ART6 IN DEVELOPMENT - AcceleRate® HP Double Density, Co-Packaged Cable Assembly
Features
Co-packaged (direct-to-chip package) solution
Routes an extremely high number of transmission lines from the chip
112 Gbps PAM4 performance
Doubles the density in the same footprint compared to AcceleRate® HP near-chip cable system (ARP6, APF6-L/APF6-T)
12 rows, 6 or 12 pairs per row (72 and 144 differential pairs)
0.635 mm pitch with staggered row-to-row spacing
Eye Speed Thinax™ cable technology provides overall weight reduction and maximizes airflow
Ultra low skew 3.5 ps/meter max
2-piece system for high-reliability and thermal performance required for co-packaged solutions
Operating temperatures supporting -55 °C to +125 °C
Integrated mechanical retention (removal tool required)
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