Ultra Micro

Ultra-fine pitch, ultra-low profile and ultra-slim body interconnects with 28+ Gbps performance.


Razor Beam™ LPRazor Beam™ LP

Ultra slim, ultra low profile and ultra fine pitch interconnects.

Features
  • Ultra fine pitch – 0.40 mm and 0.50 mm
  • Ultra low stack down to 2.00 mm
  • Slim body design for increased board space savings
Series
V
  • SLH
  • SS4
  • SS5
  • ST4
  • ST5
  • TLH
Help Me Choose?
Razor Beam™ LP

Edge Rate® SlimEdge Rate® Slim High-Speed Connector Strips

Slim body, low profile single row connector strips designed for high-speed performance.

Features
  • Slim 2.5 mm body width
  • 56 Gbps PAM4 performance
  • Low profile 5 mm stack height
  • Up to 120 total positions
  • J lead for ease of processing
Series
V
  • ESF6
  • ESM6
Edge Rate® Slim

Edge Rate®Edge Rate® Connector Strips

Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features
  • Edge Rate® contacts optimized for signal integrity performance
  • Robust when "zippered" during unmating
  • 0.80 mm or 0.50 mm pitch systems
  • Stack heights from 7 mm to 16 mm
  • 0.50 mm pitch system for up to 40% PCB space savings
Series
V
  • ERF5
  • ERF5-RA
  • ERF8
  • ERF8-EM
  • ERF8-RA
  • ERM5
  • ERM8
  • ERM8-EM
  • ERM8-RA
Edge Rate®

Razor Beam™Razor Beam™

High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

Features
  • 10 stack height options from 5 mm to 12 mm
  • Audible click when mated
  • Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
  • Up to 100 contacts
Series
V
  • JSO
  • LSEM
  • LSHM
  • LSS
Razor Beam™

Edge Rate® High-DensityEdge Rate® High-Density Multi-Row Mezzanine Strips

Samtec’s 0.635 mm pitch high-density multi-row mezzanine strips feature up to 240 signal integrity optimized Edge Rate® contacts in a low profile, slim body design.

Features
  • Incredibly dense with up to 240 total I/Os
  • Low profile 5 mm stack height and slim 5 mm width
  • 4-row design; 10 - 60 positions per row (40 - 240 total positions)
  • Edge Rate® contact systems optimized for signal integrity performance
  • Supports 28+ Gbps applications
  • Solder ball technology for simplified processing
  • Even thinner 2-row version and additional stack heights in development
Series
V
  • EDF6
  • EDM6
Edge Rate® High-Density

Z-Ray® Ultra-Low Profile ArraysZ-Ray® Ultra-Low Profile Arrays

Z-Ray® ultra-low profile, high-density one-piece arrays with compression contacts.

Features
  • 1 mm standard body height
  • Dual compression contacts
  • Single compression with solder ball
  • Performance up to 20 GHz / 40 Gbps
  • 0.80 mm or 1.00 mm pitch standard
  • Highly customizable system
Series
V
  • ZA1
  • ZA8
  • ZA8H
  • ZD
  • ZHSI
  • ZSO
Z-Ray® Ultra-Low Profile Arrays

SEARAY™ 0.80 mmSEARAY™ 0.80 mm Pitch Ultra High-Density Arrays

These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.

Features
  • 0.80 mm (.0315") pitch grid
  • 50% board space savings versus .050" (1.27 mm) pitch SEARAY™
  • Performance: Up to 17.5 GHz / 35 Gbps
  • Rugged Edge Rate® contact system
  • Up to 500 I/Os
  • 7 mm and 10 mm stack heights
  • Solder charge terminations for ease of processing
  • Samtec 28+ Gbps Solution
  • Final Inch® certified for Break Out Region trace routing recommendations (patent pending)
Series
V
  • JSO
  • SEAF8
  • SEAF8-RA
  • SEAM8
  • UBPS
  • UBPT
SEARAY™ 0.80 mm

LP Array™LP Array™ Low Profile Open-Pin-Field Arrays

Low profile open-pin-field arrays down to 4 mm stack height and up to 320 total I/Os.

Features
  • 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Performance up to 18.5 GHz / 37 Gbps
Series
V
  • JSO
  • LPAF
  • LPAM
LP Array™

Choosing the right plating is critical to the success of a connector system. Plating affects the connector’s performance, life cycle, quality, and cost. A recent blog explains that pins and plating are usually the main cost drivers in board-to-board connector systems. That blog f...
As consumers, no one ever complains that their wireless connectivity is “too fast”. Global wireless carriers and network providers continue to push the limits of 4G LTE, but a next-generation wireless standard – 5G New Radio (5G NR) – is on the horizon. 5G technology will be 100x...
Everyone loves a good book. From Shakespearean classics to more modern-day masterpieces, a solid story can leave a lasting impression. While the VITA family of standards isn’t necessarily a book, it does have a rich history with a large impact.  As we learned in a previous blog, ...
With our last web update, we brought you several new additions to our on-site search, a new Microelectronics web experience, and our new 2017 product overview guide. In September, the updates to search came to a close (for now), we’ve added a few new content pages, and we began w...
I’ll start this blog with two questions. First, what are the major costs to build a connector? Second, which of these are the bigger costs?  In other words, what is the most expensive part of a connector? (Quick aside: I can’t speak for all connector companies when it comes to co...
View Full Site