CPC Copper Si-Fly® LP Low-Profile, High-Density Cable System

Features

  • Extremely low mated height (view mating details here): 3.06 mm (8 pair) and 4.35 mm (16 pair)

  • Ideal for highly dense applications where z-axis height is limited

  • Near-chip (ASIC-adjacent) cable system

  • Multiple connectors can be used side-to-side, front-to-back or in a belly-to-belly configuration

  • 34 AWG, 92 or 100 Ω Eye Speed® ultra low skew twinax cable

  • 112 Gbps PAM4 per lane

  • 16 pair aggregate data rate: 896 Gbps (x8, bi-directional) or 1.79 Tbps (x16, uni-directional)

  • PCIe® 6.0/CXL® 3.2 capable

  • Rugged swing latch for positive retention

  • Operating temperature: -25 ˚C to +85 ˚C

  • Eludes the BGA and routes signals directly from the silicon package through a long-reach cable

  • In development options: 34 AWG Thinax™ cable, 105 ˚C operating temp

Copper Si-Fly® LP Low-Profile, High-Density Cable System
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Evaluation and Development Kits
Si-Fly® Flyover® SI Evaluation Kit

REF-224260-X.XX-XXX

Company: Samtec

As data rates increase, trace lengths on PCBs decrease. Samtec's high-speed, Flyover® solutions simplify PCB design and limit signal degradation in high data rate applications. The Si-Fly® Flyover® SI Evaluation Kit provides system designers and SI engineers an easy-to-use solution for testing the Si-Fly® 112 Gbps PAM4, Low-Profile High-Density Cable System. The Si-Fly® Flyover® SI Evaluation Kit (REF-224260-X.XX-XXX) routes eight high-speed differential pairs through Precision RF connectors, a Copper Si-Fly® Cable System and a Copper Si-Fly® High-Density Interconnect. The Si-Fly® Flyover® SI Evaluation Kit delivers a high-quality system with robust mechanical design. Please contact Samtec’s technical experts at [email protected] for additional information.

picture of development kit
Protocols
PDR IB EDR 32GFC 64GFC IB HDR 128GFC IB NDR 256GFC IB XDR
25.8 Gbps 28.05 Gbps 28.9 Gbps PAM4 53.13 Gbps PAM4 56.1 Gbps PAM4 106.25 Gbps PAM4 112.2 Gbps PAM4 200 Gbps PAM4
56 Gbps NRZ/112 Gbps PAM4 Capable Capable Capable Capable Capable Capable Capable No
How is this calculated?
Mates and Related Components

Mating Connectors

Si-Fly® LP Low-Profile, High-Density Interconnect
CPI

Si-Fly® LP Low-Profile, High-Density Interconnect

Compliance
Compliance Tools
Material Declaration
EU RoHS and REACH Compliance

For assistance with Compliance, please contact [email protected].
What is Risk Mitigation?