MICROELECTRONICS

INTERCONNECT SOLUTIONS

Next generation microelectronics require increased performance and integration, advanced chip technology and miniaturization.

Samtec’s extensive microelectronics and high-speed interconnect expertise, along with our proven methods for package integration, miniaturization, wafer level processing and signal integrity optimization, enable us to provide a unique level of support for advanced microelectronics applications.

New Power Connector Options Increase Design and Performance Options Samtec’s EXTreme Ten60Power™ header and socket system (ET60T/ET60S Series) is available in both power/signal combinations and power only for increased design flexibility. A new 5-row signal option allows for up t...
Samtec receives daily requests from designers looking for customized solutions for application-specific interconnect needs. Samtec has turned the quick-turn prototype model from our Sudden Service® Advantage into a standard design methodology. Numerous customers were interested i...
We often take for granted the dual 12-megapixel camera collecting dust on the back of our smartphones or the fact that almost any building we enter has a sign reading “Smile, you’re on camera!”.  Cameras have gone from a mysterious “stealer of souls” to a technology we can’t seem...
Samtec will be introducing several new products at DesignCon 2018. All of these products are designed to increase data rates, increase system density, and shrink product footprints, so designers can meet their system signal integrity needs. NovaRay™ High Bandwidth, High Density A...
Wow. What a fun year for Samtec.com and the entire team behind it! In 2017, we streamlined your online sampling experience, brought you a way to view detailed information about any of our trillions of part numbers, built an entirely new on-site search, upgraded to Azure CDN and A...
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