High power and signal connectors. Combination board-to-board systems up to 60 A, in vertical and right-angle orientations with high-density power blades and small form factor designs.
Combination signal and power edge card system with rugged Edge Rate® contacts and performance up to 60 A per power bank.
Q2™ power and signal combination interconnects with integral ground plane.
PowerStrip™/30 and PowerStrip™/40 combination signal and power systems.
These 0.635 mm pitch power/signal arrays achieve 64 Gbps PAM4 speeds and feature rotated power blades for 22 Amps/blade and simplified breakout region (BOR).
A 60 Amp modular high power and signal combo connector system for coplanar and right-angle board-to-board applications. Designed as a high-current and lower profile interconnect than existing connectors, EXTreme Ten60Power™ interconnects provide maximum current-to-length ratio packaged in a low 10 mm height housing that enhances airflow within the system.
High-power, low profile system.
ExaMAX® high-speed backplane interconnects deliver 56 Gbps electrical performance.
Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.