Solutions & Support for Next Gen System Demands


As data rate requirements approach and surpass 56 Gbps, developers are challenged with balancing increasing throughput, scalability and density demands with concerns such as power consumption, signal integrity, cost and time-to-market. Samtec helps address these challenges with industry-leading expertise in high-performance interconnect design, system optimization, and innovative strategies and technologies for the demands of next generation data transmission.


High-Speed
Interconnect
Expertise


High-Performance
SI Characterization
Testing & Validation


online
design tools
& resources

samtec technology centers

High-Performance System Design & Support from Silicon-to-Silicon™


SIGNAL INTEGRITY GROUP AND SAMTEC TERASPEED CONSULTING

Full channel signal and power integrity analysis, testing and validation services
sig@samtec.com

SAMTEC OPTICAL GROUP

R&D, design, development and support of micro optical engines and assemblies
optics@samtec.com

Advanced
Interconnect Design

High precision stamping, plating, molding and automated assembly
asg@samtec.com

Samtec microelectronics group

Glass Core Technology (GCT), next gen 2.5D / 3D solutions, advanced IC packaging and assembly
sme@samtec.com

HIGH–SPEED CABLE GROUP

In-house R&D and manufacturing of precision extruded cable and assemblies
hdr@samtec.com

PRECISION RF GROUP

RF interconnect design and development expertise, with testing to 65 GHz
rftechnicalgroup@samtec.com

Characterization & development

Samtec Development Boards and SI Characterization Kits help simplify the design process and reduce time to market. Kits are available for many of our high-performance connector sets and standard high-speed cable assembly configurations; customized kits are also available for application specific evaluation.


Samtec SI Characterization Kits are currently available for the following products; additional kits are also in development. Contact kitsandboards@samtec.com for the most current list, or to discuss your evaluation requirements.

  • ExaMAX® High-Speed Backplane Connectors
  • Flyover™ QSFP28 Double-Density
  • Flyover™ QSFP28
  • AcceleRate® Cable
  • NovaRay™ Extreme Density Arrays
  • High-Speed Micro Edge Card Connectors
  • LP Array™ Low-Profile Arrays
  • Z-Ray® Low-Profile Interposers

Visit samtec.com/kits for more information.

Embedded World 2019 is the conference for security in electronic systems, distributed intelligence, the Internet of Things / e-mobility, and energy efficiency. In other words, you are going to experience a wide range of embedded systems. It shouldn’t come as a surprise, since we ...
Samtec’s Active Product Demonstrator proves 56 Gbps PAM4 based systems are fully realizable today. It’s a state-of-the-art prototype combining high-performance interconnects from Samtec and bleeding edge Credo silicon. All interconnect and silicon shown are available. The Demonst...
“So, what really is 5G?” That may be a question some folks are asking themselves. Why? No one has really heard of any 5G applications yet. Right? Insert rolling eye emoji here. In case someone lives under a rock, “5G” refers to the next-gen cellular standard that will take over t...
Samtec’s complete line of discrete wire connectors and cable assemblies are used in a variety of applications, including industrial automation and industrial equipment (like power supplies, measurement devices, process controls and sensor systems), security, telecom, automation, ...
In this video from DesignCon 2019, Scott McMorrow walks us through a live demonstration showing how NovaRay® Cable assemblies offer extreme density while enabling 112 Gbps PAM4 performance. In combination with an ExaMAX® Backplane Cable assembly, the traditional backplane archite...