Ultra Micro

Ultra-fine pitch, ultra-low profile and ultra-slim body interconnects with 28+ Gbps performance.


Razor Beam™ LPRazor Beam™ LP

Ultra slim, ultra low profile and ultra fine pitch interconnects.

Features
  • Ultra fine pitch – 0.40 mm and 0.50 mm
  • Ultra low stack down to 2.00 mm
  • Slim body design for increased board space savings
Series
V
  • SLH
  • SS4
  • SS5
  • ST4
  • ST5
  • TLH
Help Me Choose?
Razor Beam™ LP

Edge Rate® High-DensityEdge Rate® High-Density Multi-Row Mezzanine Strips

Samtec’s 0.635 mm pitch high-density multi-row mezzanine strips feature up to 240 signal integrity optimized Edge Rate® contacts in a low profile, slim body design.

Features
  • Incredibly dense with up to 240 total I/Os
  • Low profile 5 mm stack height and slim 5 mm width
  • 4-row design; 10 - 60 positions per row (40 - 240 total positions)
  • Edge Rate® contact systems optimized for signal integrity performance
  • Supports 28+ Gbps applications
  • Solder ball technology for simplified processing
  • Even thinner 2-row version and additional stack heights in development
Series
V
  • EDF6
  • EDM6
Edge Rate® High-Density

Edge Rate®Edge Rate® Connector Strips

Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features
  • Edge Rate® contacts optimized for signal integrity performance
  • Robust when "zippered" during unmating
  • 0.80 mm or 0.50 mm pitch systems
  • Stack heights from 7 mm to 16 mm
  • 0.50 mm pitch system for up to 40% PCB space savings
Series
V
  • ERF5
  • ERF5-RA
  • ERF8
  • ERF8-EM
  • ERF8-RA
  • ERM5
  • ERM8
  • ERM8-EM
  • ERM8-RA
Edge Rate®

Razor Beam™Razor Beam™

High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

Features
  • 10 stack height options from 5 mm to 12 mm
  • Audible click when mated
  • Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
  • Up to 100 contacts
Series
V
  • JSO
  • LSEM
  • LSHM
  • LSS
Razor Beam™

Z-Ray® Ultra-Low Profile ArraysZ-Ray® Ultra-Low Profile Arrays

Z-Ray® ultra-low profile, high-density one-piece arrays with compression contacts.

Features
  • 1 mm standard body height
  • Dual compression contacts
  • Single compression with solder ball
  • Performance up to 20 GHz / 40 Gbps
  • 0.80 mm or 1.00 mm pitch standard
  • Highly customizable system
Series
V
  • ZA1
  • ZA8
  • ZA8H
  • ZD
  • ZHSI
  • ZSO
Z-Ray® Ultra-Low Profile Arrays

SEARAY™ 0.80 mmSEARAY™ 0.80 mm Pitch Ultra High-Density Arrays

These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.

Features
  • 0.80 mm (.0315") pitch grid
  • 50% board space savings versus .050" (1.27 mm) pitch SEARAY™
  • Performance: Up to 17.5 GHz / 35 Gbps
  • Rugged Edge Rate® contact system
  • Up to 500 I/Os
  • 7 mm and 10 mm stack heights
  • Solder charge terminations for ease of processing
  • Samtec 28+ Gbps Solution
  • Final Inch® certified for Break Out Region trace routing recommendations (patent pending)
Series
V
  • JSO
  • SEAF8
  • SEAF8-RA
  • SEAM8
  • UBPS
  • UBPT
SEARAY™ 0.80 mm

LP Array™LP Array™ Low Profile Open-Pin-Field Arrays

Low profile open-pin-field arrays down to 4 mm stack height and up to 320 total I/Os.

Features
  • 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Performance up to 18.5 GHz / 37 Gbps
Series
V
  • JSO
  • LPAF
  • LPAM
LP Array™

It seems FPGAs are getting bigger and faster all the time. FPGA vendors continue to integrate more transceivers running at higher speeds in their newest ICs.  As an example, the Xilinx Virtex UltraScale+ VU13P FPGA contains 128 GTY transceivers running data rates up to 32.75 Gbps...
Every year Samtec releases a new catalog showcasing our full line of products and 2017 was no exception. The latest F-217 Full Line Catalog features new products and technology that enable us to provide overall system optimization from Silicon-to-Silicon. The combination of Samte...
The growth in high-speed serial channel data rates has no end in sight.  28 Gbps design starts abound across the industry.  56 Gbps PAM-4 solutions are coming down the road, whether silicon, interconnect or high-speed copper and optical cables. On the optical front, the front-pan...
In last month’s update, we brought you an updated way to order your samples from our Solutionator parametric search tool. In February, we rolled that out on an even larger scale, with this feature being added to a new full-part technical specifications page experience (more about...
OFC 2017, The Optical Networking and Communication Conference & Exhibition, is a global forum and exhibition for optical communications and networking possibilities. Samtec will showcase the latest FireFly™ Optical Cable Systems, including new PCIe® Over Fiber, extended temperatu...
View Full Site