Ultra Micro

Ultra-fine pitch, ultra-low profile and ultra-slim body interconnects with 28+ Gbps performance.


Razor Beam™ LPRazor Beam™ LP

Ultra slim, ultra low profile and ultra fine pitch interconnects.

Features
  • Ultra fine pitch – 0.40 mm and 0.50 mm
  • Ultra low stack down to 2.00 mm
  • Slim body design for increased board space savings
Series
V
  • SLH
  • SS4
  • SS5
  • ST4
  • ST5
  • TLH
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Razor Beam™ LP

Edge Rate®Edge Rate® Connector Strips

Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features
  • Edge Rate® contacts optimized for signal integrity performance
  • Robust when "zippered" during unmating
  • 0.80 mm or 0.50 mm pitch systems
  • Stack heights from 7 mm to 16 mm
  • 0.50 mm pitch system for up to 40% PCB space savings
Series
V
  • ERF5
  • ERF5-RA
  • ERF8
  • ERF8-EM
  • ERF8-RA
  • ERM5
  • ERM8
  • ERM8-EM
  • ERM8-RA
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Edge Rate®

Razor Beam™Razor Beam™

High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

Features
  • 10 stack height options from 5 mm to 12 mm
  • Audible click when mated
  • Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
  • Up to 100 contacts
Series
V
  • JSO
  • LSEM
  • LSHM
  • LSS
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Razor Beam™

Z-Ray® Ultra-Low Profile ArraysZ-Ray® Ultra-Low Profile Arrays

Z-Ray® ultra-low profile, high-density one-piece arrays with compression contacts.

Features
  • 1 mm standard body height
  • Dual compression contacts
  • Single compression with solder ball
  • Performance up to 20 GHz / 40 Gbps
  • 0.80 mm or 1.00 mm pitch standard
  • Highly customizable system
Series
V
  • ZA1
  • ZA8
  • ZA8H
  • ZD
  • ZHSI
  • ZSO
Z-Ray® Ultra-Low Profile Arrays

SEARAY™ 0.80 mmSEARAY™ 0.80 mm Pitch Ultra High-Density Arrays

These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.

Features
  • 0.80 mm (.0315") pitch grid
  • 50% board space savings versus .050" (1.27 mm) pitch SEARAY™
  • Performance: Up to 17.5 GHz / 35 Gbps
  • Rugged Edge Rate® contact system
  • Up to 500 I/Os
  • 7 mm and 10 mm stack heights
  • Solder charge terminations for ease of processing
  • Samtec 28+ Gbps Solution
  • Final Inch® certified for Break Out Region trace routing recommendations (patent pending)
Series
V
  • JSO
  • SEAF8
  • SEAF8-RA
  • SEAM8
  • UBPS
  • UBPT
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SEARAY™ 0.80 mm

LP Array™LP Array™ Low Profile Open-Pin-Field Arrays

Low profile open-pin-field arrays down to 4 mm stack height and up to 320 total I/Os.

Features
  • 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Performance up to 18.5 GHz / 37 Gbps
Series
V
  • JSO
  • LPAF
  • LPAM
LP Array™

One of several demonstrations at DesignCon 2017 shows the variety of Samtec interconnects supporting the Xilinx® Virtex® UltraScale+ FPGA VCU118 Development Kit.  Included in the kit is an FMC+ Active Loopback Card, which carries Samtec’s direct attach Flyover™ QSFP28. In the Fly...
In this video, Kevin Burt of Samtec’s Optical Group explains one of Samtec’s product demonstrations at DesignCon 2017.  The demo features a disaggregated computing platform with PCIe® Gen 3 fabric enabled by the patented FireFly™ mid-board optical technology. PCIe® Over Fiber PCI...
At DesignCon 2017, Jim Nadolny, Samtec’s Principle SI and EMI Engineer, presented(1) a technical paper entitled “Design of Flyover QSFP28 (FQSFP Series) for 56+ Gbps Applications.” This white paper discusses the Flyover QSFP (FQSFP) approach for 56+ Gbps applications to overcome ...
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As the demand for bandwidth increases, so does the demand for higher capacity products with faster transmission capabilities. In response to these demands, Samtec has expanded the FireFly™ Micro Flyover Optical product line to solve more complex design hurdles. Benefits such as c...
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