100-CM
IN DEVELOPMENT - 50 Ohm 1.00 mm Jack, Vertical Compression Mount
Features
Vertical, solderless compression
Board thickness, vertical: .016" to .125" or .069" to .178" with screws
Field replaceable, cost-effective assembly
Microstrip/CPW transmission
Small form factor improves density
Alignment features: with the addition of fiducials on the PCB any visual misalignment is eliminated, ensuring peak connector performance
Threaded coupling with high mechanical stability
Performance to 110 GHz
Ideal for high-performance test applications
Air dielectric design for low VSWR and insertion loss
Torque (board mount): 0.5 ~ 0.8 in-lbs
1.00 mm bandwidth expansion opportunities for emerging D band applications
Armored design for crush, abrasion, kink, and torque resistance with enhanced tensile strength
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