System Optimization

Silicon-to-Silicon™ System Optimization capabilities assist designers in optimizing the high-speed serial path from bare die, to IC package and assembly, to PCB, to connectors and cable assemblies, and back again. These capabilities include:

  • Assisting IC layout designers to optimize power and signal integrity of the bare die during the IC design process
  • Developing complex, customized IC packaging and assembly solutions enabling maximum IC density, precision and ruggedness
  • Enabling PCB designers to create denser, faster PCBs by providing factory and field-based technical support to ensure signal chain optimization
  • Providing the products, tools, design expertise and consulting services to link high-speed signal chains between PCBs and through backplanes
  • Engineer industry standard and customized copper and optical cable assemblies at data rates up to 28Gbps and beyond
  • IC Packaging
  • Advanced package design and assembly capabilities along with the ability to assist in choosing the best technology and materials for an application, helping to save valuable design and engineering time.

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  • Mid-Board & Panel Optics
  • Patented signal integrity-optimized optical systems designed to ensure maximum density at minimum cost, while offering a path to 56 Gbps.

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    + Panel Optics

  • High-Speed Backplane
  • High-performance backplane systems designed to optimize density and minimize board layer count, while offering an easy migration path to 56 Gbps performance.

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    Backplane

  • Twinax Flyover
  • Ultra high-performance cable systems engineered to extend signal reach and performance by routing high-speed signals via ultra low skew twinax cable rather than through the PCB.

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  • High-Speed Mezzanine
  • High-density, low profile systems designed to optimize signal integrity in high-performance board-to-board, IC-to-board and cable-to-board applications.

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    Mezzanine

The North American Broadcast Show, or NAB, is April 22-27 at the Las Vegas Convention Center.  NAB is about everything digital in the fields of media, entertainment, and technology. Samtec is exhibiting its line of 12G SDI RF interconnects, including a product demonstration showi...
Shielded Connectors For EMI, EMC Protection Samtec is expanding its line of rugged, high-speed 0.80 mm pitch Edge Rate® interconnects. First is a mating set with both socket (ERF8 Series) and terminal (ERM8 Series) strips that are fully shielded. The shield encircles the entire m...
Consumers just want more HD video everywhere they go. The migration from 4G to 5G enables live streaming video consumption everywhere the wireless network reaches. Faster bandwidths via cable or fiber to the home provide the pipe to support the 4K/UHDTV products that are common o...
Kevin Burt, of the Samtec Optical Group, explains another one of the several demos that Samtec presented at OFC 2017.  In this demo, four GT 28 Gbps transceiver signals are generated by an FPGA and launched mid-board from a FireFly™ 28 G x4 optical connector system. These 28 Gbps...
Our friend Eric Bogatin wrote a paper for DesignCon 2017 entitled “New Characterization Technique for Glass-Weave Skew.”  He wrote a summary article of the paper in Signal Integrity Journal. Since many of our readers strive to optimize their signal transmission path, I thought it...
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