Standoffs, Guide Posts & Hardware
Precision standoffs, compression alignment hardware and guidance modules assist with mating and help ensure a reliable connection.
GPSO
Guide Post Standoff
Features
- Allows for 0.035" of initial misalignment; alignment starts before connectors engage
- Assists with “blind mate” for ultra micro, fine pitch mezzanine connectors
- 5 mm - 30 mm stack heights
- MIL-DTL stainless steel
- Pairs well with NVAM/NVAF, APM6/APF6, ADM6/ADF6 and UMPT/UMPS
SO
Precision Board Stacking Standoff
Features
- Board stacking stand off
- Board stacks from 5.00 mm to 30.00 mm
- Female thread/press-in and male/male thread
JSO
Jack Screw Precision Board Stacking Standoff
Features
- Works as a traditional standoff
- Assists with unmating LSHM, SEAM/SEAF, SEAM8/SEAF8, LPAM/LPAF, ADM6/ADF6 and other high-normal-force connectors
- Reduces risk for component damage on boards
- Board stacks from 4.00 mm to 16.00 mm
- Press-fit and threaded bases available
JSOM
Micro Jack Screw Precision Board Stacking Standoff - VITA and PC/104 Standard
Features
- Designated for PCI/104-Express™, VITA 42, 57.1, and 57.4 systems
- For use with SamArray® and SEARAY™ connectors designed for VITA 42, 57.1, and 57.4 applications
- ASP-103614-04, ASP-103612-04, ASP-189983-02, ASP-200178-01, ASP-200191-01, ASP-200179-01
- ASP-134602-01, ASP-134488-01, ASP-134486-01, ASP-134606-01, ASP-134604-01, ASP-134603-01
- ASP-188588-01, ASP-184330-01, ASP-184329-01, ASP-196174-01, ASP-186900-01, ASP-186899-01
- For use with Q2™ connectors designed for PCI/104-Express™ applications: ASP-129637-03, ASP-129637-13, ASP-129646-03, ASP-129646-22
- All versions operate with a 1.5 mm Allen key or driver
- Divides PCBs in a steady, even motion to reduce risk of component damage
- Available with or without thread locker
- Works as a traditional standoff
- 8.5 mm, 10 mm, 12 mm, and 15.24 mm board stack heights available
GPSK
Independent Guide Post Holes for SEAF-RA Series
Features
- Guide post holes for blind mating
- Used with SEAF-RA series
GPPK
Independent Guide Post for SEAM Series
Features
- Guide post for blind mating
- Used with SEAM series
ZSO
Z-Ray® Press-Fit Alignment Hardware
Features
- Provides alignment for single-compression solder ball interposers
- Prevents over compression of solder ball joints on interposer
- Ensures proper contact retention and board spacing
- Press-fit design
- 1 mm board stack height (additional heights available; contact Samtec)
ZD
Z-Ray® Alignment Dowel
Features
- Press-fit hardware provides proper PCB-to-interposer alignment for ZA8 and ZA1 Series
- Micro 1 mm diameter
- 3.7 mm, 5.3 mm and 5.7 mm lengths available for varying mated heights
- Uses industry standard hardware to secure and compress the interposer
ZHSI
Z-Ray® Press-Fit Alignment Hardware
Features
- Provides alignment and ensures proper contact retention for dual compression interposers
- Prevents over compression of interposer contacts
- Eliminates the need for additional fasteners
- Press-fit design
- Accommodates .062" and .093" PCB thickness
- Max torque of 4 in-oz on the screw head
EGBF
ExaMAX® Socket Guide Module
Features
- Right-angle orientation
- Guide module for EBTF-RA and EBTM Series
EGBM
ExaMAX® Terminal Guide Module
Features
- Vertical or right-angle orientation
- Guide module for EBTF-RA and EBTM Series
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