System Optimization

Silicon-to-Silicon™ System Optimization capabilities assist designers in optimizing the high-speed serial path from bare die, to IC package and assembly, to PCB, to connectors and cable assemblies, and back again. These capabilities include:

  • Assisting IC layout designers to optimize power and signal integrity of the bare die during the IC design process
  • Developing complex, customized IC packaging and assembly solutions enabling maximum IC density, precision and ruggedness
  • Enabling PCB designers to create denser, faster PCBs by providing factory and field-based technical support to ensure signal chain optimization
  • Providing the products, tools, design expertise and consulting services to link high-speed signal chains between PCBs and through backplanes
  • Engineer industry standard and customized copper and optical cable assemblies at data rates up to 28Gbps and beyond
  • IC Packaging
  • Advanced package design and assembly capabilities along with the ability to assist in choosing the best technology and materials for an application, helping to save valuable design and engineering time.

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  • Mid-Board & Panel Optics
  • Patented signal integrity-optimized optical systems designed to ensure maximum density at minimum cost, while offering a path to 56 Gbps.

    Go to Mid-Board
    + Panel Optics

  • High-Speed Backplane
  • High-performance backplane systems designed to optimize density and minimize board layer count, while offering an easy migration path to 56 Gbps performance.

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    Backplane

  • Twinax Flyover
  • Ultra high-performance cable systems engineered to extend signal reach and performance by routing high-speed signals via ultra low skew twinax cable rather than through the PCB.

    Go to Twinax Flyover

  • High-Speed Mezzanine
  • High-density, low profile systems designed to optimize signal integrity in high-performance board-to-board, IC-to-board and cable-to-board applications.

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    Mezzanine

Between overdue books, too many “Quiet Please” signs to count, and trying to navigate the Dewey Decimal System, going to the library is never much fun.  The same feeling is often true when searching for technical documentation before, during, or after the design process.  Scourin...
Steve “Groot” Groothuis, CTO of Samtec Microelectronics, recently presented “Biomedical Solutions: Successfully Integrating New Chips, Packages, and Modules” at BIOMEDevice in Boston. The presentation included an overview of: How Samtec microelectronics are incorporated into medi...
Chris Shelly, Samtec’s RF/SI Modeling Engineer, walks us through another 12G SDI product demonstration from NAB 2017. This demonstration showcases the Samtec BNC Edge Mount connector used in the Fidus® Gearbox+™ and the Phabrix® QX UHDTV 12G SDI generator/analyzer.  This demonstr...
Tinkerers, hobbyists, students and enthusiasts form the backbone of the tech-influenced DIY community known as the Maker Movement. Makers use various open-source electronic platforms as they develop interactive products ranging from robotics and drones to arts, crafts, and musica...
Many Samtec blogs discuss bleeding edge technologies, new products, or provide guidelines and tips on optimizing system performance. Having said that, our biggest selling product line is standard pitch (2.54, 2.00, 1.27 mm), two-piece board-to-board interconnects. These are not a...
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