マイクロエレクトロニクス

インターコネクト ソリューション

次世代のマイクロエレクトロニクスには、パフォーマンスの向上とさらなる統合、高度なチップ技術、小型化が必要とされます。

マイクロエレクトロニクスとハイスピードインターコネクトに関するSamtecの広範な専門知識が、パッケージ統合、小型化、ウエハーレベル実装、シグナルインテグリティの最適化における当社の実績ある手法と合わさり、高度なマイクロエレクトロニクス アプリケーションに対する独自のサポートを実現します。

Many of our Samtec blogs focus on high-speed, high-bandwidth, cutting-edge connector applications. This makes sense because Signal Integrity is a critical issue for many of our customers, and because it’s a more flashy, attention-grabbing, sexy topic. And yes, I did just use the ...
Many electronics experience a wide range of climates while in operation and storage. Because of this fact, connector humidity testing is used to determine the ability of a product to withstand elevated humidity and cycling temperatures. Humidity testing is conducted in combinatio...
In this new video, Samtec’s Kevin Burt introduces Samtec Direct Connect™. Direct Connect gives the benefit of exiting a higher number of lanes at low loss from the chip package, which can be very useful in both high performance computing and network switching applications, especi...
This is the first release of a few phases of a new login system for Samtec.com. This replaces a system that was built in 2011 and has been running well ever since. But, technology changes over time, and it was time for an upgrade. Here are some additional details about the featur...
Modern electronic devices are getting smaller with every new generation, and as a result, they are becoming more portable.  At the same time, the performance of these devices is growing as the demands of consumers become greater.  We expect to be able to connect to the internet w...