CLP-111-02-H-D-BE-A

Low Profile Dual-Wipe Socket, .050" Pitch rohs logo set logo Product Specs

CLP-111-02-H-D-BE-A

Low Profile Dual-Wipe Socket, .050" Pitch rohs logo set logo

Product Specs

Please Login to see customer specific pricing. Or you may directly contact support.
You don't have an account? Create one

Click here to check the current lead time for this product.

Save your preferred CAD Download type in your user profile.

2D view may not be representative of the configured product. Please see 3D preview or CAD download for actual representation.

Need help choosing your options? View Catalog Page.

Please confirm configuration with the Series Print before final design in.

For assistance with 3D Models, please contact [email protected].

For 3D Models suitable for EM Field Solvers, please contact Samtec’s Signal Integrity Group.

.
Features

  • Dual vertical and horizontal row available
  • Low profile dual wipe Tiger Claw™ contact
  • Up to 8 Gbps performance
  • SET Qualified Product: visit samtec.com/SET for more information about Severe Environment Testing
  • Meets or exceeds MIL-DTL-55302 testing
  • Top or bottom entry styles
  • Extended Life Product™ (E.L.P.™)
Specs Kit

Secured form. No spam.

. .
.
.
. .
.