RSP-246372-01 Custom RF Solution
Features
Industry's highest density 112 Gbps PAM4 near-chip cable-to-board system
Designed to mate with AcceleRate® HP cable assembly (ARP6)
Shield features through-hole tails
0.635 mm contact pitch; 2.20 x 2.40 mm pitch row-to-row
Data rate compatible with PCIe® 6.0/CXL® 3.2 and 100 GbE
Rugged locking for maximum density; removal tool required
- 2D view may not be representative of the configured product. Please see 3D preview or CAD download for actual representation.
- Read our 3D Models Disclaimer.
- Please confirm configuration with the Series Print before final design in.
- For assistance with 3D Models, please contact [email protected].
- For 3D Models suitable for EM Field Solvers, please contact Samtec’s Signal Integrity Group.
| Packaging Notes |
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| Packaging Type: Bag & Tag |






