RSP-235735-01 Custom RF Solution
Features
Edge launch, solderless compression
Field replaceable, cost-effective assembly
Edge launch: small form factor improves density
Threaded coupling with high mechanical stability
Performance to 40 GHz
Ideal for high-performance test applications
Intermateable with 3.50 mm & SMA
Air dielectric for low VSWR and insertion loss
- 2D view may not be representative of the configured product. Please see 3D preview or CAD download for actual representation.
- Read our 3D Models Disclaimer.
- Please confirm configuration with the Series Print before final design in.
- For assistance with 3D Models, please contact [email protected].
- For 3D Models suitable for EM Field Solvers, please contact Samtec’s Signal Integrity Group.
| Packaging Notes |
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| Packaging Type: Tray |


