HALO-C - IN DEVELOPMENT - Halo® Next Gen Mid-Board Optical Transceivers

Features

  • Designed for next gen embedded applications

  • 56 Gbps PAM4 performance per lane; 112 Gbps PAM4 per lane in development

  • 16 channels (x8 bidirectional)

  • Low 6.35 mm profile for space savings

  • Features a low center of gravity for a stable connection to the board

  • Optically pluggable for easy field replacement

  • Variety of heat sink options for conduction, convection, cold plates or liquid cooling thermal relief

  • Interchangeable with Halo Cu™ next gen copper cable assembly using the same high-performance socket connector

  • Rugged surface mount connector with integrated locking latch mechanism simplifies mating/unmating of the cable assembly

  • Contact [email protected] for more information

  • Samtec Halo® optical transceiver kits and Halo Cu™ copper cables are not affiliated with HALO® front panel or other products sold by Halo Electronics (www.haloelectronics.com)

IN DEVELOPMENT - Halo® Next Gen Mid-Board Optical Transceivers
Mates and Related Components

Related Components

Halo Cu™ Copper Mid-Board Cable System
HALO-PE

Halo Cu™ Copper Mid-Board Cable System

Mating Connectors

halo high density socket
HLF6

Halo® Rugged, High-Density Socket

Compliance
Compliance Tools
Material Declaration
EU RoHS and REACH Compliance

For assistance with Compliance, please contact [email protected].
What is Risk Mitigation?

Send this Page as an Email

Download Specs Kit

Enter your email address to download a Specs Kit for this product. Inside you’ll find helpful links to Catalog Pages, Prints, Test Reports, 3D Models, Samples, and more.

Secured form. No spam.
By completing this form, you consent to our Privacy Policy.