Technology Centers

Technology Centers

Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system. These complementary, cross-functional groups leverage their respective areas of expertise and experience to ensure complete system optimization - from Silicon-to-Silicon™.

Signal Integrity Group

Signal Integrity Group

The Signal Integrity Group (SIG) provides in-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Services include full-channel analysis, high-data rate simulations, application-specific design and development assistance, and advanced design support.

High-Speed Cable Plant

High-Speed Cable Plant

This Technology Center focuses on R&D and manufacturing of precision extruded micro coax and twinax cable used for high-speed, high-density cable assemblies, including 26-38 AWG, 50/75/85/100 Ω impedance, and systems rated at 28 Gbps and beyond.

Samtec Optical Group

Samtec Microelectronics Group

The Microelectronics Group brings a unique blend of signal integrity and advanced IC packaging expertise to provide full channel system support. This includes precision die attach, fine pitch and low profile wire bond, flip chip, underfill and stacked die, com- plete IC-to-Board design, support and manufacturing of IC packaging, substrates, micro high-density inter- posers, and micro optical engines.

Samtec Optical Group

Samtec Optical Group

The Samtec Optical Group is an engineering team dedicated to the design, development, and application support of high performance micro optical engines, active optical assemblies, and high-density ganged passive optical panel solutions.

Advanced Interconnect Design

Advanced Interconnect Design

The Samtec Advanced Interconnect Design Technology Center (AID) ensures your interconnect systems are designed for quality, design flexibility, ease-of-processing, and even supply chain risk minimization. The AID includes precision stamping, plating, molding, and automated assembly for high-speed, fine pitch, array, and micro-rugged interconnects.

Samtec Teraspeed Consulting

Samtec Teraspeed Consulting

From the early stages of the design process including package design, material selection and PCB routing, through in-depth analysis, modeling and simulation, with measurement validation services available to 67 GHz, Samtec Teraspeed Consulting services can help you optimize and validate your high-performance systems. Samtec Teraspeed Consulting

In November, we continued our mobile updates to the website, released a couple of new content experiences, and made placing sample requests even easier. Read more below on these and the rest of the major updates to Samtec.com for November 2018. Continued Improvements to our Mobil...
A joint demonstration between Samtec and eSilicon — an eSilicon 7 nm 56 Gbps DSP SerDes over a Samtec 5 meter ExaMAX® backplane cable assembly — caught a lot of attention at SC18. The demo showed a true long-reach capability with a high-performance, flexible, easy-to-configure Se...
Over the past few years, Samtec has expanded its portfolio of Characterization and Development Kits. Engineers and designers demand the best tools for system prototyping. From concept and prototype to development and production, Samtec-designed Characterization and Development Ki...
That’s shocking! Insulation Resistance and Dielectric Withstanding Voltage are two of the qualification tests that Samtec performs in-house during part qualification testing. These tests will ensure that when a connector is used in environmental conditions at the rated working vo...
As corporations worldwide become more mobile-friendly to their workforce, the Internet needs to evolve to match. This has been a huge trend in the B2C space for the last decade, and is now quickly catching up to the B2B space. We’ve seen our mobile user base grow rapidly in the p...