COM-HPC® Standard Products and Support

COM-HPC® Standard Products and Support

Overview

The development of COM-HPC® exceeds the demand for high-speed performance in embedded computers. COM-HPC®, expected to be ratified in early 2021, coexists with the COM Express® specification, but provides the scalability and enhanced performance for next-gen embedded system design.

COM-HPC® supports two different module types. COM-HPC® server modules are targeted for edge server applications. COM-HPC® client modules support robust embedded computing.

COM-HPC® provides access to more system memory (up to 1 TB RAM) and system flexibility for various compute engines like GPGPUs, FPGAs and DSPs.

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COM-HPC Brochure

COM-HPC® Interconnect Solutions

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COM-HPC® Logo
COM-HPC® Client COM-HPC® Server
49x PCIe 65x PCIe
2x MIPI-CSI
2x 25GbE KR 8x 25GbE KR
3x DDI
2x BaseT (up to 10 Gb)
2x SoundWire, I2S BaseT (up to 10 Gb)
4x USB4 2x USB4
2x USB3.2
4x USB2.0 4x USB2.0
2x SATA 2x SATA
eSPI, 2x SPI, SMB eSPI, 2x SPI, SMB
2x I2C, 2x UART 2x I2C, 2x UART
12x GPIO 12x GPIO

COM-HPC® CONNECTORS

COM-HPC® provides system and interface flexibility by adopting a pair of 400 pin connectors (800 pins total) based on Samtec's AcceleRate® HP High-Performance Arrays. Samtec COM-HPC®-aligned connectors support existing and future interfaces such as PCIe® 5.0 (32 Gbps) and up to 100 Gb Ethernet.

The female Module Receptables are employed at a standard height. The male Carrier Plugs vary to allow for either a 5 mm or 10 mm stack height.

Depending on the application, the connector pinouts are optimized for Client or Server module as defined in the COM-HPC® specification.

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Test Reports


COM-HPC® Standard

For questions regarding the COM-HPC® Standard and additional information, please contact us at:


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