Samtec COM-HPC® Interconnects

The development of COM-HPC® exceeds the demand for high-speed performance in embedded computers, and provides scalability for next-gen embedded system designs. Samtec interconnects included in this standard offer 5 mm and 10 mm stack heights, a 400 pin open-pin-field on 0.635 mm pitch, BGA attach, and up to 112 Gbps PAM4 performance. Please watch the video to learn more. https://www.samtec.com/standards/picmg/comhpc

As I write this post, we’re in the final stages of completing a massive project to upgrade all of the main product navigation pages on Samtec.com. The current navigation structure […] The post Here’s Your Preview of the New Samtec.com Navigation appeared first on The Samtec Blog....
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Samtec will be demonstrating next-gen, high-performance optical and copper interconnect solutions at the upcoming OFC 2024 Exhibition at the San Diego Convention Center, San Diego, CA March 26-28, 2024. OFC […] The post Samtec Exhibits at OFC 2024 in San Diego appeared first on T...