Build your mated connector set using Samtec’s High-Speed Board-to-Board Solutionator®. Ultra fine pitch, ultra-low profile and ultra-slim body connectors with 28+ Gbps performance.
0.40 mm and 0.50 mm pitch Micro Blade & Beam ultra slim, ultra low profile connectors.
Rugged Edge Rate® contact systems optimized for signal integrity performance.
High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.
These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.
Low profile open-pin-field arrays down to 4 mm stack height and up to 400 total I/Os.