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triangle alert The safety of our employees and customers is most important to Samtec. COVID-19 has impacted lead times on some, but not all, of our products. At this time, those impacted are only being pushed out from 3-5 days to 6 weeks. Current lead times will be reflected in your cart. Create a My Samtec account to easily monitor order status. ×

Ultra Micro

Ultra fine pitch, ultra-low profile and ultra-slim body connectors with 28+ Gbps performance.


AcceleRate® HDAcceleRate® HD Ultra-Dense Multi-Row Mezzanine Strips

These 0.635 mm pitch high-density multi-row mezzanine strips are rated for 56 Gbps PAM4 and feature up to 240 high-speed Edge Rate® contacts in a slim, low-profile design.

Features
  • Incredibly dense with up to 240 total I/Os
  • Low profile 5 mm stack height
  • Slim 5 mm width
  • 4-row design; 10 - 60 positions per row (40 - 240 total positions)
  • Edge Rate® contact system optimized for signal integrity performance
  • Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
  • Solder ball technology for simplified processing and self aligning
  • Additional stack heights and higher pin counts in development
Series
V
  • ADM6
  • ADF6
AcceleRate® HD

Micro Blade & BeamMicro Blade & Beam Ultra Fine Pitch Connectors

0.40 mm and 0.50 mm pitch Micro Blade & Beam ultra slim, ultra low profile connectors.

Features
  • Ultra fine pitch – 0.40 mm and 0.50 mm
  • Ultra low stack down to 2.00 mm
  • Slim body design for increased board space savings
  • Compatible with mPOWER™ for power/signal flexibility.
Series
V
  • SS4
  • ST4
  • SS5
  • ST5
  • SLH
  • TLH
Micro Blade & Beam

Edge Rate®Edge Rate® Connector Strips

Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features
  • Edge Rate® contacts optimized for signal integrity performance
  • 1.5 mm contact wipe
  • Robust when "zippered" during unmating
  • Up to 56 Gbps PAM4 performance
  • 0.50 mm, 0.635 mm or 0.80 mm pitch systems
  • Stack heights from 5 mm to 18 mm
  • Extremely slim 2.5 mm body width on 0.635 mm pitch system
  • 0.50 mm pitch system for up to 40% PCB space savings vs 0.80 mm pitch system
Series
V
  • ERM8
  • ERF8
  • ERM8-RA
  • ERF8-RA
  • ERM8-EM
  • ERF8-EM
  • ERM5
  • ERF5
  • ERF5-RA
  • ERM6
  • ERF6
Edge Rate®

Razor Beam™Razor Beam™

High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

Features
  • 10 stack height options from 5 mm to 12 mm
  • Audible click when mated
  • Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
  • Up to 100 contacts
Series
V
  • LSHM
  • LSS
  • LSEM
  • JSO
Razor Beam™

Z-Ray® Ultra-Low Profile ArraysZ-Ray® Ultra-Low Profile Arrays

Z-Ray® high-density, ultra-low profile, highly customizable arrays with compression contacts.

Features
  • 0.33 mm and 1 mm standard body heights
  • Dual compression contacts
  • Single compression with solder ball
  • Performance up to 20 GHz / 40 Gbps
  • 0.80 mm or 1.00 mm pitch standard
  • Highly customizable system
Series
V
  • ZA1
  • ZA8
  • ZA8H
  • ZSO
  • ZD
  • ZHSI
Z-Ray® Ultra-Low Profile Arrays

SEARAY™ 0.80 mmSEARAY™ 0.80 mm Pitch Ultra High-Density Arrays

These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.

Features
  • 0.80 mm (.0315") pitch grid
  • 50% board space savings versus .050" (1.27 mm) pitch SEARAY™
  • Performance: Up to 17.5 GHz / 35 Gbps
  • Rugged Edge Rate® contact system
  • Up to 500 I/Os
  • 7 mm and 10 mm stack heights
  • Solder charge terminations for ease of processing
  • Samtec 28+ Gbps Solution
  • Final Inch® certified for Break Out Region trace routing recommendations
Series
V
  • SEAM8
  • SEAF8
  • SEAF8-RA
  • JSO
SEARAY™ 0.80 mm

LP Array™LP Array™ Low Profile Open-Pin-Field Arrays

Low profile open-pin-field arrays down to 4 mm stack height and up to 320 total I/Os.

Features
  • 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 400 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Performance up to 18.5 GHz / 37 Gbps
Series
V
  • JSO
  • LPAF
  • LPAM
LP Array™

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