The development of COM-HPC® exceeds the demand for high-speed performance in embedded computers. COM-HPC®, expected to be ratified in early 2021, coexists with the COM Express® specification, but provides the scalability and enhanced performance for next-gen embedded system design.
COM-HPC® supports two different module types. COM-HPC® server modules are targeted for edge server applications. COM-HPC® client modules support robust embedded computing.
COM-HPC® provides access to more system memory (up to 1 TB RAM) and system flexibility for various compute engines like GPGPUs, FPGAs and DSPs.
COM-HPC® Client | COM-HPC® Server |
---|---|
49x PCIe | 65x PCIe |
2x MIPI-CSI | |
2x 25GbE KR | 8x 25GbE KR |
3x DDI | |
2x BaseT (up to 10 Gb) | |
2x SoundWire, I2S | BaseT (up to 10 Gb) |
4x USB4 | 2x USB4 |
2x USB3.2 | |
4x USB2.0 | 4x USB2.0 |
2x SATA | 2x SATA |
eSPI, 2x SPI, SMB | eSPI, 2x SPI, SMB |
2x I2C, 2x UART | 2x I2C, 2x UART |
12x GPIO | 12x GPIO |
COM-HPC® provides system and interface flexibility by adopting a pair of 400 pin connectors (800 pins total) based on Samtec's AcceleRate® HP High-Performance Arrays. Samtec COM-HPC®-aligned connectors support existing and future interfaces such as PCIe® 5.0 (32 Gbps) and up to 100 Gb Ethernet.
The female Module Receptables are employed at a standard height. The male Carrier Plugs vary to allow for either a 5 mm or 10 mm stack height.
Depending on the application, the connector pinouts are optimized for Client or Server module as defined in the COM-HPC® specification.
5 mm Stack | 10 mm Stack |
---|---|
Module Receptacle (ASP-209946-01) | Module Receptacle (ASP-209946-01) |
Carrier Plug (ASP-214802-01) | Carrier Plug (ASP-209948-01) |
For questions regarding the COM-HPC® Standard and additional information, please contact us at:
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