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Application/Technical Notes

Date	Link	Created By
10/19	VITA 57.4 FMC+ Extender Application Note	Samtec
10/19	VITA 57.4 FMC+ Loopback Cards Application Note	Samtec
10/19	Mechanical Design of Micro Jack Screw Precision Board Stacking Standoff Application Note	Samtec
10/19	Mechanical Design of High Data Rate Cable Assembly for VITA 57.4 Application Note	Samtec
03/18	Thermal Design of QSFP-DD Cages and Heatsinks Application Note	Samtec
10/16	PCIE-RA Product Final Inch® Designs in PCI Express® Applications Generation 3 - 8.0 GT/s	Samtec
05/16	FireFly™ Optical Half Cables Application Note	Samtec
09/15	FQSFP Flyover® QSFP Technical Note Samtec	Samtec
05/15	PCIE-EM Product Final Inch® Designs in PCI Express® Applications Generation 3 - 8.0 GT/s	Samtec
01/15	PCI Express® - PCIEC-85 Jumper High Speed Designs in PCI Express® Applications Gen 3 - 8.0 GT/s	Samtec
12/14	Edge Rate® ERM8/ERF8 16 mm Stack Height High Speed Designs in PCI Express® Applications Gen 3 - 8.0 GT/s	Samtec
12/14	Edge Rate® - HSEC8-DV High Speed Edge Card Connector, Vertical High Speed Designs in PCI Express® Applications Gen 3 - 8.0 GT/s	Samtec
04/13	Q Strip® QTH/QSH 16 mm Stack Height High Speed Designs in PCI Express® Applications Gen 3 - 8.0 GT/s	Samtec
02/12	SEAM-RA/SEAF-RA Products Final Inch® Designs in PCI Express® Applications Generation 3 - 8.0 GT/s	Samtec Teraspeed Consulting

Papers

White Papers

Date	Link	Created By
11/22	Reflecting on Reflections: An Evaluation of New and Standardized Metrics - DesignCon 2022	Samtec, Achronix, Intel
11/22	Impacts of Solder Reflow on High Bandwidth RF Connectors	Michael Griesi and Chris Shelly, Samtec
05/22	Wideband RF Launches: Much More Than Footprints on PCBs	Samtec
08/21	Hidden/Secrets of IBIS Sampling Specifications - DesignCon 2021	Achronix Semiconductor, Samtec, Keysight, IBIS Enthusiast
08/21	Impact of Power Plane Termination on System Noise - DesignCon 2021	Amazon, Cadence, Oracle, Samtec
08/21	Specification-based IBIS-AMI Model PCIe 5.0 32GT/s - DesignCon 2021	Keysight, Samtec, Achronix Semiconductor, IBIS Enthusiast
08/21	A Case Study in the Development of 112 Gbps PAM4 Silicon and Connector Test Platform - DesignCon 2021	Samtec, Alphawave
08/21	Design Case Study and Experimental Validation for a 100 Gb/s per Lane C2M Link Using Channel Operating Margin - DesignCon 2021	Keysight, University of L'Aquila, Samtec
06/21	System and Component Qualifications of VPX Solutions	Steven Searle-Spratt and Douglas Caldes, EIZO; Shane Dabrowski and John Riley, Samtec
01/21	Shaken Not Stirred! Vibration Testing Explained	David P. Scopelliti, Samtec
01/20	Current Distribution, Resistance, and Inductance in Power Connectors - DesignCon 2020	Samtec
01/20	Finding Reflective Insertion Loss Noise and Reflectionless Insertion Loss - DesignCon 2020	Achronix Semiconductor Corporation, Samtec, Intel Corporation
01/20	Validation of Achieving 100 Gb/s Signaling per Electrical Lane over 2 Meters of Passive Twinaxial Copper Cable - DesignCon 2020	MC Communications, Keysight, Cisco, UNH-IOL, Samtec
04/19	Creepage and Clearance	David P. Scopelliti, Samtec
05/18	Introducing Channel Performance Metric: A New Definition of Interconnect Signal Integrity Performance
01/18	Designing DC Blocking Capacitor Transitions to Enable 56 Gbps NRZ & 112 Gbps PAM4 - DesignCon 2018	Scotty Neally and Scott McMorrow, Samtec Teraspeed Consulting
01/17	Design of Flyover® QSFP (FQSFP) for 56+ Gbps Applications - DesignCon 2017	Missouri University of Science and Technology, Samtec, Xilinx
11/16	Effects of Lubrication on Connector Processing	Kevin Meredith
01/16	Microwave Interconnect Testing For 12G-SDI Applications - DesignCon 2016	Imagine, Keysight, Samtec
02/15	Optimizing Symmetry in Open Pin Field Designs - DesignCon 2015	Julian Ferry, Samtec
02/15	Causality Demystified - DesignCon 2015 (DesignCon15 Best Paper Award Finalist)	Stefaan Sercu, Samtec
02/15	Anisotropic Design Considerations for 28 Gbps Via to Stripline Transitions - DesignCon 2015	Scott McMorrow, Samtec Teraspeed Consulting
03/18	Calculating Mating and Unmating Forces for Samtec Connectors	Kevin Meredith
04/14	High I/O BGA Connector Solder Joint Integrity Investigation	Dave Hillman, Rockwell Collins
01/14	Simplified Pulse Current (Duty Cycle) Guidelines	David P. Scopelliti, Samtec
04/13	The Pain of Fretting Corrosion	David P. Scopelliti, Samtec
04/13	Galvanic (Electrolytic) Corrosion	David P. Scopelliti, Samtec
02/13	Advances in Onboard Optical Interconnects: A New Generation of Miniature Optical Engines - DesignCon 2013	Marc Verdiell, Samtec Optical Group
02/12	Connector Models - Are they any good? - DesignCon 2012	Samtec
02/12	Comprehensive Analysis of Flexible Circuit Materials Performance in Frequency and Time Domains - DesignCon 2012	Samtec & Dupont
10/07	Power and Voltage Rating	David P. Scopelliti, Samtec

Articles

Document Type	Date	Link	Created By
	10/15	Strike Up The Bandwidth!	Scott McMorrow, Samtec Teraspeed Consulting

FAQs

Document Type	Date	Link	Created By
	02/15	FireFly™ Frequently Asked Questions

gEEk spEEk Webinars

Document Type	Date	Link
	02/23	SI/PI AM(A)A - A Conversation with Scott McMorrow
	01/23	DesignCon 2023 Preview
	12/22	Impacts of Solder Reflow on High Bandwidth RF Connectors
	10/22	Precision RF Connector PCB Launches for 224 Gbps Devices
	08/22	Cascaded or End-to-End Interconnect Models
	06/22	Reverberation Cavities for I/O Connector EMI Performance
	04/22	Mitigating the Effect of Connector Mating & Normal Forces in Signal Integrity
	02/22	Single Ended Analysis in a Differential World
	12/21	Pros & Cons of Thin Laminates in Power Distribution
	11/21	In PDN, Loss May Be Your Friend But Inductance Is Your Enemy
	10/21	Advanced High Density Breakout Design and Crosstalk Mitigation Strategies
	09/21	Key Development Steps of 112 Gbps PAM4 Test Platforms
	08/21	How to Read the ESR Curve of Capacitors
	07/21	Common Mode Conundrums
	06/21	Advanced Test Fixture Design
	05/21	Causality Correction or No Causality Correction, That is the Question
	04/21	Successful PCIe® Interconnect Guidelines at 8, 16 and 32 GT/s
	03/21	Mechanics of Running COM
	02/21	Bending EM Tools to Your Will
	01/21	S and Z Parameters for PDN Measurements and Simulations
	12/20	Using Ferrites and Inductors in Power Distribution Networks
	11/20	Effective Return Loss - What is ERL and How is it Computed?
	10/20	XTLK Mitigation Strategies in 12G-SDI Systems
	10/20	Waveguides, Modes and Cutoff Frequencies
	09/20	Periodical Discontinuities
	09/20	Noise and Simulation Correlation
	08/20	High-Speed Connector SI Round-Up
	08/20	Trace Corner Bends
	07/20	Signal Power & Noise and SI
	07/20	Do You Know How Much Capacitance You Really Get? – Multi-Layer Capacitor (MLCC) Loss
	07/20	IEEE Channel Operating Margin (COM) for Channel Analysis
	06/20	Trace Design for Crosstalk Reduction
	06/20	Break Out Design by Inspection
	06/20	Impedance Corrected De-Embedding
	06/20	DC Block Capacitor Location - Does it Really Matter?
	05/20	Component Crosstalk Characterization by ICN
	05/20	Quantifying Glass Induced Skew on Printed Circuit Boards
	05/20	The Perils of Right-Angle Turns at DC
	05/20	Twinax Basics
	04/20	PCI Express: Is 85 Ohms Really Needed?

Videos

Connectors

Document Type	Link
	AcceleRate® HD Ultra-Dense Multi-Row Mezzanine Strips
	Edge Rate® Contact System
	EMI Shielding Demonstration
	ExaMAX® High-Speed Backplane
	Flexible Board Stacking Solutions
	High Speed Edge Card Sockets
	Jack Screw Standoffs Application
	MEC5 - Extreme Density, High-Speed Edge Card
	MEC5 Processing Recommendations
	Micro Rugged & Power Interconnect Solutions
	mPOWER^® Micro High-Power Interconnects
	NovaRay® 112 Gbps PAM4, Extreme Density Arrays
	PowerStrip™ High Power Systems
	Q Rate® - Signal Integrity Optimized Edge Rate® Contacts
	Q Series® Rugged High Speed Interconnects
	Razor Beam™ Ultra Low Profile Connectors
	SEARAY™ Right Angle High Density Arrays
	SEARAY™ High Density Arrays
	SkyRay™ High Speed Elevated Arrays
	XCede® HD High-Density Backplane Connector System
	Z-Ray® Ultra-Low Profile One-Piece Arrays

Cable Systems

Document Type	Link
	AccliMate™ Sealed Circular and Rectangular Cables
	FireFly™ Micro Flyover System™
	High Speed Copper I/O Systems
	High Speed High Density Copper I/O Systems
	High Reliability Tiger Eye™ Discrete Wire Contact System
	NovaRay® 112 Gbps PAM4, Extreme Density Arrays
	Samtec Discrete Wire Cable Assemblies
	Samtec Discrete Wire IDC System
	Twinax Flyover® Technology

RF Interconnects

Document Type	Link
	12G-SDI Optimized RF Systems
	Bulls Eye^® BQRA Product Installation
	HDBNC - Samtec High Density BNC Solutions
	IsoRate® Cable Assembly - Isolated Edge Rate® Contacts
	Precision RF
	Samtec SMP RF Solutions

Technology Centers

Document Type	Link
	Samtec Microelectronics Tech Center
	Glass Core Technology
	Samtec Optical Group Tech Center
	Samtec Cable Group Tech Center
	Advanced Interconnect Design Tech Center
	Samtec Signal Integrity Group & Samtec Teraspeed Consulting Tech Center
	Samtec Product Solutions

Demonstrations

Document Type	Link
	NAB 2017 - 12G-SDI Connectors Performance Demonstration
	OFC 2017 - Flyover® QSFP In Xilinx VCU118
	OFC 2017 - PCIe®-Over-Fiber with FireFly™
	DesignCon 2017 - Flyover® QSFP28 for 56 Gbps Applications
	DesignCon 2017 - BiFAST Duobinary Technology Through Samtec Z-Ray® at 56 Gbps
	DesignCon 2017 – Flyover® QSFP In Xilinx VCU 118 Demonstration Board
	DesignCon 2017 PCIe®-Over-Fiber FireFly™
	OFC 2016 - High Speed Signal Transfer Rates At 28 Gbps
	OFC 2016 - 14 Gbps Optical Link in FMC VITA 57.1 Form Factor for FPGA Applications

Presentations

Document Type	Link
	Autonomous Vehicles: Successfully Integrating New Chips, Packages, and Modules (Part 1)
	Autonomous Vehicles: Successfully Integrating New Chips, Packages, and Modules (Part 2)
	Mentor Graphics PCB Systems Forum - SerDes And Its Role in Future Designs
	Mentor Graphics PCB Systems Forum - DDR4 Design and Verification in Hyperlynx LINESIM/Boardsim
	BIOMEDevice 2017 - Glass Core Technology
	BIOMEDevice 2017 - Microelectronics in Medical Applications
	Isola Educational Series 2015 - PCB Materials for Terabit Backplanes Part 1
	Isola Educational Series 2015 - PCB Materials for Terabit Backplanes Part 2
	Electronica 2014 - PCB Material Selection for High-Speed Design HD
	Electronica 2014 - High Fidelity Signal Integrity Modeling

Additional Videos

Document Type	Link
	Cable Management
	Severe Environment Testing

Press Releases

Document Type	Date	Link
	03/17	Samtec FireFly™ Power/Control Connector Proposal Adopted by COBO
	03/17	QSFP-DD and FQSFP-DD: Not Your Brother’s Quad Small Form Factor Pluggable!
	12/16	Samtec AIMs for Advances in Silicon Photonics
	07/16	Samtec Ranked #1 in Bishop Customer Survey for 16th Time
	06/16	Samtec and Amphenol Sign License Agreement for Backplane Interconnect Products
	06/16	Samtec Announces Acquisition of nMode Solutions and Triton Microtechnologies
	04/16	Samtec to Open Chicago Design and Development Center
	10/15	Samtec and Amphenol® Aerospace Partner to Address the Growing Need for Rugged Optics
	05/15	Samtec, Global Provider of Interconnect Systems, Joins IRT Nanoelec Silicon Photonics Program
	03/14	Samtec, Inc. Announces Hirose as Second Source for FireFly™ Micro Flyover System™
	03/14	Hirose Announces Licensing Agreement with Samtec, Inc. for BF4 Active Optical Connectorv
	09/14	Samtec, Inc. Announces Acquisition of Samtec Teraspeed Consulting Group
	06/14	Q&A Samtec on Signal Integrity
	03/14	Samtec, Inc. and Pentek Partner to Incorporate FireFly™ Active Optical Flyover System™ Into VITA 65 Open VPX Standard
	03/14	Pentek OpenVPX board points the way to multi-Gbps optical backplanes using VITA 66.4 optical interconnect
	01/13	Samtec Announces Licensing Agreement with Hirose for IT3/IT5 Mezzanine Connector Systems
	05/12	Samtec Releases New Interconnect Solutions Catalog
	04/12	Samtec's New SI Fusion Approach Makes High Speed Integration Easier Than Ever!

Presentations

Date	Link	Created By
01/20	DesignCon 2020 - Current Distribution, Resistance, and Inductance in Power Connectors	Samtec
01/20	DesignCon 2020 - Finding Reflective Insertion Loss Noise and Reflectionless Insertion Loss	Achronix Semiconductor Corporation, Samtec, Intel Corporation
01/20	DesignCon 2020 - Panel - PCIe 32G & 64G: System Design & Test Challenges
01/18	DesignCon 2018 - Designing DC Blocking Capacitor Transitions to Enable 56 Gbps NRZ & 112 Gbps PAM4	Scotty Neally and Scott McMorrow, Samtec Teraspeed Consulting
01/18	DesignCon 2018 - Understanding Skin Effect and Dielectric Loss Material Effects on Digital Interconnects	Dr. Edward Sayre, Samtec
01/17	DesignCon 2017 - Design of Flyover® QSFP (FQSFP) for 56+ Gbps Applications	Missouri University of Science and Technology, Samtec, Xilinx
08/16	Autonomous Vehicles: Successfully Integrating New Chips, Packages & Modules	Steve Groothuis, Samtec Microelectronics
05/16	SerDes and Its Role In Future Designs	Rod Strange, Samtec Teraspeed Consulting
04/16	DDR4 Design and Verification In Hyperlynx LINESIM/Boardsim	Rod Strange, Samtec Teraspeed Consulting
02/16	DesignCon 2016 - A Material World, Modeling Dielectrics And Conductors For Interconnects Operating at 10-50 Gbps	Scott McMorrow, Samtec Teraspeed Consulting
02/16	DesignCon 2016 - Design Considerations For A Cost Optimized 28 G/56 G PAM4 Backplane	Scott McMorrow and Edward Sayre, Samtec Teraspeed Consulting
02/16	DesignCon 2016 - Optics Vs. Copper For In-Chassis Connections @ 56-112 Gbps: Is Copper Still A Viable Solution?	Avago, Cisco, Samtec, Tektronix
02/16	DesignCon 2016 - Microwave Interconnect Testing for 12G SDI Applications	Jim Nadolny, Samtec
02/13	DesignCon 2013 - Advances in Onboard Optical Interconnects: A New Generation of Miniature optical Engines	Marc Verdiell, Samtec Optical Group
04/12	Using ADS to post Process Simulated and Measured Models	Leon Wu
02/12	DesignCon 2012 - Connector Models - Are they any good?	Samtec
02/12	Comprehensive Analysis of Flexible Circuit Materials Performance in Frequency and Time Domains	Samtec & Dupont

Cable Data Sheets

Coax Cable

Document Type	Date	Link
	10/19	50 Ohm, 36 AWG Micro Coax Cable HT
	10/19	50 Ohm, 34 AWG Micro Coax Cable
	10/19	50 Ohm, 32 AWG Micro Coax Cable
	09/19	50 Ohm, 38 AWG Micro Coax Cable
	09/18	50 Ohm, 38 AWG Micro Coax Cable HT
	04/18	75 Ohm, 38 AWG Micro Coax Cable
	04/18	50 Ohm, 26 AWG Micro Coax Cable
	01/17	50 Ohm, 28 AWG Micro Coax Cable
	01/17	50 Ohm, 30 AWG Micro Coax Cable
	09/16	50 Ohm, 26 AWG Braid Micro Coax Cable HT

Twinax Cable

Document Type	Date	Link
	09/22	92 Ohm, 34 AWG Solid, CU Micro Thinax™ Cable HT
	05/22	95 Ohm, 30 AWG Micro Twinax Cable HT
	03/22	100 Ohm, 30 AWG CU Micro Twinax Cable HT
	12/21	100 Ohm, 28 AWG Solid, CU Micro Twinax Cable HT
	12/21	100 Ohm, 30 AWG Solid, CU Micro Twinax Cable HT
	09/21	85 Ohm, 34 AWG Solid, CU Micro Twinax Cable HT
	06/21	92 Ohm, 34 AWG Solid, CU Micro Twinax Cable HT
	01/20	100 Ohm, 30 AWG CU Micro Twinax Cable
	01/20	100 Ohm, 32 AWG Micro Twinax Cable
	01/20	100 Ohm, 34 AWG Micro Twinax Cable
	01/20	100 Ohm, 36 AWG Solid, Micro Twinax Cable
	07/18	100 Ohm, 26 AWG Micro Twinax Cable
	06/18	100 Ohm, 34 AWG Solid, CU Micro Twinax Cable HT
	06/18	85 Ohm, 30 AWG CU Micro Twinax Cable
	06/18	85 Ohm, 32 AWG Micro Twinax Cable

Power Cable

Document Type	Date	Link
	05/21	16 AWG Power Cable HT (300 V)
	05/21	16 AWG Power Cable HT (600 V)
	03/18	26 AWG Power Cable HT-THV
	03/18	30 AWG Power Cable HT-THV
	07/17	20 Ohm, 26 AWG Quiet Power Cable
	03/16	20 AWG Power Cable HT (TC)
	03/16	24 AWG Power Cable HT (TC)
	03/16	28 AWG Power Cable HT (TC)
	03/16	30 AWG Power Cable HT (TC)
	03/16	32 AWG Power Cable HT (TC)

IDC Cable

Document Type		Link
		30 AWG, 7/38 Stranded IDC Cable for a 1.27 mm Pitch Connector
		28 AWG, 7/36 Stranded IDC Cable for a 2.00 mm Pitch Connector
		28 AWG, 7/36 Stranded IDC Cable for a 2.54 mm Pitch Connector

RF Cable

Document Type	Date	Link
	11/22	V-Band Flexible Waveguide Cable
	04/18	100 Ohm, 28 AWG, Shielded Twisted Pair Cable
	09/17	50 Ohm, 23 AWG, Micro CU Coax Cable
	09/16	50 Ohm, 26 AWG Braid Micro Coax Cable HT
	03/16	50 Ohm, 25 AWG Micro Coax Cable
	11/15	50 Ohm, 23 AWG Micro Coax Cable