Z-Ray® High-Speed Compression Interposers

Z-Ray® High-Speed Compression Interposers

Z-Ray® high-speed, ultra low profile interposers feature a one-piece design with high-density compression contacts.


FAMILY OVERVIEW

zray video

As a high-speed, high-density connector, Z-Ray® provides the ultimate in design flexibility, from custom heights to full custom geometries. As an interposer, Z-Ray® is a cost-saving removable interface between the IC package and main board. Z-Ray® is ideal for the demands of military/defense, aerospace and R&D applications including radar, radio, navigation and sensors.

BeCu micro-formed contacts, on 0.80 mm and 1.00 mm pitches, are available in a variety of standard and custom configurations, as dual compression or single compression with solder balls. The contacts are assembled into rugged low-profile FR4 substrate under high pressure and temperature.

zray poster

BeCu micro-formed contacts, on 0.80 mm and 1.00 mm pitches, are available in a variety of standard and custom configurations, and in dual compression and single compression/solder ball designs. The contacts are assembled into rugged low-profile FR4 substrate under high pressure and temperature.

FEATURES

Low Profile

zray low profile

High Density

  • Customer-specific pin counts for ultimate high density and speed flexibility
  • Choice of 0.80 mm or 1.00 mm pitch grid
  • Up to 400 I/Os standard with custom capabilities to 3,000+ I/Os
  • Also Available: 1.00 mm pitch system with up to 400 I/Os,1.27 mm and 2 mm standard heights, and up to 56 Gbps performance (GMI Product)
zray high density

Flexible Designs

  • Configurations for any application, complete with detailed footprints
  • Dual compression or single compression with solder balls
  • Customer-specific stack heights, pin counts, insulator shapes, and plating thicknesses
  • Customizable in the X, Y, and Z axes
  • Wide variety of custom geometries
  • Quick-turn customization with minimal NRE and tooling charges
  • A variety of compression and alignment configurations available
zray flexible

Construction

zray construction

Specifications

  • Performance up to 14 Gbps (ZA8, ZA1 Product) and 56 Gbps NRZ (ZA8H Product) with a migration path to 100 Gbps
  • Up to 1,000 cycles, with alternate contact design for up to 3,000 cycles also available (tested to 85˚C)
  • Low 30 g normal force with .008" contact deflection
  • 500 mA per line
  • Differential Vias™ PCB routing available
  • Also Available: 1.00 mm pitch system with up to 400 I/Os, 1.27 mm and 2 mm standard heights, and up to 56 Gbps performance
    (GMI Product)
  • Also Available: Ultra-low profile Z-Ray® Cable Assembly designed for high-speed, micro pitch applications (ZRDP Product)
zray specifications

Compression Hardware Systems

  • Engineered to provide precise alignment, compression and retention of dual compression (LGA) or single compression with solder balls (BGA) Z-Ray® Interposers
  • Z-Ray® hardware systems are ultra-low profile and designed to reduce risk of damage to the interposer
  • ZSO Product provides alignment for single compression solder ball interposers
  • ZHSI Product provides alignment and ensures proper contact retention for dual compression interposers
  • ZD Product press-in hardware provides proper PCB to interposer alignment for dual compression interposers
zray hardware

DOWNLOADS

Literature

Z-Ray<sup>®</sup> Interposer Application Design Guide

Z-Ray® Interposer Application Guide

Get
Compression Hardware e-brochure

Compression Hardware e-brochure

Get
High-Speed Board-to-Board Application Guide

High-Speed Board-to-Board Application Guide

Get
Military & Aerospace Solutions

Military & Aerospace Solutions

Get

Technical Documents

VIDEOS

Z-Ray® Compression Hardware

Products

ZA1

1.00 mm Ultra-Low Profile Compression Interposer

Features
  • Dual compression contacts or single compression with solder balls
  • Low profile - 1 mm standard height
  • Ideal for board stacking, module-to-board and LGA interfaces
  • Allows easy field upgrade, exchange
  • Minimizes thermal expansion issues
  • Up to 400 I/Os standard, with custom capabilities to 3,000+ I/Os
  • 1.00 mm (.0394") pitch
  • Performance up to 14 Gbps
1.00 mm Ultra-Low Profile Compression Interposer

ZA8

0.80 mm Ultra-Low Profile Compression Interposer

Features
  • Dual compression contacts or single compression with solder balls
  • Low profile - 1 mm standard height
  • Ideal for board stacking, module-to-board and LGA interfaces
  • Allows easy field upgrade, exchange
  • Minimizes thermal expansion issues
  • Up to 400 I/Os standard, with custom capabilities to 3,000+ I/Os
  • 0.80 mm (.0315") pitch
  • Performance up to 14 Gbps
0.80 mm Ultra-Low Profile Compression Interposer

ZSO

Z-Ray® Press-Fit Alignment Hardware

Features
  • Provides alignment for single-compression solder ball interposers
  • Prevents over compression of solder ball joints on interposer
  • Ensures proper contact retention and board spacing
  • Press-fit design
  • 1 mm board stack height (additional heights available; contact Samtec)
Z-Ray® Press-Fit Alignment Hardware

ZD

Z-Ray® Alignment Dowel

Features
  • Press-fit hardware provides proper PCB-to-interposer alignment for ZA8 and ZA1 Series
  • Micro 1 mm diameter
  • 3.7 mm, 5.3 mm and 5.7 mm lengths available for varying mated heights
  • Uses industry standard hardware to secure and compress the interposer
Z-Ray® Alignment Dowel

ZHSI

Z-Ray® Press-Fit Alignment Hardware

Features
  • Provides alignment and ensures proper contact retention for dual compression interposers
  • Prevents over compression of interposer contacts
  • Eliminates the need for additional fasteners
  • Press-fit design
  • Accommodates .062" and .093" PCB thickness
  • Max torque of 4 in-oz on the screw head
Z-Ray® Press-Fit Alignment Hardware

CONTACT SALES

First Name
Last Name
Email
Company
Industry
Estimate Annual Usage
Family
Message

Don't want to fill out a form?
Chat with a product expert directly.

.
In today’s blog episode, we would like to introduce our newest White Paper: “System and Component qualifications of VPX solutions, Create a novel, low-cost, easy to build, high reliability test platform for VPX modules“. Over the past year, Samtec has worked with EIZO Rugged Solu...
We all hope for peace and a world free from conflict.  Despite this, it is the duty of governments to provide their armed forces with the tools they need to deter aggression from foreign powers who have different aspirations and, if necessary, take action to safeguard the lives o...
Samtec Flyover® Twinax Cable assemblies allow designers to extend signal reach and density, enabling 112 Gbps PAM4 performance. Samtec Flyover systems are commonly used in mid-board applications, with a cable assembly connector located next to the chip. The signal path is directe...
As a Southern California native, learning to surf is a must. Traveling elsewhere and telling people you’re from California without experiencing surfing is somewhat a surprise to most people. So, I have decided to take up surfing. It takes more practice than most people think. I p...
Samtec has hundreds of videos that span across everything from products, to demos, to presentations, branding, and more. We rebuilt our video search to be more lightweight, and also added a huge new feature. Previous to this update, all of the videos opened in a modal pop-up wind...