HDAF - 2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Socket

Features

  • HD Mezz is a trademark of Molex Incorporated

  • Up to 299 I/Os

  • Solder charge termination for ease of processing

  • Intermateable with Molex HD Mezz Arrays

  • Integrated guide posts to minimize contact damage when mating and unmating

  • 2.00 mm x 1.20 mm pitch

  • Open pin field design

  • Application specific capability to build any height from 20 mm to 35 mm

  • Performance: Up to 9 GHz / 18 Gbps

  • Current rating: 1.8 A max

  • Voltage rating: 230 VAC/325 VDC max

2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Socket
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Mates and Related Components

Mating Connectors

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HDAM

2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal

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