Up to 16 channels (8 channel bidirectional); 112 Gbps PAM4 per lane
Low 6.5 mm profile with a 2-piece contact system
Designed to withstand high shock and vibration
Features a low center of gravity for a stable connection to the board
Optically pluggable for easy field replacement
Protocol agnostic
Supports data center, HPC and FPGA Protocols, including 10/40/100 GbE Ethernet, InfiniBand™, Fibre Channel, PCIe®, CXL® and Aurora
Variety of heat sink options for conduction, convection, cold plates or liquid cooling thermal relief
Rugged surface mount connector with integrated locking latch mechanism simplifies mating/unmating of the cable assembly
Halo™ optical, copper and active copper systems are interchangeable using the same high-performance surface mount connector
IN DEVELOPMENT - Designed for next gen embedded applications demanding 56/112 Gbps PAM4 performance in low profile and ruggedized form factors.
