Technology Centers

Technology Centers

Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system. These complementary, cross-functional groups leverage their respective areas of expertise and experience to ensure complete system optimization - from Silicon-to-Silicon™.

Signal Integrity Group

Signal Integrity Group

The Signal Integrity Group (SIG) provides in-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Services include full-channel analysis, high-data rate simulations, application-specific design and development assistance, and advanced design support.

High-Speed Cable Plant

High-Speed Cable Plant

This Technology Center focuses on R&D and manufacturing of precision extruded micro coax and twinax cable used for high-speed, high-density cable assemblies, including 26-38 AWG, 50/75/85/100 Ω impedance, and systems rated at 28 Gbps and beyond.

Samtec Optical Group

Samtec Microelectronics Group

The Microelectronics Group brings a unique blend of signal integrity and advanced IC packaging expertise to provide full channel system support. This includes precision die attach, fine pitch and low profile wire bond, flip chip, underfill and stacked die, com- plete IC-to-Board design, support and manufacturing of IC packaging, substrates, micro high-density inter- posers, and micro optical engines.

Samtec Optical Group

Samtec Optical Group

The Samtec Optical Group is an engineering team dedicated to the design, development, and application support of high performance micro optical engines, active optical assemblies, and high-density ganged passive optical panel solutions.

Advanced Interconnect Design

Advanced Interconnect Design

The Samtec Advanced Interconnect Design Technology Center (AID) ensures your interconnect systems are designed for quality, design flexibility, ease-of-processing, and even supply chain risk minimization. The AID includes precision stamping, plating, molding, and automated assembly for high-speed, fine pitch, array, and micro-rugged interconnects.

Teraspeed Consulting

Teraspeed Consulting

Teraspeed® Consulting offers Tier 1 level signal integrity expertise and capabilities delivered directly to your engineering team. This includes complete system design, full channel signal and power integrity analysis and modeling, thermal management, in-depth signal integrity training, and signal integrity optimized advanced IC packaging for 28 Gbps and beyond.
teraspeed.com

Steve “Groot” Groothuis, CTO of Samtec Microelectronics, recently presented “Biomedical Solutions: Successfully Integrating New Chips, Packages, and Modules” at BIOMEDevice in Boston. The presentation included an overview of: How Samtec microelectronics are incorporated into medi...
Chris Shelly, Samtec’s RF/SI Modeling Engineer, walks us through another 12G SDI product demonstration from NAB 2017. This demonstration showcases the Samtec BNC Edge Mount connector used in the Fidus® Gearbox+™ and the Phabrix® QX UHDTV 12G SDI generator/analyzer.  This demonstr...
Tinkerers, hobbyists, students and enthusiasts form the backbone of the tech-influenced DIY community known as the Maker Movement. Makers use various open-source electronic platforms as they develop interactive products ranging from robotics and drones to arts, crafts, and musica...
Many Samtec blogs discuss bleeding edge technologies, new products, or provide guidelines and tips on optimizing system performance. Having said that, our biggest selling product line is standard pitch (2.54, 2.00, 1.27 mm), two-piece board-to-board interconnects. These are not a...
Data. Data. Data. The world is full of data. As humans breathe, use smartphones, or have a meal, a digital trail of data is left behind. That data trail is highly lucrative for companies ranging from retail and high-tech to online advertising and social media. Why all the fuss on...
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