Presented by: Michael Griesi In a perfect world, soldering a high bandwidth precision RF connector to an optimized PCB launch should be straightforward. In reality, results can vary from perfectly acceptable results to severely degraded electrical performance or catastrophic failures. Identifying and addressing root causes can be challenging with hidden solder joints and finite trace lengths. In this gEEk® spEEk webinar, Mr. Griesi will detail the side effects of standard solder reflow processes on PCB-mounted RF connectors and offer techniques to control and predict unwanted solder flow. Additional tips and tricks for application-specific optimized correlation of simulated and measured data will also be presented.