CPI Si-Fly® LP Low-Profile, High-Density Interconnect
Features
Extremely low mated height (view mating details here): 3.06 mm (8 pair) and 4.35 mm (16 pair)
Ideal for highly dense applications where z-axis height is limited
Near-chip (ASIC-adjacent) cable system
Surface mount termination
Multiple connectors can be used side-to-side, front-to-back or in a belly-to-belly configuration
112 Gbps PAM4 per lane
16 pair aggregate data rate: 896 Gbps (x8, bi-directional) or 1.79 Tbps (x16, uni-directional)
Operating temperature: -25 ˚C to +85 ˚C
Eludes the BGA and routes signals directly from the silicon package through a long-reach cable
In development options: 34 AWG Thinax™ cable, 105 ˚C operating temp
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