Language
triangle alert Samtec manufacturing capacity has been influenced by this pandemic. Our global operations team is working tirelessly to maximize output and minimize impact to customers while prioritizing COVID-19 critical response applications. Some part numbers are experiencing delays, but many are not. For the most up-to-date and accurate lead times use your My Samtec account, chat, or call us anytime for the latest information. ×
triangle alert Samtec manufacturing capacity has been influenced by this pandemic. Our global operations team is working tirelessly to maximize output and minimize impact to customers while prioritizing COVID-19 critical response applications. Some part numbers are experiencing delays, but many are not. For the most up-to-date and accurate lead times use your My Samtec account, chat, or call us anytime for the latest information. ×
Board-to-Board Connectors
High-Speed Board-to-Board Connectors
Compression Interposers
Z-Ray® High-Speed Compression Interposers
Board-to-Board Connectors
High-Speed Board-to-Board Connectors
Compression Interposers
Z-Ray® High-Speed Compression Interposers

Z-Ray® High-Speed Compression Interposers

Z-Ray® High-Speed Compression Interposers

Z-Ray® high-speed, ultra low profile interposers feature a one-piece design with high-density compression contacts.

FAMILY OVERVIEW

zray video

As a high-speed, high-density connector, Z-Ray® provides the ultimate in design flexibility, from custom heights to full custom geometries. As an interposer, Z-Ray® is a cost-saving removable interface between the IC package and main board. Z-Ray® is ideal for the demands of military/defense, aerospace and R&D applications including radar, radio, navigation and sensors.

BeCu micro-formed contacts, on 0.80 mm and 1.00 mm pitches, are available in a variety of standard and custom configurations, as dual compression or single compression with solder balls. The contacts are assembled into rugged low-profile FR4 substrate under high pressure and temperature.

zray poster

BeCu micro-formed contacts, on 0.80 mm and 1.00 mm pitches, are available in a variety of standard and custom configurations, and in dual compression and single compression/solder ball designs. The contacts are assembled into rugged low-profile FR4 substrate under high pressure and temperature.

FEATURES

Low Profile

zray low profile

High Density

  • Customer-specific pin counts for ultimate high density and speed flexibility
  • Choice of 0.80 mm or 1.00 mm pitch grid
  • Up to 400 I/Os standard with custom capabilities to 3,000+ I/Os
  • Also Available: 1.00 mm pitch system with up to 400 I/Os,1.27 mm and 2 mm standard heights, and up to 56 Gbps performance (GMI Product)
zray high density

Flexible Designs

  • Configurations for any application, complete with detailed footprints
  • Dual compression or single compression with solder balls
  • Customer-specific stack heights, pin counts, insulator shapes, and plating thicknesses
  • Customizable in the X, Y, and Z axes
  • Wide variety of custom geometries
  • Quick-turn customization with minimal NRE and tooling charges
  • A variety of compression and alignment configurations available
zray flexible

Construction

zray construction

Specifications

  • Performance up to 14 Gbps (ZA8, ZA1 Product) and 56 Gbps NRZ (ZA8H Product) with a migration path to 100 Gbps
  • Up to 1,000 cycles, with alternate contact design for up to 3,000 cycles also available (tested to 85˚C)
  • Low 30 g normal force with .008" contact deflection
  • 500 mA per line
  • Differential Vias™ PCB routing available
  • Also Available: 1.00 mm pitch system with up to 400 I/Os, 1.27 mm and 2 mm standard heights, and up to 56 Gbps performance
    (GMI Product)
  • Also Available: Ultra-low profile Z-Ray® Cable Assembly designed for high-speed, micro pitch applications (ZRDP Product)
zray specifications

Compression Hardware Systems

  • Engineered to provide precise alignment, compression and retention of dual compression (LGA) or single compression with solder balls (BGA) Z-Ray® Interposers
  • Z-Ray® hardware systems are ultra-low profile and designed to reduce risk of damage to the interposer
  • ZSO Product provides alignment for single compression solder ball interposers
  • ZHSI Product provides alignment and ensures proper contact retention for dual compression interposers
  • ZD Product press-in hardware provides proper PCB to interposer alignment for dual compression interposers
zray hardware

DOWNLOADS

Literature

Z-Ray<sup>®</sup> Interposer Application Design Guide

Z-Ray® Interposer Application Guide

Get
Compression Hardware e-brochure

Compression Hardware e-brochure

Get
High-Speed Board-to-Board Application Guide

High-Speed Board-to-Board Application Guide

Get
Military/Aerospace Applications

Military/Aerospace Applications

Get

Technical Documents

VIDEOS

Z-Ray® Compression Hardware

Products

ZA1

1.00 mm Ultra-Low Profile Compression Interposer

Features
  • Dual compression contacts or single compression with solder balls
  • Low profile - 1 mm standard height
  • Ideal for board stacking, module-to-board and LGA interfaces
  • Allows easy field upgrade, exchange
  • Minimizes thermal expansion issues
  • Up to 400 I/Os standard, with custom capabilities to 3,000+ I/Os
  • 1.00 mm (.0394") pitch
  • Performance up to 14 Gbps
1.00 mm Ultra-Low Profile Compression Interposer
Downloads
Technical Details

ZA8

0.80 mm Ultra-Low Profile Compression Interposer

Features
  • Dual compression contacts or single compression with solder balls
  • Low profile - 1 mm standard height
  • Ideal for board stacking, module-to-board and LGA interfaces
  • Allows easy field upgrade, exchange
  • Minimizes thermal expansion issues
  • Up to 400 I/Os standard, with custom capabilities to 3,000+ I/Os
  • 0.80 mm (.0315") pitch
  • Performance up to 14 Gbps
0.80 mm Ultra-Low Profile Compression Interposer
Downloads
Technical Details

ZA8H

0.80 mm High-Speed Dual Compression Interposer

Features
  • Performance up to 56 Gbps NRZ
  • 0.33 mm height provides shortest signal path
  • Dual compression BeCu contacts
  • Up to 168 contacts: 4 or 7 rows with 3, 12 or 24 pairs per row
  • 30 g normal force with .008" (0.20 mm) contact deflection
0.80 mm High-Speed Dual Compression Interposer
Downloads
Technical Details

ZSO

Z-Ray® Press-Fit Alignment Hardware

Features
  • Provides alignment for single-compression solder ball interposers
  • Prevents over compression of solder ball joints on interposer
  • Ensures proper contact retention and board spacing
  • Press-fit design
  • 1 mm board stack height (additional heights available; contact Samtec)
Z-Ray® Press-Fit Alignment Hardware
Downloads
Technical Details

ZD

Z-Ray® Alignment Dowel

Features
  • Press-fit hardware provides proper PCB-to-interposer alignment for ZA8 and ZA1 Series
  • Micro 1 mm diameter
  • 3.7 mm, 5.3 mm and 5.7 mm lengths available for varying mated heights
  • Uses industry standard hardware to secure and compress the interposer
Z-Ray® Alignment Dowel
Downloads
Technical Details

ZHSI

Z-Ray® Press-Fit Alignment Hardware

Features
  • Provides alignment and ensures proper contact retention for dual compression interposers
  • Prevents over compression of interposer contacts
  • Eliminates the need for additional fasteners
  • Press-fit design
  • Accommodates .062" and .093" PCB thickness
  • Max torque of 4 in-oz on the screw head
Z-Ray® Press-Fit Alignment Hardware
Downloads
Technical Details

CONTACT SALES

First Name
Last Name
Email
Company
Industry
Estimate Annual Usage
Family
Message

Don't want to fill out a form?
Chat with a product expert directly.

.

More Compression Interposers
In July we rolled out a major update to our Cart, added a few tweaks to the Video Search page, added several new training videos, and updated content in a variety of places. Here are the major website updates for July 2020. Upgraded and Redesigned Cart Experience You’ll notice a ...
[Read More]
You might remember the last blog on Immersion Cooling where we introduced Samtec’s new landing page for Immersion Cooling. The test results are in, and they look good. Samtec has partnered with Engineered Fluids to run a series of qualification tests on several of our product ser...
[Read More]
The pandemic has not slowed the demand for high bandwidth, high-performance systems, such as 56 Gbps PAM4, 112 Gbps PAM4 and more. Designer engineers in all types of industries, from data center, HPC, networking, telecom, medical, storage, semiconductor, wireless, test and measur...
[Read More]
Design engineers – EEs, PCBs designers, MEs, etc., – are hard-pressed to get designs to market faster. They are always looking for shortcuts to make product design process simpler. Samtec and its partner SnapEDA are giving engineers more tools to accelerate the design cycle. Our ...
[Read More]
Samtec.com includes close to 200 high-quality videos that span across a variety of categories and topics. These videos include things like recorded presentations and webinars, product features and benefits, tutorials for web tools, virtual tours of our tech centers, corporate ove...
[Read More]
Your local FSE  Location: (Change)

© 2020 Samtec. All rights reserved.

View Full Site

SPEAK WITH A REPRESENTATIVE

1-800-726-8329

1-800-SAMTEC-9

1-812-944-6733

Reveal Local Sales Rep Info

WEBSITE OR PRODUCT SUPPORT

eCustomerService@samtec.com

Live Chat

ABOUT US

CONTACT US

LANGUAGES

Samtec Logo

© 2020 Samtec. All rights reserved.

View Mobile Site