MICROELECTRONICS

INTERCONNECT SOLUTIONS

Next generation microelectronics require increased performance and integration, advanced chip technology and miniaturization.

Samtec’s extensive microelectronics and high-speed interconnect expertise, along with our proven methods for package integration, miniaturization, wafer level processing and signal integrity optimization, enable us to provide a unique level of support for advanced microelectronics applications.

The PCI-SIG Developers Conference is a free event for the 800+ member companies that develop and bring to market new products utilizing PCI Express® technology. Granted most people reading this blog won’t be at the conference, but you might be interested in learning more about Sa...
In the first article of this series, we looked at how contacts are formed. This time, we’ll investigate the next step in the manufacturing process – plating. Have you ever looked closely at an electrical contact?  Contacts may be small and hard to see, but they are the most impor...
In May of 2019, we spent the majority of our time working on a few larger applications that are due to release soon, several minor maintenance tasks, and a few front-end enhancements. Here were the major updates to Samtec.com for May 2019. User Experience Updates to Family Pages ...
One topic resonates across the Samtec blog: optics. Why? The Samtec FireFly™ Micro Flyover System™ is such a cool solution. The foundation is a simple but high-performing SMT two-piece connector set. It connects to both copper and optical cable assemblies. It can support 56 Gbps ...
Over the past few months, we’ve rolled out several upgrades to what we call our “family” pages on the website. These pages are one step before you begin configuring a product on the website, and are some of our most vital to getting web users to the correct product. We’re approac...