The development of COM-HPC® exceeds the demand for high-speed performance in embedded computers. COM-HPC®, expected to be ratified in early 2021, coexists with the COM Express® specification, but provides the scalability and enhanced performance for next-gen embedded system design.
COM-HPC® supports two different module types. COM-HPC® server modules are targeted for edge server applications. COM-HPC® client modules support robust embedded computing.
COM-HPC® provides access to more system memory (up to 1 TB RAM) and system flexibility for various compute engines like GPGPUs, FPGAs and DSPs.
|COM-HPC® Client||COM-HPC® Server|
|49x PCIe||65x PCIe|
|2x 25GbE KR||8x 25GbE KR|
|2x BaseT (up to 10 Gb)|
|2x SoundWire, I2S||BaseT (up to 10 Gb)|
|4x USB4||2x USB4|
|4x USB2.0||4x USB2.0|
|2x SATA||2x SATA|
|eSPI, 2x SPI, SMB||eSPI, 2x SPI, SMB|
|2x I2C, 2x UART||2x I2C, 2x UART|
|12x GPIO||12x GPIO|
COM-HPC® provides system and interface flexibility by adopting a pair of 400 pin connectors (800 pins total) based on Samtec's AcceleRate® HP High-Performance Arrays. Samtec COM-HPC®-aligned connectors support existing and future interfaces such as PCIe® 5.0 (32 GT/s) and up to 100 Gb Ethernet.
The female Module Receptables are employed at a standard height. The male Carrier Plugs vary to allow for either a 5 mm or 10 mm stack height.
Depending on the application, the connector pinouts are optimized for Client or Server module as defined in the COM-HPC® specification.
|5 mm Stack||10 mm Stack|
|Module Receptacle (ASP-209946-01)||Module Receptacle (ASP-209946-01)|
|Carrier Plug (ASP-214802-01)||Carrier Plug (ASP-209948-01)|