Solutions & Support for Next Gen System Demands


As data rate requirements approach and surpass 56 Gbps, developers are challenged with balancing increasing throughput, scalability and density demands with concerns such as power consumption, signal integrity, cost and time-to-market. Samtec helps address these challenges with industry-leading expertise in high-performance interconnect design, system optimization, and innovative strategies and technologies for the demands of next generation data transmission.


High-Speed
Interconnect
Expertise


High-Performance
SI Characterization
Testing & Validation


online
design tools
& resources

samtec technology centers

High-Performance System Design & Support from Silicon-to-Silicon™


SIGNAL INTEGRITY GROUP AND SAMTEC TERASPEED CONSULTING

Full channel signal and power integrity analysis, testing and validation services
sig@samtec.com

SAMTEC OPTICAL GROUP

R&D, design, development and support of micro optical engines and assemblies
optics@samtec.com

Advanced
Interconnect Design

High precision stamping, plating, molding and automated assembly
asg@samtec.com

Samtec microelectronics group

Glass Core Technology (GCT), next gen 2.5D / 3D solutions, advanced IC packaging and assembly
sme@samtec.com

HIGH–SPEED CABLE GROUP

In-house R&D and manufacturing of precision extruded cable and assemblies
hdr@samtec.com

PRECISION RF GROUP

RF interconnect design and development expertise, with testing to 65 GHz
rftechnicalgroup@samtec.com

Characterization & development

Samtec Development Boards and SI Characterization Kits help simplify the design process and reduce time to market. Kits are available for many of our high-performance connector sets and standard high-speed cable assembly configurations; customized kits are also available for application specific evaluation.


Samtec SI Characterization Kits are currently available for the following products; additional kits are also in development. Contact kitsandboards@samtec.com for the most current list, or to discuss your evaluation requirements.

  • ExaMAX® High-Speed Backplane Connectors
  • Flyover™ QSFP28 Double-Density
  • Flyover™ QSFP28
  • AcceleRate® Cable
  • NovaRay™ Extreme Density Arrays
  • High-Speed Micro Edge Card Connectors
  • LP Array™ Low-Profile Arrays
  • Z-Ray® Low-Profile Interposers

Visit samtec.com/kits for more information.

Any engineer who has designed an IC-based solution likely used some sort of HW development tool. Semiconductor manufacturers have a long history of providing engineers with the HW tools needed to test their silicon. Evaluation platforms, like the Xilinx® Zynq UltraScale+ RFSoC ZC...
Samtec offers one of the industry’s largest and most flexible lines of two-piece, pin-and-socket board-stacking interconnects. To say it another way, we have more ways to stack two or more boards together than any other connector company.  Also, you can specify a custom stack hei...
EDI CON USA brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, product demonstrations, training, and learning opportunities. And as you have probably already guessed, Samtec will be attending EDI CON.  We will be...
In September, we spent some time focusing on our checkout process, continued to improve our industry standards experience, and released a few new content pages. We also rolled out the first version of our new Samtec Cares website. More on these and the rest of the major updates t...
As with many things, nothing stays the same; especially in the world of technology.  Samtec continues to improve and refine its offerings with Glass Core Technology (GCT), and with that there is also a need to update the materials surrounding it. Tell me more Through Glass Vias (...
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