Technology Centers

Technology Centers

Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system. These complementary, cross-functional groups leverage their respective areas of expertise and experience to ensure complete system optimization - from Silicon-to-Silicon™.

Signal Integrity Group

Signal Integrity Group

The Signal Integrity Group (SIG) provides in-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Services include full-channel analysis, high-data rate simulations, application-specific design and development assistance, and advanced design support.

High-Speed Cable Plant

High-Speed Cable Plant

This Technology Center focuses on R&D and manufacturing of precision extruded micro coax and twinax cable used for high-speed, high-density cable assemblies, including 26-38 AWG, 50/75/85/100 Ω impedance, and systems rated at 28 Gbps and beyond.

Samtec Optical Group

Samtec Microelectronics Group

The Microelectronics Group brings a unique blend of signal integrity and advanced IC packaging expertise to provide full channel system support. This includes precision die attach, fine pitch and low profile wire bond, flip chip, underfill and stacked die, com- plete IC-to-Board design, support and manufacturing of IC packaging, substrates, micro high-density inter- posers, and micro optical engines.

Samtec Optical Group

Samtec Optical Group

The Samtec Optical Group is an engineering team dedicated to the design, development, and application support of high performance micro optical engines, active optical assemblies, and high-density ganged passive optical panel solutions.

Advanced Interconnect Design

Advanced Interconnect Design

The Samtec Advanced Interconnect Design Technology Center (AID) ensures your interconnect systems are designed for quality, design flexibility, ease-of-processing, and even supply chain risk minimization. The AID includes precision stamping, plating, molding, and automated assembly for high-speed, fine pitch, array, and micro-rugged interconnects.

Teraspeed Consulting

Teraspeed Consulting

Teraspeed® Consulting offers Tier 1 level signal integrity expertise and capabilities delivered directly to your engineering team. This includes complete system design, full channel signal and power integrity analysis and modeling, thermal management, in-depth signal integrity training, and signal integrity optimized advanced IC packaging for 28 Gbps and beyond.
teraspeed.com

Our friends at Connector Supplier keep the world up-to-date on everything in the connector universe.  They recently ran an article from Samtec entitled Rugged Industrial Interconnects:  The Design Behind The Description. Many industrial electronics OEM designers use the word “rug...
It seems FPGAs are getting bigger and faster all the time. FPGA vendors continue to integrate more transceivers running at higher speeds in their newest ICs.  As an example, the Xilinx Virtex UltraScale+ VU13P FPGA contains 128 GTY transceivers running data rates up to 32.75 Gbps...
Every year Samtec releases a new catalog showcasing our full line of products. The latest F-217 Full Line Catalog features new products and technology that enable us to provide overall system optimization from Silicon-to-Silicon. The combination of Samtec’s ultra fast, ultra dens...
The growth in high-speed serial channel data rates has no end in sight.  28 Gbps design starts abound across the industry.  56 Gbps PAM-4 solutions are coming down the road, whether silicon, interconnect or high-speed copper and optical cables. On the optical front, the front-pan...
In last month’s update, we brought you an updated way to order your samples from our Solutionator parametric search tool. In February, we rolled that out on an even larger scale, with this feature being added to a new full-part technical specifications page experience (more about...
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