Technology Centers

Technology Centers

Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system. These complementary, cross-functional groups leverage their respective areas of expertise and experience to ensure complete system optimization - from Silicon-to-Silicon™.

Signal Integrity Group

Signal Integrity Group

The Signal Integrity Group (SIG) provides in-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Services include full-channel analysis, high-data rate simulations, application-specific design and development assistance, and advanced design support.

High-Speed Cable Plant

High-Speed Cable Plant

This Technology Center focuses on R&D and manufacturing of precision extruded micro coax and twinax cable used for high-speed, high-density cable assemblies, including 26-38 AWG, 50/75/85/100 Ω impedance, and systems rated at 28 Gbps and beyond.

Samtec Optical Group

Samtec Microelectronics Group

The Microelectronics Group brings a unique blend of signal integrity and advanced IC packaging expertise to provide full channel system support. This includes precision die attach, fine pitch and low profile wire bond, flip chip, underfill and stacked die, com- plete IC-to-Board design, support and manufacturing of IC packaging, substrates, micro high-density inter- posers, and micro optical engines.

Samtec Optical Group

Samtec Optical Group

The Samtec Optical Group is an engineering team dedicated to the design, development, and application support of high performance micro optical engines, active optical assemblies, and high-density ganged passive optical panel solutions.

Advanced Interconnect Design

Advanced Interconnect Design

The Samtec Advanced Interconnect Design Technology Center (AID) ensures your interconnect systems are designed for quality, design flexibility, ease-of-processing, and even supply chain risk minimization. The AID includes precision stamping, plating, molding, and automated assembly for high-speed, fine pitch, array, and micro-rugged interconnects.

Samtec Teraspeed Consulting

Samtec Teraspeed Consulting

From the early stages of the design process including package design, material selection and PCB routing, through in-depth analysis, modeling and simulation, with measurement validation services available to 67 GHz, Samtec Teraspeed Consulting services can help you optimize and validate your high-performance systems. teraspeed.com

Choosing the right plating is critical to the success of a connector system. Plating affects the connector’s performance, life cycle, quality, and cost. A recent blog explains that pins and plating are usually the main cost drivers in board-to-board connector systems. That blog f...
As consumers, no one ever complains that their wireless connectivity is “too fast”. Global wireless carriers and network providers continue to push the limits of 4G LTE, but a next-generation wireless standard – 5G New Radio (5G NR) – is on the horizon. 5G technology will be 100x...
Everyone loves a good book. From Shakespearean classics to more modern-day masterpieces, a solid story can leave a lasting impression. While the VITA family of standards isn’t necessarily a book, it does have a rich history with a large impact.  As we learned in a previous blog, ...
With our last web update, we brought you several new additions to our on-site search, a new Microelectronics web experience, and our new 2017 product overview guide. In September, the updates to search came to a close (for now), we’ve added a few new content pages, and we began w...
I’ll start this blog with two questions. First, what are the major costs to build a connector? Second, which of these are the bigger costs?  In other words, what is the most expensive part of a connector? (Quick aside: I can’t speak for all connector companies when it comes to co...
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