triangle alert This site uses cookies and other website monitoring technologies to assist with website functions and with our promotional and marketing efforts. By clicking Accept, you consent to the terms in our recently updated Privacy Notice and Policy Manual.
Accept Decline
triangle alert This site uses cookies and other website monitoring technologies to assist with website functions and with our promotional and marketing efforts. By clicking Accept, you consent to the terms in our recently updated Privacy Notice and Policy Manual.
Accept Decline

AcceleRate® HD Ultra-Dense Multi-Row Mezzanine Strips

AcceleRate® HD Ultra-Dense Multi-Row Mezzanine Strips

AcceleRate® HD ultra-dense, multi-row mezzanine strips are rated for 56 Gbps PAM4 on a 0.635 mm pitch.


FAMILY OVERVIEW

accelerate hd

AcceleRate® HD features high-speed Edge Rate® contacts designed for high-speed, high-cycle applications.

The surface of the contact is milled creating a smooth mating surface, which reduces wear on the contact increasing durability and cycle life. Also, lower insertion and withdrawal forces allow zippered unmating.

FEATURES

  • Incredibly dense with up to 240 total I/Os; up to 400 in development
  • Low profile 5 mm stack height
  • Slim 5 mm width
  • 4-row design; 10 - 60 positions per row (70 - 100 total positions per row in development)
  • Edge Rate® contact system optimized for signal integrity performance
  • Open-pin-field design for grounding and routing flexibility
  • Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
  • PCIe® Gen 5 compatible
  • Solder ball technology for simplified processing and self aligning
  • 7 - 16 mm stack heights, right-angle and cable in development
adx6 accelerate

DOWNLOADS

Literature

AcceleRate® HD eBrochure

AcceleRate® HD eBrochure

Get
High-Speed Board-to-Board Application Guide

High-Speed Board-to-Board Application Guide

Get
Broadcast Video Solutions Guide

Broadcast Video Solutions Guide

Get
Product Overview Guide

Product Overview Guide

Get

SERIES

ADM6

0.635 mm AcceleRate® HD High-Density 4-Row Header

Features
  • Incredibly dense with up to 240 total I/Os
  • Low profile 5 mm stack height and slim 5 mm width
  • 4-row design; 10 - 60 positions per row (40 - 240 total positions)
  • Edge Rate® contact system optimized for signal integrity performance
  • Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
  • Solder ball technology for simplified processing and self aligning
  • Additional stack heights and higher pin counts in development
0.635 mm AcceleRate® HD High-Density 4-Row Header

ADF6

0.635 mm AcceleRate® HD High-Density 4-Row Socket

Features
  • Incredibly dense with up to 240 total I/Os
  • Low profile 5 mm stack height and slim 5 mm width
  • 4-row design; 10 - 60 positions per row (40 - 240 total positions)
  • Edge Rate® contact system optimized for signal integrity performance
  • Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
  • Solder ball technology for simplified processing and self aligning
  • Additional stack heights and higher pin counts in development
0.635 mm AcceleRate® HD High-Density 4-Row Socket

CONTACT SALES

First Name
Last Name
Email
Company
Industry
Estimate Annual Usage
Family
Message

Don't want to fill out a form?
Chat with a product expert directly.

.
.
While Samtec started as a connector company with a focus on two-piece, pin-and-socket board stacking systems, High-Speed Board Stacking connectors and High-Speed Cable Assemblies now make up a significant portion of our sales. To support development in this area, in December of 2...
In the manufacturing world there are standards for just about everything, and they all are typically there to ensure a product can perform as expected for the end application. Among these standards is IPC-A-610 covering solder joints for varying types of connector termination sty...
New Year’s resolutions. Many of us make them, whether it’s to continue a good habit, change a bad one or accomplish a new goal, improvement is the focus. The hardest part of this process is the time between making the plan and accomplishing it. Wouldn’t it be nice if we could jus...
2019 was a fun year for Samtec.com. We’re in a great place right now where we get to maintain current content and features while we’re building a lot of new stuff as well. The website is becoming more mature, but still developing rapidly. If you missed it, here is a look back at ...
While air cooling is still a commonly used method to cool data centers, the industry is seeing HPC, AI, and scientific computing market leaders investigating either conduction cooling, or full-scale immersion cooling, for their next generation designs. In this video from SuperCom...