Compression Interposers

High-speed interposers up to 56 Gbps NRZ featuring an ultra-low profile with high-density single or dual compression contacts and extreme design flexibility.


SUPERNOVA™ Low Profile Compression InterposersSUPERNOVA™ Low Profile Compression Interposers

High-speed, low profile one-piece interposers with a 1.27 mm body height and dual compression contacts.

Features
  • 1.27 mm standard body height
  • 1.00 mm pitch
  • Dual compression contacts
  • 100 – 300 total pins
  • Ideal for low cost board stacking, module-to-board and LGA interfaces
  • Minimizes thermal expansion issues
  • Analog Over Array™ capable
Products
V
  • GMI
SUPERNOVA™ Low Profile Compression Interposers

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