System Optimization

Silicon-to-Silicon™ System Optimization capabilities assist designers in optimizing the high-speed serial path from bare die, to IC package and assembly, to PCB, to connectors and cable assemblies, and back again. These capabilities include:

  • Assisting IC layout designers to optimize power and signal integrity of the bare die during the IC design process
  • Developing complex, customized IC packaging and assembly solutions enabling maximum IC density, precision and ruggedness
  • Enabling PCB designers to create denser, faster PCBs by providing factory and field-based technical support to ensure signal chain optimization
  • Providing the products, tools, design expertise and consulting services to link high-speed signal chains between PCBs and through backplanes
  • Engineer industry standard and customized copper and optical cable assemblies at data rates up to 28Gbps and beyond
  • IC Packaging
  • Advanced package design and assembly capabilities along with the ability to assist in choosing the best technology and materials for an application, helping to save valuable design and engineering time.

    Go to IC Packaging

  • Mid-Board & Panel Optics
  • Patented signal integrity-optimized optical systems designed to ensure maximum density at minimum cost, while offering a path to 56 Gbps.

    Go to Mid-Board
    + Panel Optics

  • High-Speed Backplane
  • High-performance backplane systems designed to optimize density and minimize board layer count, while offering an easy migration path to 56 Gbps performance.

    Go to High-Speed
    Backplane

  • Twinax Flyover
  • Ultra high-performance cable systems engineered to extend signal reach and performance by routing high-speed signals via ultra low skew twinax cable rather than through the PCB.

    Go to Twinax Flyover

  • High-Speed Mezzanine
  • High-density, low profile systems designed to optimize signal integrity in high-performance board-to-board, IC-to-board and cable-to-board applications.

    Go to High-Speed
    Mezzanine

IC Packaging

Advanced package design and assembly capabilities along with the ability to assist in choosing the best technology and materials for an application, helping to save valuable design and engineering time.

Go to IC Packaging



Mid-Board & Panel Optics

Patented signal integrity-optimized optical systems designed to ensure maximum density at minimum cost, while offering a path to 56 Gbps.

Go to Mid-Board
+ Panel Optics



High-Speed Backplane

High-performance backplane systems designed to optimize density and minimize board layer count, while offering an easy migration path to 56 Gbps performance.

Go to High-Speed
Backplane



Twinax Flyover

Ultra high-performance cable systems engineered to extend signal reach and performance by routing high-speed signals via ultra low skew twinax cable rather than through the PCB.

Go to Twinax Flyover



High-Speed Mezzanine

High-density, low profile systems designed to optimize signal integrity in high-performance board-to-board, IC-to-board and cable-to-board applications.

Go to High-Speed
Mezzanine

This time of year is typically set aside for preparation, and this year is no different. We spent November working on a couple of major upgrades to prepare for releases in 2018, one with the way we handle quotes in My Samtec, and the other with how we handle the checkout experien...
There are few words in an electrical engineer’s life that make them cringe more than EMI (Electromagnetic Interference).  From noise on the lines to crippling entire infrastructures, whether large or small, EMI presents a serious problem. As all active electrical systems emit ele...
As with any product development, ASIC designers aim to quicken time to market and reduce unnecessary design cycles. Designing full-custom ASICs comes with many benefits but leveraging the flexibility, configurability and high-performance of FPGAs has become a preferred method for...
The 28 Gbps Product Demonstrator is an active system that showcases a variety of Samtec interconnect products at 28 Gbps and beyond. The Demonstrator was up and running at SC17, and Anthony Fellbaum was there also, where he walked us through the demo. Real World 28 Gbps This demo...
Low latency. This simple two-word phrase drives entire industries solely focused on minimizing propagation, serialization, queuing, and processing delays in packet-switched networks. This is especially in HPC applications where high-throughput and low-latency are mandatory. Many ...
View Full Site