System Optimization

Silicon-to-Silicon™ System Optimization capabilities assist designers in optimizing the high-speed serial path from bare die, to IC package and assembly, to PCB, to connectors and cable assemblies, and back again. These capabilities include:

  • Assisting IC layout designers to optimize power and signal integrity of the bare die during the IC design process
  • Developing complex, customized IC packaging and assembly solutions enabling maximum IC density, precision and ruggedness
  • Enabling PCB designers to create denser, faster PCBs by providing factory and field-based technical support to ensure signal chain optimization
  • Providing the products, tools, design expertise and consulting services to link high-speed signal chains between PCBs and through backplanes
  • Engineer industry standard and customized copper and optical cable assemblies at data rates up to 28Gbps and beyond
  • IC Packaging
  • Advanced package design and assembly capabilities along with the ability to assist in choosing the best technology and materials for an application, helping to save valuable design and engineering time.

    Go to IC Packaging

  • Mid-Board & Panel Optics
  • Patented signal integrity-optimized optical systems designed to ensure maximum density at minimum cost, while offering a path to 56 Gbps.

    Go to Mid-Board
    + Panel Optics

  • High-Speed Backplane
  • High-performance backplane systems designed to optimize density and minimize board layer count, while offering an easy migration path to 56 Gbps performance.

    Go to High-Speed
    Backplane

  • Twinax Flyover
  • Ultra high-performance cable systems engineered to extend signal reach and performance by routing high-speed signals via ultra low skew twinax cable rather than through the PCB.

    Go to Twinax Flyover

  • High-Speed Mezzanine
  • High-density, low profile systems designed to optimize signal integrity in high-performance board-to-board, IC-to-board and cable-to-board applications.

    Go to High-Speed
    Mezzanine

IC Packaging

Advanced package design and assembly capabilities along with the ability to assist in choosing the best technology and materials for an application, helping to save valuable design and engineering time.

Go to IC Packaging



Mid-Board & Panel Optics

Patented signal integrity-optimized optical systems designed to ensure maximum density at minimum cost, while offering a path to 56 Gbps.

Go to Mid-Board
+ Panel Optics



High-Speed Backplane

High-performance backplane systems designed to optimize density and minimize board layer count, while offering an easy migration path to 56 Gbps performance.

Go to High-Speed
Backplane



Twinax Flyover

Ultra high-performance cable systems engineered to extend signal reach and performance by routing high-speed signals via ultra low skew twinax cable rather than through the PCB.

Go to Twinax Flyover



High-Speed Mezzanine

High-density, low profile systems designed to optimize signal integrity in high-performance board-to-board, IC-to-board and cable-to-board applications.

Go to High-Speed
Mezzanine

Samtec receives daily requests from designers looking for customized solutions for application-specific interconnect needs. Samtec has turned the quick-turn prototype model from our Sudden Service® Advantage into a standard design methodology. Numerous customers were interested i...
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Samtec will be introducing several new products at DesignCon 2018. All of these products are designed to increase data rates, increase system density, and shrink product footprints, so designers can meet their system signal integrity needs. NovaRay™ High Bandwidth, High Density A...
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DesignCon 2018, which is a big deal for Samtec, is a few weeks away. Our high-speed technologies for Silicon-to-Silicon optimization will be on full display and our product experts will show new products that are just released, or will be released in 2018.  Our application engine...
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