HALO-C IN DEVELOPMENT - Halo® Next Gen Mid-Board Optical Transceivers

Features

  • Designed for next gen embedded applications

  • 56 Gbps PAM4 performance per lane; 112 Gbps PAM4 per lane in development

  • 16 channels (x8 bidirectional)

  • Low 6.35 mm profile for space savings

  • Features a low center of gravity for a stable connection to the board

  • Optically pluggable for easy field replacement

  • Variety of heat sink options for conduction, convection, cold plates or liquid cooling thermal relief

  • Interchangeable with Halo Cu™ next gen copper cable assembly using the same high-performance socket connector

  • Rugged surface mount connector with integrated locking latch mechanism simplifies mating/unmating of the cable assembly

  • Contact [email protected] for more information

  • Samtec Halo® optical transceiver kits and Halo Cu™ copper cables are not affiliated with HALO® front panel or other products sold by Halo Electronics (www.haloelectronics.com)

IN DEVELOPMENT - Halo® Next Gen Mid-Board Optical Transceivers
Add to Cart
Mates and Related Components

Related Components

Halo Cu™ Copper Mid-Board Cable System
HALO-PE

Halo Cu™ Copper Mid-Board Cable System

Mating Connectors

halo high density socket
HLF6

Halo® Rugged, High-Density Socket

Compliance
Compliance Tools
Material Declaration
EU RoHS and REACH Compliance

For assistance with Compliance, please contact [email protected].
What is Risk Mitigation?