Ultra-fine pitch, ultra-low profile and ultra-slim body interconnects with 28+ Gbps performance.
Samtec’s 0.635 mm pitch high-density multi-row mezzanine strips feature up to 240 signal integrity optimized Edge Rate® contacts in a low profile, slim body design.
Rugged Edge Rate® contact systems optimized for signal integrity performance.
High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.
Z-Ray® ultra-low profile, high-density one-piece arrays with compression contacts.
These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.
Low profile open-pin-field arrays down to 4 mm stack height and up to 320 total I/Os.