Power/Signal Systems
High power and signal connectors. Combination board-to-board systems up to 60 A, in vertical and right-angle orientations with high-density power blades and small form factor designs.
Signal/Power Edge Rate® ComboSignal/Power Edge Rate® Combo Edge Card System
Combination signal and power edge card system with rugged Edge Rate® contacts and performance up to 60 A per power bank.
Features
- Power blades rated up to 60 A per power bank
- Rugged Edge Rate® contact system
- Accepts 1.60mm (.062") thick cards
- Available with 40, 60 and 80 signal pins
- Choice of 2 or 4 power banks
- Optional weld tab for mechanical strength
Power / Q2™ Signal ComboPower / Q2™ Signal Combo
Q2™ power and signal combination interconnects with integral ground plane.
Features
- High-speed Q2™ contacts with power end option
- Vertical and right-angle orientations
- Up to 8 power pins per end as an application specific option
- Optional shielding
- Stack Height: 10.00 mm and 11.00 mm
- Contacts: Up to 156 signals, up to 4 power per end
PowerStrip™PowerStrip™
PowerStrip™/30 and PowerStrip™/40 combination signal and power systems.
Features
- Performance to 31.4 A per power blade
- Up to 8 power blades and 80 signal pins
- High-power dual blade contact system
- Rugged screw down and locking clip options
mPOWER® Ultra Micro Power ConnectorsmPOWER® Ultra Micro Power Connectors
Micro 2.00 mm pitch power blade interconnects designed for staging a combination power and signal/ground solution.
Features
- Design flexibility as a power-only system or a two-piece system for power/signal applications
- Use with Samtec’s high-speed connector systems for a power/signal solution
- 5 mm to 16 mm, 18 mm & 20 mm stack heights
- Up to 18 A per blade
- 2 – 5 power blades on a 2.00 mm pitch
EXTreme Ten60Power™EXTreme Ten60Power™
A 60 Amp modular high power and signal combo connector system for coplanar and right-angle board-to-board applications. Designed as a high-current and lower profile interconnect than existing connectors, EXTreme Ten60Power™ interconnects provide maximum current-to-length ratio packaged in a low 10 mm height housing that enhances airflow within the system.
Features
- Performance to 60 A per power blade
- Rugged 10 mm low profile design (right-angle orientation)
- 3 or 5 signal rows in the same form factor
- Available with 0 to 40 signal pins
- Up to 20 total DC power blades or 12 total AC power blades
- AC-DC power combos and split power options available
- Press-fit tails option for ease of board termination (ET60S only)
- Modules can be configured to accommodate most any design
- For coplanar or perpendicular applications
- Hot plug option available
- Dual sourced by Molex®
EXTreme LPHPower™EXTreme LPHPower™
High-power, low profile system.
Features
- Performance to 30 A per power blade
- Extremely low 7.50 mm profile (right-angle)
- Double stacked power blades for high-density
- Socket mates with standard .062" (1.60 mm) PCB card
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