マイクロエレクトロニクス

インターコネクト ソリューション

次世代のマイクロエレクトロニクスには、パフォーマンスの向上とさらなる統合、高度なチップ技術、小型化が必要とされます。

マイクロエレクトロニクスとハイスピードインターコネクトに関するSamtecの広範な専門知識が、パッケージ統合、小型化、ウエハーレベル実装、シグナルインテグリティの最適化における当社の実績ある手法と合わさり、高度なマイクロエレクトロニクス アプリケーションに対する独自のサポートを実現します。

Samtec demonstrated many high-performance RF test and measurement solutions at DesignCon 2024. In this video, David Beraun, Samtec’s RF Product Manager, takes a quick look at some of those high-performance […] The post New Samtec RF Test and Measurement Solutions At DesignCon 202...
Samtec will be demonstrating next-gen, high-performance optical and copper interconnect solutions at the upcoming OFC 2024 Exhibition at the San Diego Convention Center, San Diego, CA March 26-28, 2024. OFC […] The post Samtec Exhibits at OFC 2024 in San Diego appeared first on T...
We have come to expect unprecedented reliability from our electronic devices, whether in the consumer market or in the industrial world.  Ensuring the highest performance of semiconductors requires manufacturers to […] The post Connectors for Semiconductor Manufacturing appeared ...
224 Gbps PAM4; CXL over optics; 112 Gbps PAM4 cable with excellent performance while subjected to dynamic flexing; 800 G; 90 GHz test and validation solutions. Samtec showcased a variety […] The post An Array of High-Performance Front Panel and Backplane Solutions appeared first ...
I am a big fan of the TV show Modern Marvels and I recently watched an episode on the evolution of the Assembly Line. The clip focused on the basic […] The post Samtec’s Five New Solution Videos for Industrial Applications appeared first on The Samtec Blog....