Solutions & Support for Next Gen System Demands


As data rate requirements approach and surpass 56 Gbps, developers are challenged with balancing increasing throughput, scalability and density demands with concerns such as power consumption, signal integrity, cost and time-to-market. Samtec helps address these challenges with industry-leading expertise in high-performance interconnect design, system optimization, and innovative strategies and technologies for the demands of next generation data transmission.


High-Speed
Interconnect
Expertise


High-Performance
SI Characterization
Testing & Validation


online
design tools
& resources

samtec technology centers

High-Performance System Design & Support from Silicon-to-Silicon™


SIGNAL INTEGRITY GROUP AND SAMTEC TERASPEED CONSULTING

Full channel signal and power integrity analysis, testing and validation services

SAMTEC OPTICAL GROUP

R&D, design, development and support of micro optical engines and assemblies

Advanced
Interconnect Design

High precision stamping, plating, molding and automated assembly

Samtec microelectronics group

Glass Core Technology (GCT), next gen 2.5D / 3D solutions, advanced IC packaging and assembly

HIGH–SPEED CABLE GROUP

In-house R&D and manufacturing of precision extruded cable and assemblies

PRECISION RF GROUP

RF interconnect design and development expertise, with testing to 65 GHz

Characterization & development

Samtec Development Boards and SI Characterization Kits help simplify the design process and reduce time to market. Kits are available for many of our high-performance connector sets and standard high-speed cable assembly configurations; customized kits are also available for application specific evaluation.


Samtec SI Characterization Kits are currently available for the following products; additional kits are also in development. Contact kitsandboards@samtec.com for the most current list, or to discuss your evaluation requirements.

  • ExaMAX® High-Speed Backplane Connectors
  • Flyover™ QSFP28 Double-Density
  • Flyover™ QSFP28
  • AcceleRate® Cable
  • NovaRay™ Extreme Density Arrays
  • High-Speed Micro Edge Card Connectors
  • LP Array™ Low-Profile Arrays
  • Z-Ray® Low-Profile Interposers

Visit samtec.com/kits for more information.

VITA 57.4 FMC+ Standard As an ANSI/VITA member, Samtec supports the release of the new ANSI/VITA 57.4-2018 FPGA Mezzanine Card Plus Standard. VITA 57.4, also referred to as FMC+, expands upon the I/O capabilities defined in ANSI/VITA 57.1 FMC by adding two new connectors that ena...
Companies proudly display it, and customers often require it. It can be a large undertaking to receive, but can help to streamline processes, maintain records, align goals, and avoid costly mistakes. We of course are talking about ISO 9001 certification. This quality standard hel...
In July we rolled out several new content updates to the website, as well as a brand new streamlined checkout experience. We also made some updates to the recently released FSE locator tool to make it far easier to find your local Samtec FSE. Here are the major web updates for Ju...
Chances are likely you have seen it, and even see it more than once per day. You can find their logo on just about every power cord of a consumer product alongside other standards, but what is UL testing and why do we need it? What is Underwriters Laboratories? Underwriters Labor...
Cobalt Digital is a US company that designs and manufactures electronic equipment for the HD & 4K television production and broadcast markets. I recently spoke with Jesse Foster, Cobalt Digital’s VP of Marketing and Strategy, about the company, their industry, and the design chal...
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