Si-Fly™ Flyover® SI Evaluation Kit

Si-Fly™ Flyover® SI Evaluation Kit

SI test platform for evaluating Si-Fly™ 112 Gbps PAM4, Low-Profile High-Density Cable System


As data rates increase, trace lengths on PCBs decrease. Samtec's high-speed, Flyover® solutions simplify PCB design and limit signal degradation in high data rate applications. The Si-Fly™ Flyover® SI Evaluation Kit provides system designers and SI engineers an easy-to-use solution for testing the Si-Fly™ 112 Gbps PAM4, Low-Profile High-Density Cable System.

The Si-Fly™ Flyover® SI Evaluation Kit (REF-224260-X.XX-XXX) routes eight high-speed differential pairs through Precision RF connectors, a Copper Si-Fly™ Cable System and a Copper Si-Fly™ High-Density Interconnect.

The Si-Fly™ Flyover® SI Evaluation Kit delivers a high-quality system with robust mechanical design. Please contact Samtec’s technical experts at [email protected] for additional information.

Si-Fly Flyover SI Evaluation Kit
Samtec Part Number REF-224260-2.40-01 Pictured


  • Two PCB system with compact form factor
  • Each PCB contains one CPI series (CPI-16-01-2-S-RA-2-L-XX) Si-Fly™ Low-Profile, High-Density Interconnect
  • PCBs connect via one of two Copper Si-Fly™ Low-Profile, High-Density Cable Systems (CPC-16-X-XX.X-2-02-L-X)
  • Kits comes with two CPC series standard cable lengths (6”, 12”)
  • Routes high-speed differential pairs (8) from CPI series connectors to high-precision RF connectors
  • Supports multiple high-precision RF connector options
  • Optimized SI performance via Samtec Final Inch® BOR PCB trace routing
  • Enable time domain measurements via direct connection to TDR/TDTs
  • Enable frequency domain measurements via direct connection to VNAs


  • Servers
  • Storage
  • Networking
  • Test and measurement
  • Wired communication
  • Wireless communications

Ordering Information

Please see drawing REF-224260-X.XX-XXX for more detail.

Contact [email protected] for additional ordering information.


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