Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system. These complementary, cross-functional groups leverage their respective areas of expertise and experience to ensure complete system optimization - from Silicon-to-Silicon™.
The Signal Integrity Group (SIG) provides in-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Services include full-channel analysis, high-data rate simulations, application-specific design and development assistance, and advanced design support.
This Technology Center focuses on R&D and manufacturing of precision extruded micro coax and twinax cable used for high-speed, high-density cable assemblies, including 26-38 AWG, 50/75/85/100 Ω impedance, and systems rated at 28 Gbps and beyond.
The Microelectronics Group brings a unique blend of signal integrity and advanced IC packaging expertise to provide full channel system support. This includes precision die attach, fine pitch and low profile wire bond, flip chip, underfill and stacked die, com- plete IC-to-Board design, support and manufacturing of IC packaging, substrates, micro high-density inter- posers, and micro optical engines.
The Samtec Optical Group is an engineering team dedicated to the design, development, and application support of high performance micro optical engines, active optical assemblies, and high-density ganged passive optical panel solutions.
The Samtec Advanced Interconnect Design Technology Center (AID) ensures your interconnect systems are designed for quality, design flexibility, ease-of-processing, and even supply chain risk minimization. The AID includes precision stamping, plating, molding, and automated assembly for high-speed, fine pitch, array, and micro-rugged interconnects.
Samtec Teraspeed Consulting offers Tier 1 level signal integrity expertise and capabilities delivered directly to your engineering team. This includes complete system design, full channel signal and power integrity analysis and modeling, thermal management, in-depth signal integrity training, and signal integrity optimized advanced IC packaging for 28 Gbps and beyond.