100-EL IN DEVELOPMENT - 50 Ohm 1.00 mm Jack, Edge Launch Compression Mount

Features

  • Edge launch, solderless compression

  • Board thickness, edge launch: .040" to .100"

  • Torque (board mount, edge launch): 0.5 ~ 0.8 in-lbs

  • Field replaceable, cost-effective assembly

  • Small form factor improves density

  • Threaded coupling with high mechanical stability

  • Performance to 110 GHz

  • Ideal for high-performance test applications

  • Air dielectric design for low VSWR and insertion loss

IN DEVELOPMENT - 50 Ohm 1.00 mm Jack, Edge Launch Compression Mount

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