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TPAF-M-H-0-S-2-TY 1.50 mm x 1.75 mm High-Speed Elevated Array Receptacle
This array receptacle is part of a three-piece elevated mezzanine system with a 35 mm standard stack height, which aids in system airflow. The 1.5 mm x 1.75 mm pitch receptacle features a low profile design, which keeps thermal mass low for reflow processing, and BGA solder ball technology. The three-piece system is available with choice of 50, 100 or 150 pairs as well as tools for installation and removal.
Features
BGA (solder ball) technology
Dual sourced by Hirose® IT5
Low profile keeps thermal mass low for reflow processing
Selective gold Plating
Up to 300 signals, 150 pairs
- 2D view may not be representative of the configured product. Please see 3D preview or CAD download for actual representation.
- Read our 3D Models Disclaimer.
- Please confirm configuration with the Series Print before final design in.
- For assistance with 3D Models, please contact [email protected].
- For 3D Models suitable for EM Field Solvers, please contact Samtec’s Signal Integrity Group.
| Packaging Notes |
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| Packaging Type: Tray (14 parts per package) |
This product complies with UL document number E111594
