Technology Centers

Technology Centers

Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system. These complementary, cross-functional groups leverage their respective areas of expertise and experience to ensure complete system optimization - from Silicon-to-Silicon™.

Signal Integrity Group

Signal Integrity Group

The Signal Integrity Group (SIG) provides in-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Services include full-channel analysis, high-data rate simulations, application-specific design and development assistance, and advanced design support.

High-Speed Cable Plant

High-Speed Cable Plant

This Technology Center focuses on R&D and manufacturing of precision extruded micro coax and twinax cable used for high-speed, high-density cable assemblies, including 26-38 AWG, 50/75/85/100 Ω impedance, and systems rated at 28 Gbps and beyond.

Samtec Optical Group

Samtec Microelectronics Group

The Microelectronics Group brings a unique blend of signal integrity and advanced IC packaging expertise to provide full channel system support. This includes precision die attach, fine pitch and low profile wire bond, flip chip, underfill and stacked die, com- plete IC-to-Board design, support and manufacturing of IC packaging, substrates, micro high-density inter- posers, and micro optical engines.

Samtec Optical Group

Samtec Optical Group

The Samtec Optical Group is an engineering team dedicated to the design, development, and application support of high performance micro optical engines, active optical assemblies, and high-density ganged passive optical panel solutions.

Advanced Interconnect Design

Advanced Interconnect Design

The Samtec Advanced Interconnect Design Technology Center (AID) ensures your interconnect systems are designed for quality, design flexibility, ease-of-processing, and even supply chain risk minimization. The AID includes precision stamping, plating, molding, and automated assembly for high-speed, fine pitch, array, and micro-rugged interconnects.

Samtec Teraspeed Consulting

Samtec Teraspeed Consulting

From the early stages of the design process including package design, material selection and PCB routing, through in-depth analysis, modeling and simulation, with measurement validation services available to 67 GHz, Samtec Teraspeed Consulting services can help you optimize and validate your high-performance systems. teraspeed.com

With now well over 100 videos that are featured in various places in Samtec.com, and the recent release of our Video Search capability, it became evident that we needed an updated central location to house all of these videos for users that wanted to easily browse all of our vide...
Regular readers of the Samtec blog are keenly aware of VITA 57 FMC and FMC+ solutions Samtec offers. For more than 10 years, this standard has defined the interface between FPGAs and various expansion modules in a growing number of applications. As FMC/FMC+ leverages open platfor...
Credo and Samtec teamed-up to to show an impressive 112 Gbps PAM4 long-reach cable demonstration at DesignCon 2018. In this video, Samtec’s Ralph Page and Credo’s Alex Narazi walk us through the demo and the results achieved. Signal Path Three ports of 112 Gbps PAM4 data are sour...
January 2018 was a heck of a month for Samtec.com! We had been developing several significant pieces of software and content in late 2017, and it seems like almost all of them were released in January. Here are the major updates to Samtec for January 2018. New Streamlined Checkou...
DesignCon 2018 has passed.  For those involved from the high-speed communications and semiconductor communities, everyone needs time to catch their breath a bit before planning for the rest of 2018. Why? DesignCon always offers exposure to the latest state-of-the-art design metho...
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