Compression Interposers
High-speed interposers up to 56 Gbps NRZ featuring an ultra-low profile with high-density single or dual compression contacts and extreme design flexibility.
SUPERNOVA™ Low Profile Compression InterposersSUPERNOVA™ Low Profile Compression Interposers
High-speed, low profile one-piece interposers with a 1.27 mm body height and dual compression contacts.
Features
- 1.27 mm standard body height
- 1.00 mm pitch
- Dual compression contacts
- 100 – 300 total pins
- Ideal for low cost board stacking, module-to-board and LGA interfaces
- Minimizes thermal expansion issues
- Analog Over Array™ capable
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