Technology Centers

Technology Centers

Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system. These complementary, cross-functional groups leverage their respective areas of expertise and experience to ensure complete system optimization - from Silicon-to-Silicon™.

Signal Integrity Group

Signal Integrity Group

The Signal Integrity Group (SIG) provides in-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Services include full-channel analysis, high-data rate simulations, application-specific design and development assistance, and advanced design support.

High-Speed Cable Plant

High-Speed Cable Plant

This Technology Center focuses on R&D and manufacturing of precision extruded micro coax and twinax cable used for high-speed, high-density cable assemblies, including 26-38 AWG, 50/75/85/100 Ω impedance, and systems rated at 28 Gbps and beyond.

Samtec Optical Group

Samtec Microelectronics Group

The Microelectronics Group brings a unique blend of signal integrity and advanced IC packaging expertise to provide full channel system support. This includes precision die attach, fine pitch and low profile wire bond, flip chip, underfill and stacked die, com- plete IC-to-Board design, support and manufacturing of IC packaging, substrates, micro high-density inter- posers, and micro optical engines.

Samtec Optical Group

Samtec Optical Group

The Samtec Optical Group is an engineering team dedicated to the design, development, and application support of high performance micro optical engines, active optical assemblies, and high-density ganged passive optical panel solutions.

Advanced Interconnect Design

Advanced Interconnect Design

The Samtec Advanced Interconnect Design Technology Center (AID) ensures your interconnect systems are designed for quality, design flexibility, ease-of-processing, and even supply chain risk minimization. The AID includes precision stamping, plating, molding, and automated assembly for high-speed, fine pitch, array, and micro-rugged interconnects.

Samtec Teraspeed Consulting

Samtec Teraspeed Consulting

From the early stages of the design process including package design, material selection and PCB routing, through in-depth analysis, modeling and simulation, with measurement validation services available to 67 GHz, Samtec Teraspeed Consulting services can help you optimize and validate your high-performance systems. Samtec Teraspeed Consulting

Embedded World 2019 is the conference for security in electronic systems, distributed intelligence, the Internet of Things / e-mobility, and energy efficiency. In other words, you are going to experience a wide range of embedded systems. It shouldn’t come as a surprise, since we ...
Samtec’s Active Product Demonstrator proves 56 Gbps PAM4 based systems are fully realizable today. It’s a state-of-the-art prototype combining high-performance interconnects from Samtec and bleeding edge Credo silicon. All interconnect and silicon shown are available. The Demonst...
“So, what really is 5G?” That may be a question some folks are asking themselves. Why? No one has really heard of any 5G applications yet. Right? Insert rolling eye emoji here. In case someone lives under a rock, “5G” refers to the next-gen cellular standard that will take over t...
Samtec’s complete line of discrete wire connectors and cable assemblies are used in a variety of applications, including industrial automation and industrial equipment (like power supplies, measurement devices, process controls and sensor systems), security, telecom, automation, ...
In this video from DesignCon 2019, Scott McMorrow walks us through a live demonstration showing how NovaRay® Cable assemblies offer extreme density while enabling 112 Gbps PAM4 performance. In combination with an ExaMAX® Backplane Cable assembly, the traditional backplane archite...