High power/signal combination board-to-board systems up to 60 A, in vertical and right-angle orientations with high-density power blades and small form factor designs.
Combination signal and power edge card system with rugged Edge Rate® contacts and performance up to 60 A per power bank.
Q2™ power and signal combination interconnects with integral ground plane.
PowerStrip™/30 and PowerStrip™/40 combination signal and power systems.
Micro 2.00 mm pitch power blade interconnects designed for staging a combination power and signal/ground solution.
A 60 Amp modular high power and signal combo connector system for coplanar and right-angle board-to-board applications. Designed as a high-current and lower profile interconnect than existing connectors, EXTreme Ten60Power™ interconnects provide maximum current-to-length ratio packaged in a low 10 mm height housing that enhances airflow within the system.
High-power, low profile system.