System Optimization

Silicon-to-Silicon™ System Optimization capabilities assist designers in optimizing the high-speed serial path from bare die, to IC package and assembly, to PCB, to connectors and cable assemblies, and back again. These capabilities include:

  • Assisting IC layout designers to optimize power and signal integrity of the bare die during the IC design process
  • Developing complex, customized IC packaging and assembly solutions enabling maximum IC density, precision and ruggedness
  • Enabling PCB designers to create denser, faster PCBs by providing factory and field-based technical support to ensure signal chain optimization
  • Providing the products, tools, design expertise and consulting services to link high-speed signal chains between PCBs and through backplanes
  • Engineer industry standard and customized copper and optical cable assemblies at data rates up to 28Gbps and beyond
  • IC Packaging
  • Advanced package design and assembly capabilities along with the ability to assist in choosing the best technology and materials for an application, helping to save valuable design and engineering time.

    Go to IC Packaging

  • Mid-Board & Panel Optics
  • Patented signal integrity-optimized optical systems designed to ensure maximum density at minimum cost, while offering a path to 56 Gbps.

    Go to Mid-Board
    + Panel Optics

  • High-Speed Backplane
  • High-performance backplane systems designed to optimize density and minimize board layer count, while offering an easy migration path to 56 Gbps performance.

    Go to High-Speed
    Backplane

  • Twinax Flyover
  • Ultra high-performance cable systems engineered to extend signal reach and performance by routing high-speed signals via ultra low skew twinax cable rather than through the PCB.

    Go to Twinax Flyover

  • High-Speed Mezzanine
  • High-density, low profile systems designed to optimize signal integrity in high-performance board-to-board, IC-to-board and cable-to-board applications.

    Go to High-Speed
    Mezzanine

Our friends at Connector Supplier keep the world up-to-date on everything in the connector universe.  They recently ran an article from Samtec entitled Rugged Industrial Interconnects:  The Design Behind The Description. Many industrial electronics OEM designers use the word “rug...
It seems FPGAs are getting bigger and faster all the time. FPGA vendors continue to integrate more transceivers running at higher speeds in their newest ICs.  As an example, the Xilinx Virtex UltraScale+ VU13P FPGA contains 128 GTY transceivers running data rates up to 32.75 Gbps...
Every year Samtec releases a new catalog showcasing our full line of products. The latest F-217 Full Line Catalog features new products and technology that enable us to provide overall system optimization from Silicon-to-Silicon. The combination of Samtec’s ultra fast, ultra dens...
The growth in high-speed serial channel data rates has no end in sight.  28 Gbps design starts abound across the industry.  56 Gbps PAM-4 solutions are coming down the road, whether silicon, interconnect or high-speed copper and optical cables. On the optical front, the front-pan...
In last month’s update, we brought you an updated way to order your samples from our Solutionator parametric search tool. In February, we rolled that out on an even larger scale, with this feature being added to a new full-part technical specifications page experience (more about...
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