ATF6 IN DEVELOPMENT – 0.635 mm AcceleRate® HP Double Density, Co-Packaged Socket for Cable Mate (ART6 Series)

Designed to mate with AcceleRate® HP Double Density cable assembly (ART6)
Co-packaged (direct-to-chip package) solution
112 Gbps PAM4 performance
Doubles the density in the same footprint compared to AcceleRate® HP near-chip cable system (ARP6, APF6-L/APF6-T)
12 rows, 6 or 12 pairs per row (72 and 144 differential pairs)
0.635 mm pitch with staggered row-to-row spacing

Surface mount reflow technology to the substrate
Qualified surface mount reflow processes; contact Samtec's Interconnect Processing Group
Operating temperatures supporting -55 °C to +125 °C
Integrated mechanical retention (removal tool required)

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ATF6-19-18.57-L-12-S-TR

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Protocols

PDR	IB EDR	32GFC	64GFC	IB HDR	128GFC	IB NDR	256GFC	IB XDR
	25.8 Gbps	28.05 Gbps	28.9 Gbps PAM4	53.13 Gbps PAM4	56.1 Gbps PAM4	106.25 Gbps PAM4	112.2 Gbps PAM4	200 Gbps PAM4
Gbps	Capable	Capable	Capable	Capable	Capable	Capable	Capable	No

PDR	USB 10Gbps	PCIe 4.0	USB 20Gbps	PCIe 5.0	USB 40Gbps	USB 80Gbps	PCIe 6.0	PCIe 7.0
	10 Gbps	16 Gbps	20 Gbps	32 Gbps	40 Gbps	40 Gbps	64 Gbps PAM4	128 Gbps PAM4
Gbps	Capable	Capable	Capable	Capable	Capable	Capable	Capable	No

PDR	Ethernet	Ethernet	Ethernet	OIF CEI 56G	Ethernet	OIF CEI 112G	Ethernet	OIF CEI 224G
	10 Gbps	25 Gbps	50 Gbps PAM4	56 Gbps PAM4	100 Gbps PAM4	112 Gbps PAM4	200 Gbps PAM4	224 Gbps PAM4
Gbps	Capable	Capable	Capable	Capable	Capable	Capable	No	No

PDR	SATA 2.0	SAS 2.0	SATA 3.0	SAS 3.0	SATA 3.5	SAS 4.0	CXL 1.1/2.0	CXL 3.2
	3 Gbps	6 Gbps	6 Gbps	12 Gbps	16 Gbps	22.5 Gbps	32 Gbps	64 Gbps PAM4
Gbps	Capable	Capable	Capable	Capable	Capable	Capable	Capable	Capable

Mates and Related Components

ART6

IN DEVELOPMENT - AcceleRate® HP Double Density, Co-Packaged Cable Assembly

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