Technology Centers

Technology Centers

Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system. These complementary, cross-functional groups leverage their respective areas of expertise and experience to ensure complete system optimization - from Silicon-to-Silicon™.

Signal Integrity Group

Signal Integrity Group

The Signal Integrity Group (SIG) provides in-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Services include full-channel analysis, high-data rate simulations, application-specific design and development assistance, and advanced design support.

High-Speed Cable Plant

High-Speed Cable Plant

This Technology Center focuses on R&D and manufacturing of precision extruded micro coax and twinax cable used for high-speed, high-density cable assemblies, including 26-38 AWG, 50/75/85/100 Ω impedance, and systems rated at 28 Gbps and beyond.

Samtec Optical Group

Samtec Microelectronics Group

The Microelectronics Group brings a unique blend of signal integrity and advanced IC packaging expertise to provide full channel system support. This includes precision die attach, fine pitch and low profile wire bond, flip chip, underfill and stacked die, com- plete IC-to-Board design, support and manufacturing of IC packaging, substrates, micro high-density inter- posers, and micro optical engines.

Samtec Optical Group

Samtec Optical Group

The Samtec Optical Group is an engineering team dedicated to the design, development, and application support of high performance micro optical engines, active optical assemblies, and high-density ganged passive optical panel solutions.

Advanced Interconnect Design

Advanced Interconnect Design

The Samtec Advanced Interconnect Design Technology Center (AID) ensures your interconnect systems are designed for quality, design flexibility, ease-of-processing, and even supply chain risk minimization. The AID includes precision stamping, plating, molding, and automated assembly for high-speed, fine pitch, array, and micro-rugged interconnects.

Samtec Teraspeed Consulting

Samtec Teraspeed Consulting

From the early stages of the design process including package design, material selection and PCB routing, through in-depth analysis, modeling and simulation, with measurement validation services available to 67 GHz, Samtec Teraspeed Consulting services can help you optimize and validate your high-performance systems. Samtec Teraspeed Consulting

Data, data, data is everywhere. From streaming video to edge computing, system designers are challenged to meet the needs of the networks (and consumers). From servers and switches to networking equipment, OEMs developing next-gen devices with high performance communications face...
I want to believe. Not only could Eugene Victor Tooms hibernate for 30-year stints, but he could squeeze and elongate his body to pass through narrow openings. In the supernatural thriller The X-Files, Tooms managed to fit through elevator shafts, air vents, chimneys, and almost ...
One topic that garnered much interest at the Samtec booth at the International Microwave Symposium was a dynamic stress test of Samtec’s microwave cable. This demonstration proves that our low-loss, microwave cable withstands high flex cycles and still maintains signal integrity....
The PCI-SIG Developers Conference is a free event for the 800+ member companies that develop and bring to market new products utilizing PCI Express® technology. Granted most people reading this blog won’t be at the conference, but you might be interested in learning more about Sa...
In the first article of this series, we looked at how contacts are formed. This time, we’ll investigate the next step in the manufacturing process – plating. Have you ever looked closely at an electrical contact?  Contacts may be small and hard to see, but they are the most impor...