Extreme Density/Small Form Factor
- Micro 1.00 mm pitch in double row space saving design
- Extreme density with up to 1,450 total I/Os in a 1RU panel (29 cables at 50 total I/Os each)

Samtec’s URSA™ I/O cable-to-cable and cable-to-board solutions achieve four points of contact for a reliable connection in a small form factor, which allows for extreme density on the panel. Designed for ultra rugged applications, EMI shielding helps to limit signal degradation and optimize performance.
IN DEVELOPMENT: URSA™ I/O Ultra Rugged Socket Cable Assembly
IN DEVELOPMENT: URSA™ I/O Ultra Rugged Socket Cable Assembly, Teflon™ Fluoropolymer Wire
IN DEVELOPMENT: URSA™ I/O Ultra Rugged Panel Mount Terminal Cable Assembly
IN DEVELOPMENT: URSA™ I/O Ultra Rugged Panel Mount Terminal Cable Assembly, Teflon™ Fluoropolymer Wire
IN DEVELOPMENT: URSA™ I/O Ultra Rugged Board Mount I/O Connector
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