As data rate requirements approach and surpass 56 Gbps, developers are challenged with balancing increasing throughput, scalability and density demands with concerns such as power consumption, signal integrity, cost and time-to-market. Samtec helps address these challenges with industry-leading expertise in high-performance interconnect design, system optimization, and innovative strategies and technologies for the demands of next generation data transmission.
Testing & Validation
Full channel signal and power integrity analysis, testing and validation services
R&D, design, development and support of micro optical engines and assemblies
High precision stamping, plating, molding and automated assembly
Glass Core Technology (GCT), next gen 2.5D / 3D solutions, advanced IC packaging and assembly
In-house R&D and manufacturing of precision extruded cable and assemblies
RF interconnect design and development expertise, with testing to 65 GHz
Samtec Development Boards and SI Characterization Kits help simplify the design process and reduce time to market. Kits are available for many of our high-performance connector sets and standard high-speed cable assembly configurations; customized kits are also available for application specific evaluation.
Samtec SI Characterization Kits are currently available for the following products; additional kits are also in development. Contact email@example.com for the most current list, or to discuss your evaluation requirements.
Visit samtec.com/kits for more information.