-density power blades and small form factor designs.


Signal/Power Edge Rate® ComboSignal/Power Edge Rate® Combo Edge Card System

Combination signal and power edge card system with rugged Edge Rate® contacts and performance up to 60 A per power bank.

Features
  • Power blades rated up to 60 A per power bank
  • Rugged Edge Rate® contact system
  • Accepts 1.60mm (.062") thick cards
  • Available with 40, 60 and 80 signal pins
  • Choice of 2 or 4 power banks
  • Optional weld tab for mechanical strength
Products
V
  • HSEC8-PV
Signal/Power Edge Rate® Combo

Power / Q2™ Signal ComboPower / Q2™ Signal Combo

Q2™ power and signal combination interconnects with integral ground plane.

Features
  • High-speed Q2™ contacts with power end option
  • Vertical and right-angle orientations
  • Up to 8 power pins per end as an application specific option
  • Optional shielding
  • Stack Height: 10.00 mm and 11.00 mm
  • Contacts: Up to 156 signals, up to 4 power per end
Products
V
  • QFS
  • QMS
  • GPSK
  • GPPK
  • HPFC
  • HPMC
  • PCS2
  • PCT2
Power / Q2™ Signal Combo

PowerStrip™PowerStrip™

PowerStrip™/30 and PowerStrip™/40 combination signal and power systems.

Features
  • Performance to 31.4 A per power blade
  • Up to 8 power blades and 80 signal pins
  • High-power dual blade contact system
  • Rugged screw down and locking clip options
Products
V
  • PESC
  • PETC
  • MPSC
  • MPTC
PowerStrip™

AcceleRate® mPAcceleRate® mP High-Density, High-Speed Power/Signal Arrays

These 0.635 mm pitch power/signal arrays achieve 64 Gbps PAM4 speeds and feature rotated power blades for 22 Amps/blade and simplified breakout region (BOR). View the full line of AcceleRate® products.

Features
  • Best in class density for power and signal
  • Power blades rotated 90º gives equal access to heat escape for uniform cooling, increased current capacity and reduced crowding
  • Supports 64 Gbps PAM4 (32 Gbps NRZ) applications
  • PCIe® 6.0/CXL® 3.1 capable
  • Up to 22 Amps per power blade
  • Open-pin-field for grounding and routing flexibility
  • High-density multi-row design
  • Low profile 5 mm stack height; up to 16 mm in development
  • 4 or 8 total power blades; up to 10 in development
  • 60 or 240 total signal positions; additional position counts in development
  • 0.635 mm signal pitch
  • Optional alignment pins and weld tabs for a secure connection to the board
  • Polarized guide posts for blind mating
  • View the full line of AcceleRate® products
Products
V
  • UDF6
  • UDM6
AcceleRate® mP

EXTreme Ten60Power™EXTreme Ten60Power™

A 60 Amp modular high power and signal combo connector system for coplanar and right-angle board-to-board applications. Designed as a high-current and lower profile interconnect than existing connectors, EXTreme Ten60Power™ interconnects provide maximum current-to-length ratio packaged in a low 10 mm height housing that enhances airflow within the system.

Features
  • Performance to 60 A per power blade
  • Rugged 10 mm low profile design (right-angle orientation)
  • 3 or 5 signal rows in the same form factor
  • Available with 0 to 40 signal pins
  • Up to 20 total DC power blades or 12 total AC power blades
  • AC-DC power combos and split power options available
  • Press-fit tails option for ease of board termination (ET60S only)
  • Modules can be configured to accommodate most any design
  • For coplanar or perpendicular applications
  • Hot plug option available
Products
V
  • ET60S
  • ET60T
EXTreme Ten60Power™

EXTreme LPHPower™EXTreme LPHPower™

High-power, low profile system.

Features
  • Performance to 30 A per power blade
  • Extremely low 7.50 mm profile (right-angle)
  • Double stacked power blades for high-density
  • Socket mates with standard .062" (1.60 mm) PCB card
Products
V
  • LPHS
  • LPHT
EXTreme LPHPower™

ExaMAX®ExaMAX® High-Speed Backplane System

ExaMAX® high-speed backplane interconnects deliver 64 Gbps PAM4 (32 Gbps NRZ) electrical performance.

Features
  • Enables 64 Gbps PAM4 (32 Gbps NRZ) electrical performance on 2.00 mm column pitch
  • PCIe® 6.0/CXL® 3.1 capable
  • Allows designers to optimize density or minimize board layer count
  • Two reliable points of contact, even when subjected to angled mating
  • Meets Telcordia GR-1217 CORE specification
  • Individual signal wafers with staggered differential pair design; 24 - 72 pairs (board connectors) and 16 - 96 pairs (cable assemblies)
  • One-piece embossed ground structure on each signal wafer to reduce crosstalk
  • Lowest mating force on the market: 0.36 N max per contact
  • Backplane cable assemblies improve signal integrity and increase signal path length at higher data rates
  • Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability
  • Stub free mating
  • Press-fit termination
  • Power and Guide Modules available
Products
V
  • EBTM
  • EBTM-RA
  • EBTF-RA
  • EBDM-RA
  • EBCM
  • EBCF
  • EGBM
  • EGBF
  • EPTT
  • EPTS
  • EBCL
  • EBCB
ExaMAX®

XCede® HDXCede® HD High-Density Backplane System

Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.

Features
  • Small form factor provides significant space savings
  • Modular design provides flexibility in applications
  • High-performance system
  • High-density backplane system – up to 84 differential pairs per linear inch
  • 1.80 mm column pitch
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • 12 - 48 pairs
  • Multiple signal/ground pin staging options
  • Integrated power, guidance, keying and side walls available
  • 85 Ω and 100 Ω options
  • Three levels of sequencing enable hot plugging
  • Cost-effective designs available for low-speed applications
Products
V
  • HDTF
  • HDTM
  • BSP
  • HPTS
  • HPTT
XCede® HD

Samtec demonstrated many high-performance RF test and measurement solutions at DesignCon 2024. In this video, David Beraun, Samtec’s RF Product Manager, takes a quick look at some of those high-performance […] The post New Samtec RF Test and Measurement Solutions At DesignCon 202...
Samtec will be demonstrating next-gen, high-performance optical and copper interconnect solutions at the upcoming OFC 2024 Exhibition at the San Diego Convention Center, San Diego, CA March 26-28, 2024. OFC […] The post Samtec Exhibits at OFC 2024 in San Diego appeared first on T...
We have come to expect unprecedented reliability from our electronic devices, whether in the consumer market or in the industrial world.  Ensuring the highest performance of semiconductors requires manufacturers to […] The post Connectors for Semiconductor Manufacturing appeared ...
224 Gbps PAM4; CXL over optics; 112 Gbps PAM4 cable with excellent performance while subjected to dynamic flexing; 800 G; 90 GHz test and validation solutions. Samtec showcased a variety […] The post An Array of High-Performance Front Panel and Backplane Solutions appeared first ...
I am a big fan of the TV show Modern Marvels and I recently watched an episode on the evolution of the Assembly Line. The clip focused on the basic […] The post Samtec’s Five New Solution Videos for Industrial Applications appeared first on The Samtec Blog....