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Integration Leads to Innovation

Integration Leads to Innovation

Samtec Technology Centers Enable Complete System Optimization from Silicon-to-Silicon™

At Samtec, integration leads to innovation. Global collaboration between Technology Centers guides advanced technology development with a goal of bringing the most effective and innovative solutions to life. As bandwidth, scale and power requirements continue to challenge conventional engineering methods, we want to help optimize the landscape of your entire system – and develop solutions, together.

Integration Leads to Innovation

Samtec Technology Centers

system optimization sig

System Signal Integrity

Full channel signal and power integrity analysis, testing and validation services
sig@samtec.com
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system optimization sog

Optics

R&D, design, development and support of micro optical engines and assemblies
optics@samtec.com
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system optimization aid

Advanced
Interconnects

High precision stamping, plating, molding and automated assembly
asg@samtec.com
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system optimization sme

Microelectronics

Advanced IC packaging design, support and manufacturing capabilities
sme@samtec.com
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system optimization hsc1

High–Speed Cable

In-house R&D and manufacturing of precision extruded cable and assemblies
hdr@samtec.com
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system optimization rf

Precision RF

RF interconnect design and development expertise, with testing to 70 GHz
rftechnicalgroup@samtec.com
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True collaboration, without business units, drives our innovation for tomorrow’s solutions. R&D in new technologies and processes enable us to support the needs of next generation complex system demands.

Technology Leader, Samtec
While Samtec started as a connector company with a focus on two-piece, pin-and-socket board stacking systems, High-Speed Board Stacking connectors and High-Speed Cable Assemblies now make up a significant portion of our sales. To support development in this area, in December of 2...
In the manufacturing world there are standards for just about everything, and they all are typically there to ensure a product can perform as expected for the end application. Among these standards is IPC-A-610 covering solder joints for varying types of connector termination sty...
New Year’s resolutions. Many of us make them, whether it’s to continue a good habit, change a bad one or accomplish a new goal, improvement is the focus. The hardest part of this process is the time between making the plan and accomplishing it. Wouldn’t it be nice if we could jus...
2019 was a fun year for Samtec.com. We’re in a great place right now where we get to maintain current content and features while we’re building a lot of new stuff as well. The website is becoming more mature, but still developing rapidly. If you missed it, here is a look back at ...
While air cooling is still a commonly used method to cool data centers, the industry is seeing HPC, AI, and scientific computing market leaders investigating either conduction cooling, or full-scale immersion cooling, for their next generation designs. In this video from SuperCom...