High-speed optical and low skew pair copper I/O assemblies with rugged latching systems and shielded EMI protection for rugged, panel-to-panel applications. Assemblies include HyperTransport™ HT 3.1 performance on the industry’s densest I/O system, micro pitch design for board space savings, and SFP+ jumpers up to 20 Gbps data transmission.
These direct attach flyover QSFP28 cable assemblies improve signal integrity and increase signal path length at higher data rates.
Future-proof system with interchangeability of FireFly™ copper and optical using the same micro connector system for up to 28 Gbps per lane.
Rugged high-speed cable systems feature a positive latching system and support multiple protocols.
Ultra high-density, high-speed cable system with HyperTransport™ HT3.1 performance, designed for rugged applications and EMI protection.
Samtec's SFP+ system includes a panel mounted connector and jumper cable for high-speed applications.
Samtec's USB systems feature both board level connectors and rugged overmold cables.