Technology Centers

Technology Centers

Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system. These complementary, cross-functional groups leverage their respective areas of expertise and experience to ensure complete system optimization - from Silicon-to-Silicon™.

Signal Integrity Group

Signal Integrity Group

The Signal Integrity Group (SIG) provides in-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Services include full-channel analysis, high-data rate simulations, application-specific design and development assistance, and advanced design support.

High-Speed Cable Plant

High-Speed Cable Plant

This Technology Center focuses on R&D and manufacturing of precision extruded micro coax and twinax cable used for high-speed, high-density cable assemblies, including 26-38 AWG, 50/75/85/100 Ω impedance, and systems rated at 28 Gbps and beyond.

Samtec Optical Group

Samtec Microelectronics Group

The Microelectronics Group brings a unique blend of signal integrity and advanced IC packaging expertise to provide full channel system support. This includes precision die attach, fine pitch and low profile wire bond, flip chip, underfill and stacked die, com- plete IC-to-Board design, support and manufacturing of IC packaging, substrates, micro high-density inter- posers, and micro optical engines.

Samtec Optical Group

Samtec Optical Group

The Samtec Optical Group is an engineering team dedicated to the design, development, and application support of high performance micro optical engines, active optical assemblies, and high-density ganged passive optical panel solutions.

Advanced Interconnect Design

Advanced Interconnect Design

The Samtec Advanced Interconnect Design Technology Center (AID) ensures your interconnect systems are designed for quality, design flexibility, ease-of-processing, and even supply chain risk minimization. The AID includes precision stamping, plating, molding, and automated assembly for high-speed, fine pitch, array, and micro-rugged interconnects.

Teraspeed Consulting

Teraspeed Consulting

Teraspeed® Consulting offers Tier 1 level signal integrity expertise and capabilities delivered directly to your engineering team. This includes complete system design, full channel signal and power integrity analysis and modeling, thermal management, in-depth signal integrity training, and signal integrity optimized advanced IC packaging for 28 Gbps and beyond.
teraspeed.com

SEARAY™ is a family of high speed, high density connectors. SEARAY gives designers tons of design flexibility, much more than any other array product in the connector industry. DESIGN FLEXIBILITY SEARAY is on a 1.27 mm X 1.27 mm grid. This is an open pin field grid array, which m...
Samtec’s FFSD, FFMD Series are micro-pitch, high reliability, high cycle IDC cable assemblies. TIGER EYE™ CONTACT The connector systems incorporate the Tiger Eye™ contact. Tiger Eye is a rugged contact for micro pitch interconnects; it is ideal for high reliability and high matin...
In this short video, Steve Groothuis, Chief Technology Officer for Samtec Microelectronics, explains Glass Core Technology (GCT), why it matters in advanced substrate packaging, and the solutions it provides. GCT is a proprietary process that leverages the performance benefits of...
Since we released Samtec Solutionator 2.0, our updated parametric search tool, the most requested feature from users has been the ability to export the results of the data grid. We’re happy to announce that with our most recent update, you can now export up to 1,000 rows of data ...
Interconnects for the military/aerospace industry are used in a variety of applications, including communication and navigation equipment, radar, airborne, marine and space guidance control, and electronic warfare, to name a few. While Samtec products are used in commercial appli...
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