MICROELECTRONICS

INTERCONNECT SOLUTIONS

Next generation microelectronics require increased performance and integration, advanced chip technology and miniaturization.

Samtec’s extensive microelectronics and high-speed interconnect expertise, along with our proven methods for package integration, miniaturization, wafer level processing and signal integrity optimization, enable us to provide a unique level of support for advanced microelectronics applications.

Samtec’s Jim Alexander and Pete Robinson recently spoke with Judy Warner on The EEcosystem. The conversation, recorded as a podcast, discusses how increasing frequencies and shrinking footprints impact RF connectors […] The post New RF Podcast: Emerging RF Interconnect Design Ch...
Good things come in pairs. Peanut butter and jelly, Batman and Robin, Thelma and Louise, turkey and dressing, Kirk and Spock, terminal and socket – just to name a few. […] The post A Good Pair: New Tech & Product Overview Guides appeared first on The Samtec Blog....
The global high-performance computing (HPC) ecosystem comes together each year at SuperComputing. SC22 offers data analysts and scientists, system architects, and design engineers the opportunity to learn, network, and explore the […] The post Samtec at SC22: New Products, Techn...
“A long time ago in a galaxy far, far away….” Consider this the only Easter egg of this blog. However, don’t tech bloggers love Star Wars, MCU or DCEU references? Where’s Black Adam? […] The post The Samtec Blog Celebrates Its 1000th Posting! appeared first on The Samtec Blog....
This month we fully launched our new checkout system, made some updates to our Picture Search, released a new industry standards page, and made some updates to how we use […] The post Here are the October 2022 Website Updates to Samtec.com appeared first on The Samtec Blog....